LTC4304 - Hot Swappable 2-Wire Bus Buffer with Stuck Bus Recovery; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DFN |
| 包装说明 | HVSON, SOLCC10,.12,20 |
| 针数 | 10 |
| 制造商包装代码 | DD |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 接口集成电路类型 | INTERFACE CIRCUIT |
| JESD-30 代码 | S-PDSO-N10 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC10,.12,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 235 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大压摆率 | 8 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.7 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 3 mm |
| LTC4304IDD#TR | LTC4304CDD#TR | LTC4304CMS#TR | LTC4304IMS#TR | |
|---|---|---|---|---|
| 描述 | LTC4304 - Hot Swappable 2-Wire Bus Buffer with Stuck Bus Recovery; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C | LTC4304 - Hot Swappable 2-Wire Bus Buffer with Stuck Bus Recovery; Package: DFN; Pins: 10; Temperature Range: 0°C to 70°C | LTC4304 - Hot Swappable 2-Wire Bus Buffer with Stuck Bus Recovery; Package: MSOP; Pins: 10; Temperature Range: 0°C to 70°C | LTC4304 - Hot Swappable 2-Wire Bus Buffer with Stuck Bus Recovery; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | DFN | DFN | MSOP | MSOP |
| 包装说明 | HVSON, SOLCC10,.12,20 | HVSON, SOLCC10,.12,20 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 |
| 针数 | 10 | 10 | 10 | 10 |
| 制造商包装代码 | DD | DD | MS | MS |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 接口集成电路类型 | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| JESD-30 代码 | S-PDSO-N10 | S-PDSO-N10 | S-PDSO-G10 | S-PDSO-G10 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 10 | 10 | 10 | 10 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | HVSON | TSSOP | TSSOP |
| 封装等效代码 | SOLCC10,.12,20 | SOLCC10,.12,20 | TSSOP10,.19,20 | TSSOP10,.19,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 235 | 235 | 235 | 235 |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 0.8 mm | 1.1 mm | 1.1 mm |
| 最大压摆率 | 8 mA | 8 mA | 8 mA | 8 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm |
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