SCOPE:
CMOS, PARALLEL-LOADING, DUAL, MULTIPLYING 12-BIT D/A CONVERTER
Generic Number
MX7537U(x)/883B
MX7537T(x)/883B
MX7537S(x)/883B
MX7547U(x)/883B
MX7547T(x)/883B
MX7547S(x)/883B
Device Type
01
02
03
04
05
06
Case Outline(s).
The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter
MAXIM SMD
Q
L
E
3
Mil-Std-1835
GDIP1-T24 or CDIP2-T24
CQCC1-N28
Case Outline
Package Code
J24
L28
24 LEAD CERDIP
28 LEADLESS CHIP
Absolute Maximum Ratings:
V
DD
to DGND ........................................................................................………. -0.3V, + 17V
V
RFBA
, V
RFBB
to AGND .......................................................................................……….
±25V
V
REFA
, V
REFB
to AGND .......................................................................................……….
±25V
Digital Input Voltage to DGND .....................................................……… -0.3V, (V
DD
+0.3V)
IOUTA, IOUTB Voltage to DGND ...............................................…….... -0.3V, (V
DD
+0.3V)
AGND to DGND ............................................................................…….... -0.3V, (V
DD
+0.3V)
Lead Temperature (soldering, 10 seconds) ........................................................................ +300°C
Storage Temperature ........................................................................................... -65°C to +150°C
Continuous Power Dissipation ..........................................................................……... T
A
=+70°C
24 pin CERDIP(derate 12.5mW/°C above +70°C) ...............................................…….. 1000mW
28 pin LCC(derate 10.2mW/°C above +70°C) .......................................................…….. 816mW
Junction Temperature T
J
.....................................................................................…….... +150°C
Thermal Resistance, Junction to Case,
ΘJC
24 pin CERDIP................................................................................................…….... 40°C/W
28 pin LCC .....................................................................................................……..... 15°C/W
Thermal Resistance, Junction to Ambient,
ΘJA:
24 pin CERDIP................................................................................................…….... 80°C/W
28 pin LCC .....................................................................................................………. 98°C/W
Recommended Operating Conditions
Ambient Operating Range (T
A
) ............................................................……... -55°C to
+125°C
Logic Supply Voltage (V
LOGIC
) ................................................................……... +4.5V to +5.5V
Positive Supply Voltage (V
DD
)..............................................................……... +11.4V to +16.5V
Negative Supply Voltage (V
EE
)...............................................................……... -11.4V to -16.5V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
-----------------------
Electrical Characteristics of MX7537/47/883B for /883B
and SMD 5962-87763 and SMD 5962-89657
19-0057
Page 2 of
Rev. C
7
TABLE 1. ELECTRICAL TESTS:
CONDITIONS
-55
°C
<=T
A
<= +125°C 1/
Unless otherwise specified
TEST
ACCURACY
Resolution
Relative Accuracy
Differential Nonlinearity
Gain Error
Symbol
Group A
Subgroup
Device
type
Limits
Min
Limits
Max
Units
RES
RA
DNL
AE
V
DD
=+10.8V and V
DD
=+16.5V
V
DD
=10.8V (MX7547 only)
Guaranteed monotonic
Measured using R
FBA
, R
FBB
; DAC
registers loaded with all 1’s,
V
DD
=10.8V
1,2,3
1,2,3
1,2,3
1,2,3
All
1,2,4,5
3,6
All
1,4
2,5
3,6
All
12.0
±0.5
±1.0
±1.0
±2.0
±3.0
±6.0
±5.0
±10
±250
20
±1.0
±3.0
2.4
0.8
±1.0
±10
10
16.5
2.0
1.5
Bits
LSB
LSB
LSB
Gain Tempco
∆Gain/∆Temperature
NOTE 2
Output Leakage Current
IOUTA, IOUTB
VREFA, VREFB Input
Leakage
VREFA, VREFB Input
Resistance Match
Digital Input High
Voltage
Digital Input Low
Voltage
Digital Input Leakage
Current
Digital Input Capacitance
Supply Voltage
Supply Current
Current Settling Time
TCFS
4
ppm/°C
ILKG
RREF
∆RREF
V
IH
V
IL
I
IN
C
IN
V
DD
I
DD
t
SL
V
DD
=+16.5V, DAC registers
loaded with all 0s
V
DD
=+10.8V
V
DD
=+10.8V
V
DD
=+10.8V and V
DD
=+16.5V
V
DD
=+10.8V and V
DD
=+16.5V
V
IN
=+0V or 16.5V
1,3
2
1,2,3
1,2,3
1,2,3
1,2,3
1,3
2
4
1,2,3
1,2,3
All
All
nA
kΩ
%
V
V
µA
pF
V
mA
µs
µs
9
1,4
2,3,5,6
All
All
All
All
All
All
4,5,6
Operating range, V
DD
=16.5V
To 0.5 LSB, IOUT load =100Ω,
CEXT=13pF, DAC output
___
measured from falling edge of WR
To 0.5 LSB, IOUT load =100Ω,
CEXT=13pF, DAC output
___
measured from rising edge of WR
DAC
VREFA=20Vp-p
registers
10kHz sine wave,
loaded
VREFB=0V
with all 0s
VREFB=20Vp-p
10kHz sine wave,
VREFA=0V
DAC
VREFA=20Vp-p
registers
10kHz sine wave,
loaded
VREFB=0V
with all 0s
VREFB=20Vp-p
10kHz sine wave,
VREFA=0V
10.8
9,10,11
Current Settling Time
t
SL
4
1,2,3
1.5
VREFA
to IOUTA
Feedthrough
Error
VREFB
to IOUTB
NOTE 2
VREFA
to IOUTA
Feedthrough
Error
VREFB
to IOUTB
NOTE 2
FTE
FTE
4,5,6
(SMD)
4,5,6
-70
-65
(SMD)
dB
4
(SMD)
1,2,3
-70
-65
(SMD)
dB
-----------------------
Electrical Characteristics of MX7537/47/883B for /883B
and SMD 5962-87763 and SMD 5962-89657
19-0057
Page 3 of
Rev. C
7
TEST
Power-Supply
Rejection Ratio
Symbol
PSRR
CONDITIONS
-55
°C
<=T
A
<= +125°C 1/
Unless otherwise specified
V
DD
=10.8V,
∆V
DD
=12V±5%
V
DD
=10.8V,
∆V
DD
=V
DD
MAX -
V
DD
MIN
DAC A, DAC B loaded with 0s
DAC A, DAC B loaded with 1s
VREFA=20Vp-p, 10kHz sine
wave, VREFB=0V
VREFB=20Vp-p, 10kHz sine
wave, VREFA=0V
Group A
Subgroup
Device
type
01,02,03
Limits
Min
Limits
Max
±0.01
±0.02
Units
1
2,3
1
2,3
4
%/%
All
All
Output Capacitance
(IOUTA, IOUTB)
C
OUT
±0.01
±0.02
-70
140
dB
Channel-to-Channel
Isolation
TIMING
Address Valid to
Write-setup Time
Address Valid to
Write-hold Time
Data-setup Time
Data-hold Time
Chip Select or Update
to Write-setup Time
VREFA
to IOUTA
VREFB to
IOUTB
t
1
t
2
t
3
t
4
t
5
dB
4
All
-84
9
10,11
9
10,11
9
10,11
9,10,11
9,10,11
9
10,11
9,10,11
9
10,11
9
10,11
01,02,03
01,02,03
All
All
01,02,03
20
30
15
25
60
80
25
0
80
100
0
80
100
80
100
ns
ns
ns
ns
ns
04,05,06
All
All
All
Chip Select orUpdate
to Write Hold Time
Write Pulse Width
Clear Pulse Width
t
6
t
7
t
8
ns
ns
ns
NOTE 1: Conditions unless otherwise specified, 4.5V≤V
DD
≤5.5V.
VDD=10.8V to 16.5V, AGND=DGND=0V,
use maximum possible reference voltage.
NOTE 2: Typical number, for design aid only.
MODE SELECTION TABLE:
MX7537
___
CLR
1
1
0
1
1
1
1
1
1
___
UPD
1
1
X
1
1
1
1
0
___
CS
1
X
X
0
0
0
0
1
___
WR
X
1
X
0
0
0
0
0
0
A1
X
X
X
0
0
1
1
X
X
A0
X
X
X
0
1
0
1
X
X
Function
No data transfer
No data transfer
All registers cleared
DAC A LS input register loaded with D7-D0
DAC A MS input register loaded with D3-D0
DAC B LS input register loaded with D7-D0
DAC B MS input register loaded with D3-D0
DAC A, DAC B registers updated simultaneously from input
registers. Input registers not changed.
DAC A, DAC B registers are transparent. Input registers loaded.
0
0
X = Don’t care
-----------------------
Electrical Characteristics of MX7537/47/883B for /883B
and SMD 5962-87763 and SMD 5962-89657
19-0057
Page 4 of
Rev. C
7
MODE SELECTION TABLE:
MX7547
___
CSA
X
1
___
CSB
X
1
___
WR
1
X
Function
No data transfer
No data transfer
↑
↑
0
1
1
0
0
0
X= don’t care
___
___
0
A rising edge on CSA or CSB transfer data to the respective DAC.
DAC A register loaded from data bus.
↑
DAC B register loaded from data bus.
↑
DAC A and DAC B registers loaded from data bus.
↑
WR input is edge-triggered.
ORDERING INFORMATION:
Package
Pkg. Code
01
24 pin CERDIP
J24
02
24 pin CERDIP
J24
03
24 pin CERDIP
J24
01
28 pin LCC
L28
02
28 pin LCC
L28
03
28 pin LCC
L28
04
24 pin CERDIP
J24
05
24 pin CERDIP
J24
06
24 pin CERDIP
J24
04
28 pin LCC
L28
05
28 pin LCC
L28
06
28 pin LCC
L28
Device ID
MX7537UQ/883B
MX7537TQ/883B
MX7537SQ/883B
MX7537UE/883B
MX7537TE/883B
MX7537SE/883B
MX7547UQ/883B
MX7547TQ/883B
MX7547SQ/883B
MX7547UE/883B
MX7547TE/883B
MX7547SE/883B
SMD Number
5962-8776303LA
5962-8776302LA
5962-8776301LA
5962-87763033C
5962-87763023C
5962-87763013C
5962-8965703LA
5962-8965702LA
5962-8965701LA
5962-89657033C
5962-89657023C
5962-89657013C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
TERMINAL CONNECTIONS:
MX7537
MX7537
MX7547
J24
L28
J24
AGNDA
NC
AGNDA
I
OUTA
AGNDA
I
OUTA
RFBA
I
OUTA
RFBA
VREFA
__
CS
D0
D1
D2
D3
D4
D5
DGND
D6
D7
RFBA
VREFA
__
CS
D0
NC
D1
D2
D3
D4
D5
DGND
VREFA
___
CSA
(LSB)D0
D1
D2
D3
D4
D5
DGND
D6
D7
MX7547
L28
NC
AGNDA
I
OUTA
RFBA
VREFA
___
CSA
(LSB)D0
NC
D1
D2
D3
D4
D5
DGND
15
16
17
18
19
20
21
22
23
24
25
26
27
28
MX7537
J24
A0
A1
____
CLR
___
WR
___
UPD
V
DD
VREFB
RFBB
I
OUTB
AGNDB
MX7537
L28
NC
D6
D7
A0
A1
____
CLR
___
WR
NC
___
UPD
V
DD
VREFB
RFBB
I
OUTB
AGNDB
MX7547
J24
D8
D9
D10
D11
(MSB)
___
WR
____
CSB
V
DD
VREFB
RFBB
I
OUTB
MX7547
L28
NC
D6
D7
D8
D9
D10
D11
NC
___
WR
____
CSB
V
DD
VREFB
RFBB
I
OUTB
-----------------------
Electrical Characteristics of MX7537/47/883B for /883B
and SMD 5962-87763 and SMD 5962-89657
19-0057
Page 5 of
Rev. C
7
QUALITY ASSURANCE
Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in Mil-Std-883.
Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:
1. Test Condition, A, B, C, or D.
2. TA = +125°C minimum.
3. Interim and final electrical test requirements shall be specified in Table 2.
Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B, C, and D inspection.
Group A inspection:
1. Tests as specified in Table 2.
2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.
Group C and D inspections:
a. End-point electrical parameters shall be specified in Table 1.
b. Steady-state life test, Method 1005 of Mil-Std-883:
1. Test condition A, B, C, D.
2. TA = +125°C, minimum.
3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.
TABLE 2.
ELECTRICAL TEST REQUIREMENTS
Mil-Std-883 Test Requirements
Subgroups
per Method 5005, Table 1
1
1*, 2, 3, 9, 10, 11
1, 2, 3, 4**, 5**, 6**, 9, 10**, 11**
1
Interim Electric Parameters
Method 5004
Final Electrical Parameters
Method 5005
Group A Test Requirements
Method 5005
Group C and D End-Point Electrical Parameters
Method 5005
*
**
PDA applies to Subgroup 1 only.
If not tested shall be guaranteed to the limits specified in Table 1.
-----------------------
Electrical Characteristics of MX7537/47/883B for /883B
and SMD 5962-87763 and SMD 5962-89657
19-0057
Page 6 of
Rev. C
7
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