REVISION J
DO NOT
SCALE FROM
THIS PRINT
* = SEE NOTE 12
K
QTS-XXX-01-XXX-D-DP-EMX-XX
No OF PAIRS
-016, -032, -048,
**-064, **-080
(PER ROW)
**SEE NOTE 13
LEAD STYLE
-01: .1680[4.267]
OPTION
-TY: TRAY PACKAGING
EDGE MOUNT THICKNESS
-EM2: .064[1.63] .004 PCB
(USE QTS-25-01-D-EM2-XX
& T-1S42-01-XXX)
-EM3:
(USE QTS-25-01-D-EM3-XX
& T-1S42-02-XXX)
ASO ONLY (APPLICATION SPECIFIC ORDER)
((No OF POSITIONS / 16) x .7875 [20.003]) + .390 [9.91] REF
C3
(No OF POSITIONS / 16) x .7875[20.003]
.7875 20.003 REF
01
.1550 3.937 REF
02
PLATING SPECIFICATION
-F: FLASH SELECTIVE GOLD WITH
MATTE TIN TAILS
DIFFERENTIAL PAIRS
(USE T-1S42-XX-F & T-1G1-01-F)
(SEE NOTE 7)
ROW SPECIFICATION
-L: LIGHT SELECTIVE GOLD WITH
-D: DOUBLE
MATTE TIN TAILS
(USE QTS-25-XX-D-EMX-XX)
(USE T-1S42-XX-L & T-1G1-01-L)
-H: HEAVY GOLD
No OF BANKS
(USE T-1S42-XX-H & T-1G1-01-G)
-FTL: FLASH SELECTIVE GOLD, TIN/LEAD TAIL
(USE T-1S42-XX-FTL & T-1G1-01-FTL)
-STL: SELECTIVE GOLD, TIN/LEAD TAIL
(USE T-1S42-XX-STL & T-1G1-01-STL)
.2350 5.969
REF
SEE NOTE 12
.0325 0.826 REF
7 EQ SPACES
@ .0750[1.905]
.6440 16.358 REF
QTS-25-01-D-EMX-XX
.1600 4.064
REF
T-1G1-01-XXX
C5
"A"
.1680±.0030 4.267±0.08
(SEE NOTE 11)
SEE TABLE 2
T-1S42-XX-XXX
.1750 4.445
REF
.1400 3.556
REF
"A" REF
"C" REF
.0400 1.016
REF
"A"
.1288 3.270
.7450 18.923 REF
.0250 0.64
REF
.0080 0.203 REF
.075 1.91
REF
C1
.1520 3.861 REF
.2782 7.067
REF
"B" .0030[.076]
(INSIDE TO INSIDE OF PIN)
.118 3.00
C4
2° MAX SWAY
(TYP)
.0150 0.381 REF
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. BURR ALLOWANCE: .0015[.038] MAX.
3. MINIMUM PUSHOUT FORCE: 6 OZ.
4. MINIMUM GROUND PLANE RETENTION: 1 LB.
5. NOTE DELETED.
6. PARTS TO BE MOLDED TO POSITION.
7. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING (CONTACT).
8. NOTE DELETED.
9. NOTE DELETED.
10. SEE ww.samtec.com/processing/edgemt_tectalk/index.htm
FOR INFORMATION ON PROCESSING EDGE MOUNT PARTS TO BOARDS.
11. MAX VARIANCE OF .002[.05].
12. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY.
PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH
ORDER INQUIRIES
13. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE
CONTACT SAMTEC INTERCONNECT PROCESSING GROUP.
14. PARTS WITHOUT -TY OPTION SHALL BE PACKAGED IN TRAYS.
C2
SECTION "A"-"A"
PACKAGING VIEW
[PARTS TO HAVE POSITION #1 LOADED
UNLESS OTHERWISE SPECIFIED,
IN SAME DIRECTION AS ARROW]
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
EDGE MOUNT -EM2 & -EM3
.XX: .01[.3]
2
.XXX: .005[.13]
.XXXX: .0020[.051]
MATERIAL:
DECIMALS
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail: info@SAMTEC.com
code: 55322
DESCRIPTION:
DO NOT SCALE DRAWING
SHEET SCALE: 1.5:1
INSULATOR: LCP, COLOR: BLACK
TERMINAL: PHOS BRONZE
GROUND PLANE: PHOS BRONZE
.635mm HS DIFF PAIR EDGE MOUNT TERMINAL ASSEMBLY
DWG. NO.
L
TUBE: PT-1-24-01-95
PLUG: TP-03
QTS-XXX-01-XXX-D-DP-EMX-XX
05/28/01
SHEET
1
OF
1
F:\DWG\MISC\MKTG\QTS-XXX-01-XXX-D-DP-EMX-XX-MKT.SLDDRW
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KEVIN B
DSP 与 ARM 处理器
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