Synchronous DRAM, 2MX8, 6ns, CMOS, PDSO44,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Integrated Circuit Solution Inc |
| 包装说明 | TSOP, TSOP44,.46,32 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 6 ns |
| 最大时钟频率 (fCLK) | 143 MHz |
| I/O 类型 | COMMON |
| 交错的突发长度 | 1,2,4,8 |
| JESD-30 代码 | R-PDSO-G44 |
| JESD-609代码 | e0 |
| 内存密度 | 16777216 bit |
| 内存集成电路类型 | SYNCHRONOUS DRAM |
| 内存宽度 | 8 |
| 端子数量 | 44 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2MX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP |
| 封装等效代码 | TSOP44,.46,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 4096 |
| 连续突发长度 | 1,2,4,8,FP |
| 最大待机电流 | 0.002 A |
| 最大压摆率 | 0.14 mA |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| IC42S8200-7T | IC42S8200-6T | IC42S8200-8TI | IC42S8200-7TI | IC42S8200-6TI | IC42S8200-8T | |
|---|---|---|---|---|---|---|
| 描述 | Synchronous DRAM, 2MX8, 6ns, CMOS, PDSO44, | Synchronous DRAM, 2MX8, 5.5ns, CMOS, PDSO44, | Synchronous DRAM, 2MX8, 6ns, CMOS, PDSO44, | Synchronous DRAM, 2MX8, 6ns, CMOS, PDSO44, | Synchronous DRAM, 2MX8, 5.5ns, CMOS, PDSO44, | Synchronous DRAM, 2MX8, 6ns, CMOS, PDSO44, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Integrated Circuit Solution Inc | Integrated Circuit Solution Inc | Integrated Circuit Solution Inc | Integrated Circuit Solution Inc | Integrated Circuit Solution Inc | Integrated Circuit Solution Inc |
| 包装说明 | TSOP, TSOP44,.46,32 | TSOP, TSOP44,.46,32 | TSOP, TSOP44,.46,32 | TSOP, TSOP44,.46,32 | TSOP, TSOP44,.46,32 | TSOP, TSOP44,.46,32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 6 ns | 5.5 ns | 6 ns | 6 ns | 5.5 ns | 6 ns |
| 最大时钟频率 (fCLK) | 143 MHz | 166 MHz | 125 MHz | 143 MHz | 166 MHz | 125 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| 交错的突发长度 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 |
| JESD-30 代码 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 44 | 44 | 44 | 44 | 44 | 44 |
| 字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP | TSOP | TSOP | TSOP | TSOP | TSOP |
| 封装等效代码 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 |
| 连续突发长度 | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP |
| 最大待机电流 | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
| 最大压摆率 | 0.14 mA | 0.145 mA | 0.135 mA | 0.14 mA | 0.145 mA | 0.135 mA |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
电源技术
DSP 与 ARM 处理器
工控电子
测试/测量
Microchip MCU
FPGA/CPLD
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