MB9B560R Series
32-bit ARM
®
Cortex
®
-M4F based Microcontroller
MB9BF566M/N/R, MB9BF567M/N/R,
MB9BF568M/N/R, MB9BF568F
Data Sheet (Full Production)
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.
Publication Number MB9B560R_DS709-00001
Revision 2.0
Issue Date February 2, 2015
D a t a S h e e t
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion
data sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this
proposed product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has
been completed, and that initial production has begun. Due to the phases of the manufacturing
process that require maintaining efficiency and quality, this document may be revised by subsequent
versions or modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However,
typographical or specification corrections, or modifications to the valid combinations offered may
occur.”
Questions regarding these document designations may be directed to your local sales office.
2
MB9B560R_DS709-00001-2v0-E, February 2, 2015
MB9B560R Series
32-bit ARM
®
Cortex
®
-M4F based Microcontroller
MB9BF566M/N/R, MB9BF567M/N/R,
MB9BF568M/N/R, MB9BF568F
Data Sheet (Full Production)
1.
Description
Devices in the MB9B560R Series are highly integrated 32-bit microcontrollers with high performance and
competitive cost.
This series is based on the ARM Cortex-M4F Processor with on-chip Flash memory and SRAM. The series
has peripheral functions such as Motor Control Timers, ADCs and Communication Interfaces (USB, CAN,
2
UART, CSIO, I C, LIN).
Note:
−
ARM and Cortex are the registered trademarks of ARM Limited in the EU and other countries.
Publication Number MB9B560R_DS709-00001
Revision 2.0
Issue Date February 2, 2015
This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient
production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the
valid combinations offered may occur.
D a t a S h e e t
Table of Contents
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
Description ..................................................................................................................................... 3
Features ......................................................................................................................................... 5
Product Lineup ............................................................................................................................. 13
Packages ...................................................................................................................................... 15
Pin Assignment............................................................................................................................. 16
Pin Description ............................................................................................................................. 22
I/O Circuit Type............................................................................................................................. 51
Handling Precautions ................................................................................................................... 58
Handling Devices.......................................................................................................................... 62
Block Diagram .............................................................................................................................. 65
Memory Size ................................................................................................................................ 66
Memory Map ................................................................................................................................ 66
Pin Status In Each CPU State ...................................................................................................... 69
Electrical Characteristics .............................................................................................................. 77
Ordering Information................................................................................................................... 170
Package Dimensions .................................................................................................................. 171
Major Changes ........................................................................................................................... 178
4
MB9B560R_DS709-00001-2v0-E, February 2, 2015
微控制器 MCU
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