EE PLD, 15ns, PAL-Type, CMOS, PDSO24,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code | unknown |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 58.8 MHz |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e0 |
| 输入次数 | 22 |
| 输出次数 | 10 |
| 产品条款数 | 132 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 5 V |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 15 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| PL22V10-12D | PL22V10-15/BLA | PL22V10-10D | PL22V10-15D | PL22V10I15D | |
|---|---|---|---|---|---|
| 描述 | EE PLD, 15ns, PAL-Type, CMOS, PDSO24, | EE PLD, 15ns, PAL-Type, CMOS, CDIP24 | EE PLD, 10ns, PAL-Type, CMOS, PDSO24, | EE PLD, 15ns, PAL-Type, CMOS, PDSO24, | EE PLD, 15ns, PAL-Type, CMOS, PDSO24, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| 最大时钟频率 | 58.8 MHz | 50 MHz | 66.6 MHz | 50 MHz | 50 MHz |
| JESD-30 代码 | R-PDSO-G24 | R-XDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 输入次数 | 22 | 22 | 22 | 22 | 22 |
| 输出次数 | 10 | 10 | 10 | 10 | 10 |
| 产品条款数 | 132 | 132 | 132 | 132 | 132 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C | 85 °C |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | SOP | SOP | SOP |
| 封装等效代码 | SOP24,.4 | DIP24,.3 | SOP24,.4 | SOP24,.4 | SOP24,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 15 ns | 15 ns | 10 ns | 15 ns | 15 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
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