82S191A/BLA概述

IC 2K X 8 OTPROM, 55 ns, CDIP24, 0.300 INCH, CERAMIC, DIP-24, Programmable ROM

82S191A/BLA规格参数

参数名称	属性值
厂商名称	NXP(恩智浦)
零件包装代码	DIP
包装说明	DIP,
针数	24
Reach Compliance Code	unknown
ECCN代码	EAR99
最长访问时间	55 ns
JESD-30 代码	R-GDIP-T24
内存密度	16384 bit
内存集成电路类型	OTP ROM
内存宽度	8
功能数量	1
端子数量	24
字数	2048 words
字数代码	2000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	2KX8
输出特性	3-STATE
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
并行/串行	PARALLEL
认证状态	Not Qualified
座面最大高度	5.08 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	BIPOLAR
温度等级	MILITARY
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
宽度	7.62 mm

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82S191A/BLA相似产品对比

	82S191A/BLA	82S191A/BKA	82S191A/B3A	82S191A/BJA	82S191/B3A	82S191/BJA	82S191/BLA	82S191/BKA
描述	IC 2K X 8 OTPROM, 55 ns, CDIP24, 0.300 INCH, CERAMIC, DIP-24, Programmable ROM	IC 2K X 8 OTPROM, 55 ns, CDFP24, CERAMIC, FP-24, Programmable ROM	IC 2K X 8 OTPROM, 55 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM	IC 2K X 8 OTPROM, 55 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM	IC 2K X 8 OTPROM, 100 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM	IC 2K X 8 OTPROM, 100 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM	IC 2K X 8 OTPROM, 100 ns, CDIP24, 0.300 INCH, CERAMIC, DIP-24, Programmable ROM	IC 2K X 8 OTPROM, 100 ns, CDFP24, CERAMIC, FP-24, Programmable ROM
零件包装代码	DIP	DFP	QLCC	DIP	QLCC	DIP	DIP	DFP
包装说明	DIP,	DFP,	QCCN,	DIP,	QCCN,	DIP,	DIP,	DFP,
针数	24	24	28	24	28	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	55 ns	55 ns	55 ns	55 ns	100 ns	100 ns	100 ns	100 ns
JESD-30 代码	R-GDIP-T24	R-CDFP-F24	S-CQCC-N28	R-GDIP-T24	S-CQCC-N28	R-GDIP-T24	R-GDIP-T24	R-CDFP-F24
内存密度	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
内存集成电路类型	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
内存宽度	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1
端子数量	24	24	28	24	28	24	24	24
字数	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
字数代码	2000	2000	2000	2000	2000	2000	2000	2000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
组织	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
封装代码	DIP	DFP	QCCN	DIP	QCCN	DIP	DIP	DFP
封装形状	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	FLATPACK	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	FLATPACK
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	5.08 mm	2.286 mm	1.905 mm	5.715 mm	1.905 mm	5.715 mm	5.08 mm	2.286 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	YES	YES	NO	YES	NO	NO	YES
技术	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	THROUGH-HOLE	FLAT	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	FLAT
端子节距	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm
端子位置	DUAL	DUAL	QUAD	DUAL	QUAD	DUAL	DUAL	DUAL
宽度	7.62 mm	9.144 mm	11.43 mm	15.24 mm	11.43 mm	15.24 mm	7.62 mm	9.144 mm
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	-	-	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)

82S191A/BLA

82S191A/BLA概述

82S191A/BLA规格参数

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82S191A/BLA相似产品对比

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