It is recommended that the temperature of the component does not exceed +125 °C under worst
case conditions
Ambient Temperature (refering to
I
R
)
Operating Temperature
Storage Conditions (in original
packaging)
Moisture Sensitivity Level (MSL)
-40 up to +85 °C
-40 up to +125 °C
< 40 °C ; < 75 % RH
1
11,5 max.
2
4
3
Scale 2:1
Test conditions of Electrical Properties: +20 °C, 33 % RH if not specified differently
Product Marking:
Start of Winding
Marking
•
033 (Inductance Code)
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
PaDi
DESCRIPTION
ArPa
DIN ISO 2768-1m
WE-MCRI SMT Molded Coupled
Inductor
SIZE
REVISION
STATUS
ORDER CODE
7448991033
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
1040
001.000
Valid
2018-10-01
eiSos
1/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Typical Inductance vs. Current Characteristics:
4.0
Typical Temperature Rise vs. Current Characteristics:
100.0
90.0
3.5
80.0
3.0
70.0
2.5
Temperature Rise [K]
60.0
50.0
40.0
30.0
Inductance [µH]
2.0
1.5
1.0
20.0
10.0
0.0
0.5
0.0
0.0
1.9
3.8
5.7
7.6
9.5 11.4 13.3
Current [A]
15.2
17.1
19.0
20.9
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
Current [A]
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
PaDi
DESCRIPTION
ArPa
DIN ISO 2768-1m
WE-MCRI SMT Molded Coupled
Inductor
SIZE
REVISION
STATUS
ORDER CODE
7448991033
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
1040
001.000
Valid
2018-10-01
eiSos
2/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Packaging Specification - Tape and Reel: [mm]
P2
K0
E1
T
W3
W1
close to center
B
D
A
D0
P0
F
C
B0
E2
W
Top Cover
Tape
W2
A
D1
A0
P1
T2
T1
detail B
Carrier Tape
Cover Tape
N
A
End
Feeding direction
Start
B
Cover Tape
Chip Cavity
Sprocket Hole
No Components
min.160mm
Components
No Components
min.100mm
Cover Tape
min. 400mm
Embossment
packaging is reffered to the international standard IEC 60286-3:2013
Tape Type
2a
A0
(mm)
typ.
11,40
B0
(mm)
typ.
10,25
W
(mm)
+0,3/ -0,1
24,00
T
(mm)
ref.
0,40
T1
(mm)
max.
0,10
T2
(mm)
typ.
4,30
K0
(mm)
typ.
4,10
P0
(mm)
±0,1
4,00
P1
(mm)
±0,1
16,00
P2
(mm)
±0,1
2,00
D0
(mm)
+0,1/ -0,0
1,50
D1
(mm)
min.
1,50
E1
(mm)
±0,1
1,75
E2
(mm)
min.
22,25
F
(mm)
±0,1
11,50
Material
Polystyrene
Qty.
(pcs.)
800
Tolerance
Tape width
24mm
A
± 2,0
330,00
B
min.
1,50
C
min.
12,80
D
min.
20,20
N
± 2,0
60,00
W1
+ 2,0
24,40
W2
max.
30,40
W3
min.
23,90
W3
max.
27,40
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
PaDi
DESCRIPTION
ArPa
DIN ISO 2768-1m
165° - 180°
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
WE-MCRI SMT Molded Coupled
Inductor
SIZE
REVISION
STATUS
ORDER CODE
7448991033
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
Pull-of force
Tape width
24 mm
0,1 N - 1,3 N
1040
001.000
Valid
2018-10-01
eiSos
3/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Classification Reflow Profile for SMT components:
Classification Reflow Soldering Profile:
Profile Feature
Preheat Temperature Min
Preheat Temperature Max
Value
T
s min
150 °C
T
s max
200 °C
t
s
T
L
t
L
T
p
t
p
60 - 120 seconds
3 °C/ second max.
217 °C
60 - 150 seconds
see table below
20 - 30 seconds
6 °C/ second max.
8 minutes max.
T
p
Max. Ramp Up Rate
Max. Ramp Down Rate
T
L
T
s max
t
L
t
p
T
C
–5°C
Preheat Time t
s
from T
s min
to T
s max
Ramp-up Rate (T
L
to T
P
)
Liquidous Temperature
Time t
L
maintained above T
L
Peak package body temperature
Time within 5°C of actual peak temperaure
Ramp-down Rate (T
L
to T
P
)
Time 25°C to peak temperature
refer to IPC/ JEDEC J-STD-020E
Temperature
Preheat Area
T
s min
t
S
Package Classification Reflow Temperature:
Properties
Volume mm³
<350
260 °C
250 °C
Volume mm³
350-2000
260 °C
250 °C
245 °C
Volume mm³
>2000
260 °C
245 °C
245 °C
25
Time 25°C to Peak
PB-Free Assembly | Package Thickness < 1.6 mm
PB-Free Assembly | Package Thickness ≥ 2.5 mm
refer to IPC/ JEDEC J-STD-020E
PB-Free Assembly | Package Thickness 1.6 mm - 2.5 mm
260 °C
Time
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
PaDi
DESCRIPTION
ArPa
DIN ISO 2768-1m
WE-MCRI SMT Molded Coupled
Inductor
SIZE
REVISION
STATUS
ORDER CODE
7448991033
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
1040
001.000
Valid
2018-10-01
eiSos
4/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Cautions and Warnings:
The following conditions apply to all goods within the product series of WE-MCRI of
Würth Elektronik eiSos GmbH & Co. KG:
General:
• This electronic component was designed and manufactured for use in general electronic equipment.
• Würth Elektronik must be asked for written approval (following the PPAP procedure) before incorporating the components into any
equipment in fields such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control,
ship control), transportation signal, disaster prevention, medical, public information network etc. where higher safety and reliability are
especially required and/or if there is the possibility of direct damage or human injury.
• Electronic components that will be used in safety-critical or high-reliability applications, should be pre-evaluated by the customer.
• The component was designed and manufactured to be used within the datasheet specified values. If the usage and operation conditions
specified in the datasheet are not met, the wire insulation may be damaged or dissolved.
• Do not drop or impact the components, as the core may flake apart.
• Würth Elektronik products are qualified according to international standards, which are listed in each product reliability report. Würth
Elektronik does not guarantee any customer qualified product characteristics beyond Würth Elektroniks’ specifications, for its validity and
sustainability over time.
• The customer is responsible for the functionality of their own products. All technical specifications for standard products also apply to
customer specific products
Potting:
• If the product is potted in the costumer application, the potting material may shrink or expand during and after hardening. Shrinking
could lead to an incomplete seal, allowing contaminants into the core. Expansion could damage the core or wire contacts. We
recommend a manual inspection after potting to avoid these effects.
Storage Conditions:
• A storage of Würth Electronik products for longer than 12 months is not recommended. Within other effects, the terminals may suffer
degradation, resulting in bad solderability. Therefore, all products shall be used within the period of 12 months based on the day of
shipment.
• Do not expose the components to direct sunlight.
• The storage conditions in the original packaging are defined according to DIN EN 61760-2.
Handling:
• Violation of the technical product specifications such as exceeding the nominal rated current will void the warranty.
• Applying currents with audio-frequency signals may result in audible noise due to the magnetostrictive material properties.
These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable.
However, no responsibility is assumed for inaccuracies or incompleteness.
Product specific:
Soldering:
• The solder profile must comply with the Würth Elektronik technical soldering specification. All other profiles will void the warranty.
• All other soldering methods are at the customers’ own risk.
• Strong forces which may affect the coplanarity of the components’ electrical connection with the PCB (i.e. pins), can damage the part,
resulting in avoid of the warranty.
Cleaning and Washing:
• Washing agents used during the production to clean the customer application may damage or change the characteristics of the wire
insulation, marking or plating. Washing agents may have a negative effect on the long-term functionality of the product.
• Using a brush during the cleaning process could break the wire due to its small diameter. Therefore, we do not recommend using a
brush during the PCB cleaning process.
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
PaDi
DESCRIPTION
ArPa
DIN ISO 2768-1m
WE-MCRI SMT Molded Coupled
Inductor
SIZE
REVISION
STATUS
ORDER CODE
7448991033
DATE (YYYY-MM-DD)
BUSINESS UNIT
PAGE
1040
001.000
Valid
2018-10-01
eiSos
5/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
许多MEMS器件，像加速度计、机械共振器件等，都需要在真空环境下才能实现设计功能。然而检验封装腔体是否达到了所要求的真空程度一直一来都是个棘手的问题。密歇根大学Khalil Najafi教授研究小组的研究人员最近开发出一种用微机械制造方法实现，可以在封装的封帽上完成皮拉尼真空测量的方案。使用这种方法可以完成封装的氦气检漏测试，该成果已发表在IEEE Transactions on Advan...[详细]
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