Operational Amplifier, 1 Func, 240uV Offset-Max, BIPolar, CDIP8
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Calogic |
零件包装代码 | DIP |
包装说明 | DIP, DIP8,.3 |
针数 | 8 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK |
25C 时的最大偏置电流 (IIB) | 0.002 µA |
频率补偿 | YES |
最大输入失调电压 | 240 µV |
JESD-30 代码 | R-XDIP-T8 |
JESD-609代码 | e0 |
低-失调 | YES |
标称负供电电压 (Vsup) | -15 V |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP8,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | +-15 V |
认证状态 | Not Qualified |
最小摆率 | 0.1 V/us |
供电电压上限 | 22 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | NO |
技术 | BIPOLAR |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
最小电压增益 | 150000 |
OP05AZ | OP05CP | OP05CZ | OP05EZ | OP05J | |
---|---|---|---|---|---|
描述 | Operational Amplifier, 1 Func, 240uV Offset-Max, BIPolar, CDIP8 | Operational Amplifier, 1 Func, 1600uV Offset-Max, BIPolar, PDIP8 | Operational Amplifier, 1 Func, 1600uV Offset-Max, BIPolar, CDIP8 | Operational Amplifier, 1 Func, 600uV Offset-Max, BIPolar, CDIP8 | Operational Amplifier, 1 Func, 700uV Offset-Max, BIPolar, MBCY8 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Calogic | Calogic | Calogic | Calogic | Calogic |
零件包装代码 | DIP | DIP | DIP | DIP | BCY |
包装说明 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | , CAN8,.2 |
针数 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
25C 时的最大偏置电流 (IIB) | 0.002 µA | 0.007 µA | 0.007 µA | 0.004 µA | 0.003 µA |
频率补偿 | YES | YES | YES | YES | YES |
最大输入失调电压 | 240 µV | 1600 µV | 1600 µV | 600 µV | 700 µV |
JESD-30 代码 | R-XDIP-T8 | R-PDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | O-MBCY-W8 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
低-失调 | YES | NO | NO | YES | YES |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | METAL |
封装等效代码 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | CAN8,.2 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CYLINDRICAL |
电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最小摆率 | 0.1 V/us | 0.1 V/us | 0.1 V/us | 0.1 V/us | 0.1 V/us |
供电电压上限 | 22 V | 22 V | 22 V | 22 V | 22 V |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | WIRE |
端子位置 | DUAL | DUAL | DUAL | DUAL | BOTTOM |
最小电压增益 | 150000 | 100000 | 100000 | 150000 | 150000 |
封装代码 | DIP | DIP | DIP | DIP | - |
表面贴装 | NO | NO | NO | NO | - |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved