8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP16, PLASTIC, DIP-16
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 16 |
Reach Compliance Code | unknown |
最大模拟输入电压 | 4.096 V |
最小模拟输入电压 | |
最长转换时间 | 55 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDIP-T16 |
JESD-609代码 | e0 |
长度 | 19.175 mm |
最大线性误差 (EL) | 0.1953% |
湿度敏感等级 | 1 |
模拟输入通道数量 | 8 |
位数 | 8 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出位码 | BINARY |
输出格式 | SERIAL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 240 |
采样速率 | 0.05 MHz |
采样并保持/跟踪并保持 | TRACK |
座面最大高度 | 4.572 mm |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 7.62 mm |
MAX1113EPE | MAX1112CPP+ | MAX1112CPP | MAX1112EAP | MAX1112EPP+ | MAX1112EPP | MAX1113EEE | MAX1113CEE | |
---|---|---|---|---|---|---|---|---|
描述 | 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP16, PLASTIC, DIP-16 | 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP20, PLASTIC, DIP-20 | 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP20, PLASTIC, DIP-20 | 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO20, 5.30 MM, 0.65 MM PITCH, PLASTIC, SSOP-20 | 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP20, PLASTIC, DIP-20 | 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP20, PLASTIC, DIP-20 | 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16, 0.150 INCH, 0.635 MM PITCH, QSOP-16 | 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16, 0.150 INCH, 0.635 MM PITCH, QSOP-16 |
是否无铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 不含铅 |
是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | DIP | DIP | DIP | SSOP | DIP | DIP | SOIC | SOIC |
包装说明 | DIP, | PLASTIC, DIP-20 | PLASTIC, DIP-20 | 5.30 MM, 0.65 MM PITCH, PLASTIC, SSOP-20 | PLASTIC, DIP-20 | DIP, | 0.150 INCH, 0.635 MM PITCH, QSOP-16 | 0.150 INCH, 0.635 MM PITCH, QSOP-16 |
针数 | 16 | 20 | 20 | 20 | 20 | 20 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最大模拟输入电压 | 4.096 V | 4.096 V | 4.096 V | 4.096 V | 4.096 V | 4.096 V | 4.096 V | 4.096 V |
最长转换时间 | 55 µs | 55 µs | 55 µs | 55 µs | 55 µs | 55 µs | 55 µs | 55 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDIP-T16 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e0 | e3 | e0 | e0 | e3 | e0 | e0 | e0 |
长度 | 19.175 mm | 26.16 mm | 26.16 mm | 7.2 mm | 26.16 mm | 26.16 mm | 4.9 mm | 4.9 mm |
最大线性误差 (EL) | 0.1953% | 0.1953% | 0.1953% | 0.1953% | 0.1953% | 0.1953% | 0.1953% | 0.1953% |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
模拟输入通道数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 20 | 20 | 20 | 20 | 20 | 16 | 16 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C |
最低工作温度 | - | - | - | -40 °C | -55 °C | -55 °C | -40 °C | -40 °C |
输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | SSOP | DIP | DIP | SSOP | SSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | IN-LINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 240 | 260 | 240 | 245 | 260 | 240 | 240 | 240 |
采样速率 | 0.05 MHz | 0.05 MHz | 0.05 MHz | 0.05 MHz | 0.05 MHz | 0.05 MHz | 0.05 MHz | 0.05 MHz |
采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK |
座面最大高度 | 4.572 mm | 4.572 mm | 4.572 mm | 1.99 mm | 4.572 mm | 4.572 mm | 1.75 mm | 1.75 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | YES | NO | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | MATTE TIN | TIN LEAD | TIN LEAD | MATTE TIN | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 0.65 mm | 2.54 mm | 2.54 mm | 0.635 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 20 | NOT SPECIFIED | 20 | NOT SPECIFIED | NOT SPECIFIED | 20 | 20 | 20 |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 5.29 mm | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm |
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