Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> BK80528JK170GR

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BK80528JK170GR: 产品描述Microprocessor, 32-Bit, 1700MHz, CMOS, PGA-423; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共98页; 制造商Intel(英特尔); 官网地址http://www.intel.com/

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BK80528JK170GR概述

Microprocessor, 32-Bit, 1700MHz, CMOS, PGA-423

BK80528JK170GR规格参数

参数名称	属性值
厂商名称	Intel(英特尔)
零件包装代码	PGA
包装说明	IPGA,
针数	423
Reach Compliance Code	unknown
ECCN代码	3A001.A.3
地址总线宽度	36
位大小	32
边界扫描	YES
最大时钟频率	100 MHz
外部数据总线宽度	64
格式	FLOATING POINT
集成缓存	YES
JESD-30 代码	S-XPGA-P423
长度	53.34 mm
低功率模式	YES
端子数量	423
封装主体材料	UNSPECIFIED
封装代码	IPGA
封装形状	SQUARE
封装形式	GRID ARRAY, INTERSTITIAL PITCH
认证状态	Not Qualified
座面最大高度	5.5118 mm
速度	1700 MHz
最大供电电压	1.75 V
最小供电电压	1.58 V
表面贴装	NO
技术	CMOS
端子形式	PIN/PEG
端子节距	2.54 mm
端子位置	PERPENDICULAR
宽度	53.34 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR

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Intel

Pentium

4 Processor 660,

650, 640, and 630

∆

and

Intel Pentium 4 Processor

Extreme Edition

Datasheet

– On 90 nm Process in the 775-land LGA Package and supporting

Intel

Extended Memory 64 Technology

February 2005

Document Number: 306382-001

Contents

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING

APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel

Pentium

4 processor 660, 650, 640, and 630, and Intel

Pentium

4 processor Extreme Edition on 90 nm process in the 775-land

package may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current

characterized errata are available on request.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across

different processor families. See

http://www.intel.com/products/processor_number

for details.

processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across

different processor families. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and

increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number

progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.

Hyper-Threading Technology requires a computer system with an Intel® Pentium® 4 processor supporting Hyper-Threading Technology and an HT

Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See

http:/

/www.intel.com/info/hyperthreading/

for more information including details on which processors support HT Technology.

∆

Intel

Extended Memory 64 Technology (Intel

EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device

drivers and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS.

Performance will vary depending on your hardware and software configurations. See http://www.intel.com/info/em64t for more information including

details on which processors support EM64T or consult with your system vendor for more information.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Pentium, Itanium, Intel Xeon, Intel NetBurst, Intel SpeedStep, and the Intel logo are trademarks or registered trademarks of Intel Corporation or

its subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Datasheet

Contents

Introduction..................................................................................................................................

1.1

1.2

2.1

2.2

2.3

Terminology ........................................................................................................................ 12

1.1.1 Processor Packaging Terminology ........................................................................ 13

References ......................................................................................................................... 14

FSB and GTLREF............................................................................................................... 15

Power and Ground Lands................................................................................................... 15

Decoupling Guidelines........................................................................................................ 15

2.3.1 VCC Decoupling .................................................................................................... 16

2.3.2 FSB GTL+ Decoupling........................................................................................... 16

2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 16

Voltage Identification .......................................................................................................... 17

2.4.1 Phase Lock Loop (PLL) Power and Filter .............................................................. 19

Reserved, Unused, FC, and TESTHI Signals..................................................................... 20

FSB Signal Groups ............................................................................................................. 20

GTL+ Asynchronous Signals ..............................................................................................22

Test Access Port (TAP) Connection ................................................................................... 22

FSB Frequency Select Signals (BSEL[2:0]) ....................................................................... 23

Absolute Maximum and Minimum Ratings ......................................................................... 23

Processor DC Specifications ..............................................................................................24

VCC Overshoot Specification ............................................................................................. 33

2.12.1 Die Voltage Validation ........................................................................................... 33

GTL+ FSB Specifications....................................................................................................34

Package Mechanical Drawing ............................................................................................ 35

Processor Component Keep-Out Zones............................................................................. 39

Package Loading Specifications......................................................................................... 39

Package Handling Guidelines............................................................................................. 39

Package Insertion Specifications........................................................................................ 40

Processor Mass Specification............................................................................................. 40

Processor Materials ............................................................................................................ 40

Processor Markings ............................................................................................................ 40

Processor Land Coordinates ..............................................................................................41

Processor Land Assignments ............................................................................................. 43

Alphabetical Signals Reference .......................................................................................... 66

Processor Thermal Specifications ...................................................................................... 75

5.1.1 Thermal Specifications .......................................................................................... 75

5.1.2 Thermal Metrology ................................................................................................. 79

Processor Thermal Features ..............................................................................................79

5.2.1 Thermal Monitor..................................................................................................... 79

5.2.2 Thermal Monitor 2.................................................................................................. 80

Electrical Specifications

............................................................................................................. 15

2.4

2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

2.13

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.1

4.2

5.1

Package Mechanical Specifications

.......................................................................................... 35

Land Listing and Signal Descriptions

....................................................................................... 43

Thermal Specifications and Design Considerations................................................................

5.2

Datasheet

Contents

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

6.1

6.2

On-Demand Mode ................................................................................................. 82

PROCHOT# Signal................................................................................................ 82

THERMTRIP# Signal............................................................................................. 83

control

and Fan Speed Reduction ......................................................................... 83

Thermal Diode ....................................................................................................... 83

Features........................................................................................................................................

Power-On Configuration Options........................................................................................ 85

Clock Control and Low Power States ................................................................................. 86

6.2.1 Normal State.......................................................................................................... 86

6.2.2 HALT and Enhanced HALT Powerdown States .................................................... 87

6.2.3 Stop-Grant State.................................................................................................... 88

6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State ...................... 88

6.2.5 HALT Snoop State, Grant Snoop State ................................................................. 89

6.2.6 Enhanced Intel SpeedStep

Technology .............................................................. 89

Mechanical Specifications .................................................................................................. 92

7.1.1 Boxed Processor Cooling Solution Dimensions .................................................... 92

7.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 93

7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly....... 93

Electrical Requirements...................................................................................................... 93

7.2.1 Fan Heatsink Power Supply .................................................................................. 93

Thermal Specifications ....................................................................................................... 95

7.3.1 Boxed Processor Cooling Requirements............................................................... 95

7.3.2 Variable Speed Fan ............................................................................................... 97

Boxed Processor Specifications................................................................................................

7.1

7.2

7.3

Datasheet

Contents

Figures

2-1

2-2

2-3

2-4

3-1

3-2

3-3

3-4

3-5

3-6

3-7

4-1

4-2

5-1

5-2

5-3

5-4

6-1

7-1

7-2

7-3

7-4

7-5

7-6

7-7

7-8

7-9

Phase Lock Loop (PLL) Filter Requirements.............................................................................. 19

VCC Static and Transient Tolerance for 775_VR_CONFIG_04A............................................... 28

VCC Static and Transient Tolerance for 775_VR_CONFIG_04B............................................... 30

VCC Overshoot Example Waveform .......................................................................................... 33

Processor Package Assembly Sketch ........................................................................................ 35

Processor Package Drawing 1 ................................................................................................... 36

Processor Package Drawing 2 ................................................................................................... 37

Processor Package Drawing 3 ................................................................................................... 38

Processor Top-Side Marking Example for Intel

Pentium

4 Processor Extreme Edition ......... 40

Processor Top-Side Marking Example for Intel

Pentium

4 Processor 660, 650, 640,

and 630....................................................................................................................................... 41

Processor Land Coordinates (Top View).................................................................................... 42

land-out Diagram (Top View – Left Side).................................................................................... 44

land-out Diagram (Top View – Right Side) ................................................................................. 45

Thermal Profile for Processors with PRB = 1 ............................................................................. 77

Thermal Profile for Processors with PRB = 0 ............................................................................. 78

Case Temperature (TC) Measurement Location ........................................................................ 79

Thermal Monitor 2 Frequency and Voltage Ordering .................................................................81

Processor Low Power State Machine......................................................................................... 86

Mechanical Representation of the Boxed Processor.................................................................. 91

Space Requirements for the Boxed Processor (Side View–applies to all four side views) ........ 92

Space Requirements for the Boxed Processor (Top View) ........................................................ 92

Overall View Space Requirements for the Boxed Processor ..................................................... 93

Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 94

Baseboard Power Header Placement Relative to Processor Socket ......................................... 95

Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View) ........................... 96

Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side View) .......................... 96

Boxed Processor Fan Heatsink Set Points................................................................................. 97

Datasheet

BK80528JK170GR相似产品对比

	BK80528JK170GR	BK80528JK140GR	RK80531PC041G0K	BK80528JK150GR	RK80532PC041512	RK80532PC060512	RK80532PE056512	RK80532PE067512	RK80532PC056512	RK80532PE061512
描述	Microprocessor, 32-Bit, 1700MHz, CMOS, PGA-423	Microprocessor, 32-Bit, 1400MHz, CMOS, PGA-423	Microprocessor, 32-Bit, 2000MHz, CMOS, CPGA478, FLIP-CHIP, PGA2-478	Microprocessor, 32-Bit, 1500MHz, CMOS, PGA-423	Microprocessor, 32-Bit, 2000MHz, CMOS, CPGA478, 1.27 MM PITCH, HEAT SPREADER, FCPGA-478	Microprocessor, 32-Bit, 2500MHz, CMOS, CPGA478, FLIP-CHIP, PGA2-478	Microprocessor, 32-Bit, 2400MHz, CMOS, CPGA478, FCPGA-478	Microprocessor, 32-Bit, 2660MHz, CMOS, CPGA478, FLIP-CHIP, PGA2-478	Microprocessor, 32-Bit, 2400MHz, CMOS, CPGA478, FLIP-CHIP, PGA2-478	Microprocessor, 32-Bit, 2530MHz, CMOS, CPGA478, FLIP-CHIP, PGA2-478
厂商名称	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)
零件包装代码	PGA	PGA	PGA	PGA	PGA	PGA	PGA	PGA	PGA	PGA
包装说明	IPGA,	IPGA,	SPGA, PGA478,26X26,50	IPGA,	SPGA, PGA478,26X26,50	SPGA, PGA478,26X26,50	SPGA, PGA478,26X26,50	SPGA, PGA478,26X26,50	SPGA, PGA478,26X26,50	SPGA, PGA478,26X26,50
针数	423	423	478	423	478	478	478	478	478	478
Reach Compliance Code	unknown	unknown	unknown	unknown	compliant	unknown	unknown	unknown	unknown	unknow
ECCN代码	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
地址总线宽度	36	36	36	36	36	36	36	36	36	36
位大小	32	32	32	32	32	32	32	32	32	32
边界扫描	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
最大时钟频率	100 MHz	100 MHz	200 MHz	100 MHz	133 MHz	200 MHz	133 MHz	200 MHz	200 MHz	200 MHz
外部数据总线宽度	64	64	64	64	64	64	64	64	64	64
格式	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
集成缓存	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-XPGA-P423	S-XPGA-P423	S-CPGA-P478	S-XPGA-P423	S-CPGA-P478	S-CPGA-P478	S-CPGA-P478	S-CPGA-P478	S-CPGA-P478	S-CPGA-P478
长度	53.34 mm	53.34 mm	35 mm	53.34 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm
低功率模式	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
端子数量	423	423	478	423	478	478	478	478	478	478
封装主体材料	UNSPECIFIED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	IPGA	IPGA	SPGA	IPGA	SPGA	SPGA	SPGA	SPGA	SPGA	SPGA
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, INTERSTITIAL PITCH	GRID ARRAY, INTERSTITIAL PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, INTERSTITIAL PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
速度	1700 MHz	1400 MHz	2000 MHz	1500 MHz	2000 MHz	2500 MHz	2400 MHz	2660 MHz	2400 MHz	2530 MHz
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
端子节距	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
宽度	53.34 mm	53.34 mm	35 mm	53.34 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
最大供电电压	1.75 V	1.7 V	1.415 V	1.7 V	-	1.4 V	1.405 V	1.395 V	1.405 V	1.4 V
最小供电电压	1.58 V	1.56 V	1.34 V	1.555 V	-	1.325 V	1.33 V	1.32 V	1.33 V	1.325 V
是否Rohs认证	-	-	符合	-	符合	符合	符合	符合	符合	符合
封装等效代码	-	-	PGA478,26X26,50	-	PGA478,26X26,50	PGA478,26X26,50	PGA478,26X26,50	PGA478,26X26,50	PGA478,26X26,50	PGA478,26X26,50
电源	-	-	1.5 V	-	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
标称供电电压	-	-	1.5 V	-	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V

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