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IDT72V3670L6PFG

产品描述FIFO, 8KX36, 4ns, Synchronous, CMOS, PQFP128, GREEN, PLASTIC, TQFP-128
产品类别存储    存储   
文件大小366KB,共46页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 全文预览

IDT72V3670L6PFG概述

FIFO, 8KX36, 4ns, Synchronous, CMOS, PQFP128, GREEN, PLASTIC, TQFP-128

IDT72V3670L6PFG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明LFQFP, QFP128,.63X.87,20
针数128
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间4 ns
其他特性RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
最大时钟频率 (fCLK)166 MHz
周期时间6 ns
JESD-30 代码R-PQFP-G128
JESD-609代码e3
长度20 mm
内存密度294912 bit
内存集成电路类型OTHER FIFO
内存宽度36
湿度敏感等级3
功能数量1
端子数量128
字数8192 words
字数代码8000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织8KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装等效代码QFP128,.63X.87,20
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源3.3 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.015 A
最大压摆率0.04 mA
最大供电电压 (Vsup)3.45 V
最小供电电压 (Vsup)3.15 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn) - annealed
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度14 mm

文档预览

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3.3V HIGH-DENSITY SUPERSYNC™ II 36-BIT FIFO
1,024 x 36, 2,048 x 36
4,096 x 36, 8,192 x 36
16,384 x 36, 32,768 x 36
IDT72V3640, IDT72V3650
IDT72V3660, IDT72V3670
IDT72V3680, IDT72V3690
Zero latency retransmit
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Program programmable flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
JTAG port, provided for Boundary Scan function (PBGA Only)
Independent Read and Write Clocks (permit reading and writing
simultaneously)
Available in a 128-pin Thin Quad Flat Pack (TQFP) or a 144-pin Plastic
Ball Grid Array (PBGA) (with additional features)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts available, see ordering information
FEATURES:
Choose among the following memory organizations:
Commercial
IDT72V3640
1,024 x 36
IDT72V3650
2,048 x 36
IDT72V3660
4,096 x 36
IDT72V3670
8,192 x 36
IDT72V3680
16,384 x 36
IDT72V3690
32,768 x 36
Up to 166 MHz Operation of the Clocks
User selectable Asynchronous read and/or write ports (PBGA Only)
User selectable input and output port bus-sizing
- x36 in to x36 out
- x36 in to x18 out
- x36 in to x9 out
- x18 in to x36 out
- x9 in to x36 out
Pin to Pin compatible to the higher density of IDT72V36100 and
IDT72V36110
Big-Endian/Little-Endian user selectable byte representation
5V input tolerant
Fixed, low first word latency
FUNCTIONAL BLOCK DIAGRAM
*Available on the PBGA package only.
D
0
-D
n
(x36, x18 or x9)
WEN
WCLK/WR
*
INPUT REGISTER
LD SEN
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
*
ASYW
WRITE CONTROL
LOGIC
RAM ARRAY
1,024 x 36, 2,048 x 36
4,096 x 36, 8,192 x 36
16,384 x 36, 32,768 x 36
FLAG
LOGIC
WRITE POINTER
READ POINTER
BE
IP
BM
IW
OW
MRS
PRS
TCK
*
TRST
*
TMS
**
TDI
*
TDO
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
RM
ASYR
*
RCLK/RD
JTAG CONTROL
(BOUNDARY SCAN)
*
OE
Q
0
-Q
n
(x36, x18 or x9)
REN
*
4667 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The SuperSync II FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©
2008 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
OCTOBER 22, 2008
DSC-4667/16
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