Datasheet> 器件分类 > 分立半导体> 二极管> PRS07D,135

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PRS07D,135: 产品描述0.6A, 200V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2; 产品类别分立半导体二极管; 文件大小52KB，共9页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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PRS07D,135概述

0.6A, 200V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2

PRS07D,135规格参数

参数名称	属性值
厂商名称	NXP(恩智浦)
包装说明	O-LELF-R2
针数	2
Reach Compliance Code	unknown
ECCN代码	EAR99
外壳连接	ISOLATED
配置	SINGLE
二极管元件材料	SILICON
二极管类型	RECTIFIER DIODE
JESD-30 代码	O-LELF-R2
JESD-609代码	e3
元件数量	1
端子数量	2
最高工作温度	150 °C
最低工作温度	-65 °C
最大输出电流	0.6 A
封装主体材料	GLASS
封装形状	ROUND
封装形式	LONG FORM
认证状态	Not Qualified
最大重复峰值反向电压	200 V
最大反向恢复时间	0.25 µs
表面贴装	YES
端子面层	TIN
端子形式	WRAP AROUND
端子位置	END

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PRS07 series

Fast soft-recovery rectiﬁers

Rev. 02 — 26 July 2004

Product data sheet

1. Product proﬁle

1.1 General description

Fast soft-recovery rectiﬁer diodes in a cavity free cylindrical glass surface mounted

package using Implotec™ technology.

1.2 Features

Low leakage current

Hermetically sealed package

Glass passivated

Small package.

1.3 Applications

Switched-mode power supplies

Snubber diode.

1.4 Quick reference data

≤

600 V (PRS07J)

≤

400 V (PRS07G)

≤

200 V (PRS07D)

≤

1.2 V

F(AV)

≤

1.7 A

≤

250 ns.

2. Pinning information

Table 1:

Discrete pinning

Description

anode (a)

001aaa020

Simpliﬁed outline

Symbol

cathode (k)

SOD87

PRS07D,135相似产品对比

	PRS07D,135	PRS07G	PRS07J	PRS07D	PRS07J,115	PRS07G,135	PRS07J,135	PRS07D,115	PRS07G,115
描述	0.6A, 200V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2	0.6A, 400V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2	DIODE 0.6 A, 600 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Signal Diode	0.6A, 200V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2	DIODE 0.6 A, 600 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Signal Diode	0.6A, 400V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2	DIODE 0.6 A, 600 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Signal Diode	0.6A, 200V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2	0.6A, 400V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS PACKAGE-2
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
包装说明	O-LELF-R2	HERMETIC SEALED, GLASS PACKAGE-2	HERMETIC SEALED, GLASS PACKAGE-2	HERMETIC SEALED, GLASS PACKAGE-2	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2
针数	2	2	2	2	2	2	2	2	2
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
外壳连接	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED	ISOLATED
配置	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
二极管元件材料	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON
二极管类型	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE
JESD-30 代码	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2	O-LELF-R2
JESD-609代码	e3	e3	e3	e3	e3	e3	e3	e3	e3
元件数量	1	1	1	1	1	1	1	1	1
端子数量	2	2	2	2	2	2	2	2	2
最高工作温度	150 °C	150 °C	150 °C	150 °C	150 °C	150 °C	150 °C	150 °C	150 °C
最大输出电流	0.6 A	0.6 A	0.6 A	0.6 A	0.6 A	0.6 A	0.6 A	0.6 A	0.6 A
封装主体材料	GLASS	GLASS	GLASS	GLASS	GLASS	GLASS	GLASS	GLASS	GLASS
封装形状	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND
封装形式	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM	LONG FORM
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大重复峰值反向电压	200 V	400 V	600 V	200 V	600 V	400 V	600 V	200 V	400 V
最大反向恢复时间	0.25 µs	0.25 µs	0.25 µs	0.25 µs	0.25 µs	0.25 µs	0.25 µs	0.25 µs	0.25 µs
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
端子面层	TIN	TIN	TIN	TIN	TIN	TIN	TIN	TIN	TIN
端子形式	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND	WRAP AROUND
端子位置	END	END	END	END	END	END	END	END	END
最低工作温度	-65 °C	-	-	-	-65 °C	-65 °C	-65 °C	-65 °C	-65 °C

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