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7025L55JI: 产品描述Application Specific SRAM, 8KX16, 55ns, CMOS, PQCC84, 1.150 X 1.150 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-84; 产品类别存储存储; 文件大小183KB，共22页; 制造商IDT (Integrated Device Technology)

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7025L55JI概述

Application Specific SRAM, 8KX16, 55ns, CMOS, PQCC84, 1.150 X 1.150 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-84

7025L55JI规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
包装说明	1.150 X 1.150 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-84
Reach Compliance Code	not_compliant
ECCN代码	EAR99
最长访问时间	55 ns
I/O 类型	COMMON
JESD-30 代码	S-PQCC-J84
JESD-609代码	e0
内存密度	131072 bit
内存集成电路类型	APPLICATION SPECIFIC SRAM
内存宽度	16
湿度敏感等级	1
功能数量	1
端口数量	2
端子数量	84
字数	8192 words
字数代码	8000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	8KX16
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	QCCJ
封装等效代码	LDCC84,1.2SQ
封装形状	SQUARE
封装形式	CHIP CARRIER
并行/串行	PARALLEL
峰值回流温度（摄氏度）	225
电源	5 V
认证状态	Not Qualified
最大待机电流	0.004 A
最小待机电流	2 V
最大压摆率	0.25 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn85Pb15)
端子形式	J BEND
端子节距	1.27 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	30

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HIGH-SPEED

8K x 16 DUAL-PORT

STATIC RAM

◆

IDT7025S/L

Features

◆

True Dual-Ported memory cells which allow simultaneous

reads of the same memory location

High-speed access

– Military: 20/25/35/55/70ns (max.)

– Industrial: 55ns (max.)

– Commercial: 15/17/20/25/35/55ns (max.)

Low-power operation

– IDT7025S

Active: 750mW (typ.)

Standby: 5mW (typ.)

– IDT7025L

Active: 750mW (typ.)

Standby: 1mW (typ.)

Separate upper-byte and lower-byte control for multiplexed

bus compatibility

◆

IDT7025 easily expands data bus width to 32 bits or more

using the Master/Slave select when cascading more than

one device

M/S = H for

BUSY

output flag on Master

M/S = L for

BUSY

input on Slave

Interrupt Flag

On-chip port arbitration logic

Full on-chip hardware support of semaphore signaling

between ports

Fully asynchronous operation from either port

Battery backup operation—2V data retention

TTL-compatible, single 5V (±10%) power supply

Available in 84-pin PGA, Flatpack, PLCC, and 100-pin Thin

Quad Flatpack

Industrial temperature range (–40°C to +85°C) is available

for selected speeds

Green parts available, see ordering information

Functional Block Diagram

R/W

I/O

-I/O

15L

I/O

-I/O

BUSY

12L

(1,2)

I/O

-I/O

15R

I/O

Control

I/O

Control

I/O

-I/O

BUSY

12R

(1,2)

Address

Decoder

MEMORY

ARRAY

Address

Decoder

R/W

SEM

(2)

INT

NOTES:

1. (MASTER):

BUSY

is output; (SLAVE):

BUSY

is input.

BUSY

outputs and

INT

outputs are non-tri-stated push-pull.

ARBITRATION

INTERRUPT

SEMAPHORE

LOGIC

R/W

SEM

INT

(2)

2683 drw 01

M/S

JULY 2012

DSC 2683/11

7025L55JI相似产品对比

	7025L55JI	7025S20PFI	7025L17PFI	7025L25PFI	7025S55PFI	7025L55PFI
描述	Application Specific SRAM, 8KX16, 55ns, CMOS, PQCC84, 1.150 X 1.150 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-84	Dual-Port SRAM, 8KX16, 20ns, CMOS, PQFP100, TQFP-100	Dual-Port SRAM, 8KX16, 17ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	Multi-Port SRAM, 8KX16, 20ns, CMOS, PQFP100	Dual-Port SRAM, 8KX16, 55ns, CMOS, PQFP100, TQFP-100	Application Specific SRAM, 8KX16, 55ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Reach Compliance Code	not_compliant	not_compliant	unknown	not_compliant	not_compliant	not_compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	55 ns	20 ns	17 ns	20 ns	55 ns	55 ns
JESD-30 代码	S-PQCC-J84	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100
内存密度	131072 bit	131072 bit	131072 bit	131072 bit	131072 bit	131072 bit
内存集成电路类型	APPLICATION SPECIFIC SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	MULTI-PORT SRAM	DUAL-PORT SRAM	APPLICATION SPECIFIC SRAM
内存宽度	16	16	16	16	16	16
端子数量	84	100	100	100	100	100
字数	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
字数代码	8000	8000	8000	8000	8000	8000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	8KX16	8KX16	8KX16	8KX16	8KX16	8KX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	QCCJ	LFQFP	LFQFP	QFP	LFQFP	QFP
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	CHIP CARRIER	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	J BEND	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
是否无铅	含铅	含铅	-	-	含铅	含铅
是否Rohs认证	不符合	不符合	-	不符合	不符合	不符合
包装说明	1.150 X 1.150 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-84	TQFP-100	LFQFP,	-	TQFP-100	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
I/O 类型	COMMON	COMMON	-	COMMON	COMMON	COMMON
JESD-609代码	e0	e0	-	e0	e0	e0
湿度敏感等级	1	3	-	3	3	3
功能数量	1	1	1	-	1	1
端口数量	2	2	-	2	2	2
输出特性	3-STATE	3-STATE	-	3-STATE	3-STATE	3-STATE
封装等效代码	LDCC84,1.2SQ	QFP100,.63SQ,20	-	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20
峰值回流温度（摄氏度）	225	240	-	-	240	240
电源	5 V	5 V	-	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
最大待机电流	0.004 A	0.03 A	-	0.004 A	0.03 A	0.004 A
最小待机电流	2 V	4.5 V	-	2 V	4.5 V	2 V
最大压摆率	0.25 mA	0.37 mA	-	0.37 mA	0.3 mA	0.25 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	-	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	-	4.5 V	4.5 V
端子面层	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	-	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)
处于峰值回流温度下的最长时间	30	20	-	-	20	20
Base Number Matches	-	1	1	1	1	-

7025L55JI

7025L55JI概述

7025L55JI规格参数

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7025L55JI相似产品对比

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