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89HPES4T4G2ZCAL

产品描述FCBGA-324, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小862KB,共31页
制造商IDT (Integrated Device Technology)
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89HPES4T4G2ZCAL概述

FCBGA-324, Tray

89HPES4T4G2ZCAL规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码FCBGA
包装说明BGA, BGA324,18X18,40
针数324
制造商包装代码AL324
Reach Compliance Codenot_compliant
ECCN代码EAR99
地址总线宽度
总线兼容性PCI
最大时钟频率100 MHz
外部数据总线宽度
JESD-30 代码S-PBGA-B324
JESD-609代码e0
长度19 mm
湿度敏感等级4
端子数量324
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA324,18X18,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)225
电源1,3.3 V
认证状态Not Qualified
座面最大高度3.42 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度19 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI

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4-Lane 4-Port
Gen2 PCI Express® Switch
®
89HPES4T4G2
Data Sheet
The 89HPES4T4G2, a 4-lane 4-port Gen2 PCI Express® switch, is a
member of IDT’s PRECISE™ family of PCI Express switching solutions.
The PES4T4G2 is a peripheral chip that performs PCI Express base
switching with a feature set optimized for servers, storage, communica-
tions, and consumer applications. It provides connectivity and switching
functions between a PCI Express upstream port and three downstream
ports or peer-to-peer switching between downstream ports.
Device Overview
Features
High Performance PCI Express Switch
– Four Gen2 PCI Express lanes supporting 5 Gbps and
2.5 Gbps operations
– Four switch ports
• One x1 upstream port
• Three x1 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2Kbytes
– Supports one virtual channel and eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates four 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
• Receive equalization (RxEQ)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
– Supports Hot-Swap
Block Diagram
4-Port Switch Core / 4 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 1)
(Port 2)
(Port 3)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 30
May 23, 2013
DSC 6928

89HPES4T4G2ZCAL相似产品对比

89HPES4T4G2ZCAL 89HPES4T4G2ZCALGI 89HPES4T4G2ZCALG 89HPES4T4G2ZCALGI8 89HPES4T4G2ZCALI 89HPES4T4G2ZBALGI 89HPES4T4G2ZBALG8 89HPES4T4G2ZBAL
描述 FCBGA-324, Tray FCBGA-324, Tray FCBGA-324, Tray FCBGA-324, Reel FCBGA-324, Tray FCBGA-324, Tray FCBGA-324, Reel FCBGA-324, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 含铅 不含铅 不含铅 不含铅 含铅 不含铅 不含铅 含铅
是否Rohs认证 不符合 符合 符合 符合 不符合 符合 符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA
包装说明 BGA, BGA324,18X18,40 FCBGA-324 BGA, BGA324,18X18,40 BGA, BGA324,18X18,40 BGA, BGA324,18X18,40 BGA, BGA, BGA324,18X18,40 BGA, BGA324,18X18,40
针数 324 324 324 324 324 324 324 324
制造商包装代码 AL324 ALG324 ALG324 ALG324 AL324 ALG324 ALG324 AL324
Reach Compliance Code not_compliant compliant compliant compliant not_compliant compliant compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
总线兼容性 PCI PCI PCI SMBUS PCI SMBUS PCI; SMBUS PCI
JESD-30 代码 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e0 e1 e1 e1 e0 e1 e1 e0
长度 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm
湿度敏感等级 4 4 4 4 4 4 4 4
端子数量 324 324 324 324 324 324 324 324
最高工作温度 70 °C 85 °C 70 °C 85 °C 85 °C 85 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA BGA BGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 225 260 260 260 225 260 260 225
座面最大高度 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm
最大供电电压 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
标称供电电压 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER TIN LEAD
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED 30
宽度 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
最大时钟频率 100 MHz 100 MHz 100 MHz - 100 MHz - 100 MHz 100 MHz
封装等效代码 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 - BGA324,18X18,40 BGA324,18X18,40
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V - 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified

 
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