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89H16T4BG2ZABXG

产品描述PCI Bus Controller, PBGA288, 23 X 23 MM, 1 MM PITCH, GREEN, BGA-288
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小761KB,共32页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览

89H16T4BG2ZABXG概述

PCI Bus Controller, PBGA288, 23 X 23 MM, 1 MM PITCH, GREEN, BGA-288

89H16T4BG2ZABXG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明23 X 23 MM, 1 MM PITCH, GREEN, BGA-288
针数288
Reach Compliance Codecompliant
ECCN代码3A001.A.3
其他特性IT ALSO NEED 3.3V I/O NOMINAL SUPPLY
地址总线宽度
最大时钟频率125 MHz
驱动器接口标准IEEE 1149.1AC; IEEE 1149.1
外部数据总线宽度
JESD-30 代码S-PBGA-B288
JESD-609代码e1
长度23 mm
湿度敏感等级3
端子数量288
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装等效代码BGA288,22X22,40
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度)260
电源1,2.5,3.3 V
认证状态Not Qualified
座面最大高度1.7 mm
最大压摆率968 mA
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度23 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI

文档预览

下载PDF文档
16-Lane 4-Port
Gen2 PCI Express® Switch
®
89HPES16T4BG2
Data Sheet
Advance Information*
Device Overview
The 89HPES16T4BG2 is a member of IDT’s PRECISE™ family of
PCI Express® switching solutions. The PES16T4BG2 is a 16-lane, 4-
port Gen2 peripheral chip that performs PCI Express Base switching
with a feature set optimized for high performance applications such as
servers, storage, and communications/networking. It provides connec-
tivity and switching functions between a PCI Express upstream port and
up to three downstream ports and supports switching between down-
stream ports.
Features
Block Diagram
4-Port Switch Core / 16 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 4)
(Port 6)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 32
©
2009 Integrated Device Technology, Inc
*Notice: The information in this document is subject to change without notice
July 1, 2009
Advance Information
High Performance PCI Express Switch
– Sixteen 5 Gbps Gen2 PCI Express lanes
– Four switch ports
• One x4 upstream port
• Three x4 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
On-Die Temperature Sensor
– Range of 0 to 127.5 degrees Celsius
– Three programmable temperature thresholds with over and
under temperature threshold alarms
– Automatic recording of maximum high or minimum low
temperature
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates sixteen 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
• Receive equalization (RxEQ)

89H16T4BG2ZABXG相似产品对比

89H16T4BG2ZABXG 89H16T4BG2ZABXG8 89H16T4BG2ZABX 89H16T4BG2ZABX8
描述 PCI Bus Controller, PBGA288, 23 X 23 MM, 1 MM PITCH, GREEN, BGA-288 Bus Controller, PBGA288 PCI Bus Controller, PBGA288, 23 X 23 MM, 1 MM PITCH, BGA-288 Bus Controller, PBGA288
是否Rohs认证 符合 符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Reach Compliance Code compliant compliant not_compliant not_compliant
JESD-30 代码 S-PBGA-B288 S-PBGA-B288 S-PBGA-B288 S-PBGA-B288
JESD-609代码 e1 e1 e0 e0
湿度敏感等级 3 3 3 3
端子数量 288 288 288 288
最高工作温度 70 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA BGA LBGA BGA
封装等效代码 BGA288,22X22,40 BGA288,22X22,40 BGA288,22X22,40 BGA288,22X22,40
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY GRID ARRAY, LOW PROFILE GRID ARRAY
电源 1,2.5,3.3 V 1,2.5,3.3 V 1,2.5,3.3 V 1,2.5,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
最大压摆率 968 mA 968 mA 968 mA 968 mA
表面贴装 YES YES YES YES
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
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