IC 4 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP48, CERAMIC, DIP-48, Serial IO/Communication Controller
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 48 |
| Reach Compliance Code | unknow |
| 地址总线宽度 | 6 |
| 边界扫描 | NO |
| 最大时钟频率 | 8 MHz |
| 通信协议 | ASYNC, BIT |
| 数据编码/解码方法 | NRZ |
| 最大数据传输速率 | 0.125 MBps |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-GDIP-T48 |
| 低功率模式 | YES |
| DMA 通道数量 | |
| I/O 线路数量 | 16 |
| 串行 I/O 数 | 4 |
| 端子数量 | 48 |
| 片上数据RAM宽度 | |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| RAM（字数） | 0 |
| 座面最大高度 | 5.715 mm |
| 最大压摆率 | 50 mA |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 |
| 26C94/VXA | 26C94-VXA | 68C94-VXA | 68C94/VXA | |
|---|---|---|---|---|
| 描述 | IC 4 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP48, CERAMIC, DIP-48, Serial IO/Communication Controller | IC 4 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP48, CERAMIC, DIP-48, Serial IO/Communication Controller | IC 4 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP48, CERAMIC, DIP-48, Serial IO/Communication Controller | IC 4 CHANNEL(S), 1M bps, SERIAL COMM CONTROLLER, CDIP48, CERAMIC, DIP-48, Serial IO/Communication Controller |
| 零件包装代码 | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, | DIP, | DIP, | DIP, |
| 针数 | 48 | 48 | 48 | 48 |
| Reach Compliance Code | unknow | unknow | unknown | unknown |
| 地址总线宽度 | 6 | 6 | 6 | 6 |
| 边界扫描 | NO | NO | NO | NO |
| 最大时钟频率 | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 通信协议 | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT |
| 数据编码/解码方法 | NRZ | NRZ | NRZ | NRZ |
| 最大数据传输速率 | 0.125 MBps | 0.125 MBps | 0.125 MBps | 0.125 MBps |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-GDIP-T48 | R-GDIP-T48 | R-GDIP-T48 | R-GDIP-T48 |
| 低功率模式 | YES | YES | YES | YES |
| I/O 线路数量 | 16 | 16 | 16 | 16 |
| 串行 I/O 数 | 4 | 4 | 4 | 4 |
| 端子数量 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.715 mm | 5.715 mm | 5.715 mm | 5.715 mm |
| 最大压摆率 | 50 mA | 50 mA | 50 mA | 50 mA |
| 最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 | 1 | 1 | 1 |
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