AHC SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, TVSOP-20
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP20,.25,16 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | WITH DUAL OUTPUT ENABLE |
| 系列 | AHC |
| JESD-30 代码 | R-PDSO-G20 |
| 长度 | 5 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP20,.25,16 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 12 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.4 mm |
| 端子位置 | DUAL |
| 宽度 | 4.4 mm |
| SN74AHC541DGV | SN54AHC541W | SN54AHC541FK | SN54AHC541J | |
|---|---|---|---|---|
| 描述 | AHC SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, TVSOP-20 | AHC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | AHC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, CC-20 | AHC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | DFP | QFN | DIP |
| 包装说明 | TSSOP, TSSOP20,.25,16 | DFP, | QCCN, | DIP, |
| 针数 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 其他特性 | WITH DUAL OUTPUT ENABLE | - | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE |
| 系列 | AHC | - | AHC | AHC |
| JESD-30 代码 | R-PDSO-G20 | - | S-CQCC-N20 | R-GDIP-T20 |
| 长度 | 5 mm | - | 8.89 mm | 24.195 mm |
| 逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | - | 8 | 8 |
| 功能数量 | 1 | - | 1 | 1 |
| 端口数量 | 2 | - | 2 | 2 |
| 端子数量 | 20 | - | 20 | 20 |
| 最高工作温度 | 85 °C | - | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | - | -55 °C | -55 °C |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE |
| 输出极性 | TRUE | - | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | TSSOP | - | QCCN | DIP |
| 封装形状 | RECTANGULAR | - | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | CHIP CARRIER | IN-LINE |
| 传播延迟（tpd） | 12 ns | - | 12 ns | 12 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | - | 2.03 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | - | 2 V | 2 V |
| 标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V |
| 表面贴装 | YES | - | YES | NO |
| 技术 | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | MILITARY | MILITARY |
| 端子形式 | GULL WING | - | NO LEAD | THROUGH-HOLE |
| 端子节距 | 0.4 mm | - | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | - | QUAD | DUAL |
| 宽度 | 4.4 mm | - | 8.89 mm | 7.62 mm |
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