C
HIP
C
OMPONENTS
B
ERYLLIUM
O
XIDE
D
UO
W
RAP
S
URFACE
M
OUNT
A
TTENUATORS
Duo Wrap Surface Mount Chip Attenuators are designed
for installation directly on printed circuit boards. Edge
metallization on two sides forms solder fillets for stronger
attachment, easier inspection and increased heat removal
area.
GENERAL SPECIFICATIONS
•
•
•
•
Impedance . . . . . . . . . . . . . . 50 Ohms
Operating Temperature . . . . -55˚C to 150˚C
Attenuation Stability . . . . . . 0.0001 dB/dB/˚C
Attenuation Tolerance . . . . . 1 - 10 dB ± 0.5 dB
11 - 20 dB ± 1.0 dB
Other attenuation values available upon request.
MATERIAL SPECIFICATIONS
• Solderable
Ground Plane . . . . . . . TIN/LEAD over Nickel
• Substrate . . . . . . . . . . . . Beryllium Oxide Ceramic
• Resistive Elements . . . . Proprietary Nichrome Thin Film
• Environment . . . . . . . . . Meets applicable portions of
MIL-E-5400 and MIL-R-55342
NOTES
w
l
Power ratings are average power and based on
maximum film temperature of 150˚C and heat sink
temperature of 100˚C maximum.
ORDERING INFORMATION
Example . . . . . . . . . . . . . . . . . . . . . . . 83- 3XXX - XX.XX
Chip Attenuator
TIN/LEAD over Nickel
Attenuation Value
POWER
WATTS
5
PART
NUMBER
83 - 3995
W
0.200
L
0.175
H
0.040
w
0.071
l
0.049
FREQUENCY
DC - 3.0 GHz
MAX.
VSWR
1.50:1
Tel:
800- 544- 5594
Fax:
561- 283- 5286
11
email:
rflabs@rflabs.com
Website:
http://www.rflabs.com
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