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27LV256-30I/SO

产品描述32K X 8 OTPROM, 300 ns, PDSO28, 0.300 INCH, PLASTIC, SOIC-28
产品类别存储    存储   
文件大小127KB,共10页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
下载文档 详细参数 全文预览

27LV256-30I/SO概述

32K X 8 OTPROM, 300 ns, PDSO28, 0.300 INCH, PLASTIC, SOIC-28

27LV256-30I/SO规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码SOIC
包装说明0.300 INCH, PLASTIC, SOIC-28
针数28
Reach Compliance Code_compli
ECCN代码EAR99
最长访问时间300 ns
其他特性DATA RETENTION >200 YEARS
I/O 类型COMMON
JESD-30 代码R-PDSO-G28
JESD-609代码e0
长度17.87 mm
内存密度262144 bi
内存集成电路类型OTP ROM
内存宽度8
功能数量1
端子数量28
字数32768 words
字数代码32000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织32KX8
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装等效代码SOP28,.4
封装形状RECTANGULAR
封装形式SMALL OUTLINE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源3.3/5 V
编程电压13 V
认证状态Not Qualified
座面最大高度2.64 mm
最大待机电流0.0001 A
最大压摆率0.025 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.49 mm
Base Number Matches1

文档预览

下载PDF文档
Obsolete Device
27LV256
256K (32K x 8) Low-Voltage CMOS EPROM
FEATURES
• Wide voltage range 3.0V to 5.5V
• High speed performance
- 200 ns access time available at 3.0V
• CMOS Technology for low power consumption
- 8 mA Active current at 3.0V
- 20 mA Active current at 5.5V
- 100
µA
Standby current
• Factory programming available
• Auto-insertion-compatible plastic packages
• Auto ID aids automated programming
• Separate chip enable and output enable controls
• High speed “Express” programming algorithm
• Organized 32K x 8: JEDEC standard pinouts
- 28-pin Dual-in-line package
- 32-pin PLCC package
- 28-pin SOIC package
- Tape and reel
• Data Retention > 200 years
• Available for the following temperature ranges:
- Commercial:
0°C to +70°C
- Industrial:
-40°C to +85°C
PACKAGE TYPES
PDIP
V
PP
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
V
SS
•1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
A14
A13
A8
A9
A11
OE
A10
CE
O7
O6
O5
O4
O3
27LV256
32
31
30
4
3
2
1
A7
A12
V
PP
NU
Vcc
A14
A13
PLCC
A6
A5
A4
A3
A2
A1
A0
NC
O0
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
A8
A9
A11
NC
OE
A10
CE
O7
O6
27LV256
14
15
16
17
18
19
SOIC
V
PP
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
V
SS
O1
O2
V
SS
NU
O3
O4
O5
1
2
3
4
5
6
7
8
9
10
11
12
13
14
DESCRIPTION
The Microchip Technology Inc. 27LV256 is a low volt-
age (3.0 volt) CMOS EPROM designed for battery
powered applications. The device is organized as a
32K x 8 (32K-Byte) non-volatile memory product. The
27LV256 consumes only 8 mA maximum of active cur-
rent during a 3.0 volt read operation therefore improv-
ing battery performance. This device is designed for
very low voltage applications where conventional 5.0
volt only EPROMS can not be used. Accessing individ-
ual bytes from an address transition or from power-up
(chip enable pin going low) is accomplished in less than
200 ns at 3.0V. This device allows systems designers
the ability to use low voltage non-volatile memory with
today’s' low voltage microprocessors and peripherals in
battery powered applications.
A complete family of packages is offered to provide the
most flexibility in applications. For surface mount appli-
cations, PLCC or SOIC packaging is available. Tape
and reel packaging is also available for PLCC or SOIC
packages.
28
27
26
25
24
23
22
21
20
19
18
17
16
15
20
V
CC
A14
A13
A8
A9
A11
OE
A10
CE
O7
O6
O5
O4
O3
27LV256
2004 Microchip Technology Inc.
DS11020H-page 1

 
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