MAT Series
High Frequencies Miniature Quartz Crystal Units
FEATURES
• Wide frequency range coverage from 12MHz to
66MHz.
APPLICATIONS
• Radio Communication Equipment, Pagers, Cellular
Telephones, Cordless Telephones, Clock Source for
Micro-Computers
STANDARD SPECIFICATIONS
Item
Nominal Frequency
Frequency Tolerance
Frequency Temperature Stability
Load Capacitance
Equivalent Series Resistance
Drive Level
Shunt Capacitance
Aging
Operating Temperature Range
Storage Temperature Range
Solderability
Symbol
f
0
Conditions without notice (Temperature: +25°C
±2°C)
MAT-309
12 MHz to 28 MHz
28.1 MHz to 66 MHz
Conditions
Fundamental
3rd overtone
∆
f/f
0
∆
f/f
0
C
L
R
1
DL
C
0
∆
f/f
0
Tope
Tsto
Tsol
±
15ppm,
±
30ppm
±
15ppm,
±
30ppm,
±
50ppm
18 pF
Please see the table below.
100
µ
W max.
5.0 pF max.
±
5ppm max.
-10
°
C to +70
°C
-45
°
C to +80
°C
280
°
C max., 5sec.max (Package 150
°
C max.)
Leads only
+25
°C±3°
C, First Year
-10
°
C to +70
°C
DIMENSIONS
MAT-309
9.0 max.
10.0 min.
φ0.3
EQUIVALENT SERIES RESISTANCE(E.S.R)
Type
Frequency
12.0MHz to 28.0MHz
MAT-309
28.1MHz to 66.0MHz
E. S. R.
60
Ω
max.
100
Ω
max.
φ3.1
UNIT: mm
12
(1.1)
Quartz Crystal Unit Handling Precautions
1.
Mounting Precautions
1.1 Lead Type Crystal Units
1.1.1 Structure
Tubular crystal units (VT, VTC, MGQ, and MAT) are hermetically sealed using glass (see Figures 1 and 2).
Case
Case
Hermetic
Glass
Lead
Hermetic
Glass
Lead
Figure 1
Figure 2
1.1.2
Unbending the lead
(1) DO NOT pull the lead excessively if unbending a lead or removing a crystal unit. The excessive force
may crack the glass and reduce the degree of vacuum. This may eventually result in deterioration of
the characteristics and may also break the crystal chip (see Figure 3).
(2) Unbend the lead by pressing on the bent part from both the upper and lower sides with fixing the
bottom of lead tightly.(see Figure 4).
Breakage
Pull out
Case
Tweezers or
needle-nose pliers
Lead
Figure 3
Figure 4
1.1.3 Bending the lead
(1) Bend the lead so that the lead remains straight for more than 0.5mm from the case when soldering after bending
a lead. If not, the glass may be cracked (see Figures 5 and 6).
(2) Always leave a length greater than the case diameter when bending a lead after soldering (see Figure 7).
D
0.5mm
0.5mm
L>D
Solder
Printed circuit board
Solder
Solder
L
Figure 5
Figure 6
Figure 7
Make the length from the case to the printed
circuit board (L) longer than the case diameter
(D) so that the lead wire will not be pulled if the
crystal unit falls over.
Soldering directly to the case will reduce the degree of vacuum and may result
in deterioration of the characteristics and may break the crystal chip.
1.1.4 Soldering
Heat the lead wire at a temperature of less than 280°C for 5 seconds or less, when mounting or removing a
crystal unit. A long period time of heating may result in deterioration of the characteristics and may break the
crystal unit.
1
1.2.
1.2.1
SMD Type Quartz Crystal Units
Soldering
(1) For mounting, it is recommended to solder at less than 230°C for 20 seconds or less. An example of
the infrared ray reflow temperature profile is shown as follows (see Figure 8).
Example of SMD product soldering conditions
(reflow conditions)
250
Temperature(°C)
230°C
-10
°C
150°C
30~40sec
15~20sec
+0
200
150
100
50
0
Note:The temperature is the PCB surface temperature.
30
60
90
Time(sec)
120
Figure 8
2.
Cleaning
(1) Since low or intermediate frequency crystal units (VT ,VTC, and MGQ) or oscillators use a small, thin crystal
chip and the frequency approximates the frequency of an ultrasonic cleaner, the crystal chip may break
easily. Therefore, DO NOT perform ultrasonic cleaning.
(2) Other crystal units may also break depending upon the ultrasonic cleaning condition. Please check the
ultrasonic cleaning condition.
3.
Mechanical Shock
(1) The quartz crystal units are designed to withstand a drop from a height of 75 cm onto a hard wooden board
at least three times. However, the crystal chip may break if dropped, depending upon the how they are
dropped. Ensure that the crystal unit functions normally, if the crystal units have been dropped or subjected
to an excessive mechanical shock.
(2) Unlike chip parts for resistors, and capacitors, the crystal unit has a crystal chip which is hermetically sealed
inside. Before using the crystal units, check the influence of shock caused during automatic mounting.
2
Packing
The following is the standard packing. In the case of a small quantity of products (less than 1 lot), this packing may
differ.
1.
Lead type products
One hundred to five hundred units are packed in a vinyl bag. Twenty to forty bags are packed in a box and
shipped.
Product name
VT Series
VTC Series
MAT Series
Quantity per lot
10,000 pcs.
10,000 pcs.
4,000 pcs.
Quantity per bag
500 pcs.
500 pcs.
100 pcs.
Quantity per box
20 bags
20 bags
40 bags
The following products are individually packed in a partitioned styrofoam package (150 pcs.). Several packages
are bound and packed in a delivery container to ship.
Product name
MGQ Series
MGXO Series
Quantity per lot
600 pcs.
100 pcs.
Quantity per package
150 pcs.
Quantity per container
4 packages
Stuck into a conductive mat and packed in a box.
2.
SMD products
After being taped, the products are rolled onto a reel. The reels are packed in a box.
Product name
Quantity per reel
SP-T1
2,000 pcs.
SP-T2
3,000 pcs.
SP-T3
3,000 pcs.
HTF-VT/VTC
3,000 pcs.
Note: Specifications may differ when shipped in small quantities.
Tape and reel configuration
Emboss taping configuration
SP-T1/T2/T3
(per EIAJ RC-1009B)
40(10P)±0.2
4.0±0.1
2.0±0.05
φ1.5
+0.1
0
1.75±0.1
Reel configuration
(per EIAJ RC-1009B)
φ330
ω
W
0
°
12
8.0±0.1
R1.0
HTF-VT-VTC
(per EIAJ RC-1009B)
40(10P)±0.2
1.75±0.1
φ
13
±0.5
ω
W
20
°
2.0±0.05
φ1.5
+0.1
0
0.8
1±
φ
2
4.0±0.1
20
°
W
8.0±0.1
SP-T1/T2/T3,HTF-VT/VTC
ω
W
7.5
16.0
W
t
SP-T1/T2/T3,HTF-VT/VTC
16.4
2.0
UNIT: mm
4
φ50
max.
2±0.5
t
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