Standard SRAM, 128KX8, 25ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32
参数名称 | 属性值 |
厂商名称 | Micron Technology |
零件包装代码 | SOJ |
包装说明 | 0.400 INCH, PLASTIC, SOJ-32 |
针数 | 32 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 25 ns |
JESD-30 代码 | R-PDSO-J32 |
长度 | 20.98 mm |
内存密度 | 1048576 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 32 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 128KX8 |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOJ |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 3.68 mm |
最大供电电压 (Vsup) | 3.63 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 10.21 mm |
MT5LC128K8D4DJ-25TR | MT5LC128K8D4TG-25 | MT5LC128K8D4TG-25TR | MT5LC128K8D4TG-20 | MT5LC128K8D4TG-20TR | MT5LC128K8D4DJ-25 | MT5LC128K8D4DJ-20 | MT5LC128K8D4DJ-20TR | |
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描述 | Standard SRAM, 128KX8, 25ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 | Standard SRAM, 128KX8, 25ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32 | Standard SRAM, 128KX8, 25ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32 | Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32 | Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32 | Standard SRAM, 128KX8, 25ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 | Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 | Standard SRAM, 128KX8, 20ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 |
零件包装代码 | SOJ | TSOP | TSOP | TSOP | TSOP | SOJ | SOJ | SOJ |
包装说明 | 0.400 INCH, PLASTIC, SOJ-32 | 0.400 INCH, PLASTIC, TSOP-32 | TSOP2, | 0.400 INCH, PLASTIC, TSOP-32 | TSOP2, | 0.400 INCH, PLASTIC, SOJ-32 | 0.400 INCH, PLASTIC, SOJ-32 | 0.400 INCH, PLASTIC, SOJ-32 |
针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | not_compliant | unknown | not_compliant | unknown | unknown | not_compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | 3A991.B.2.B | 3A991.B.2.B | EAR99 | 3A991.B.2.B | 3A991.B.2.B |
最长访问时间 | 25 ns | 25 ns | 25 ns | 20 ns | 20 ns | 25 ns | 20 ns | 20 ns |
JESD-30 代码 | R-PDSO-J32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 |
长度 | 20.98 mm | 20.96 mm | 20.96 mm | 20.96 mm | 20.96 mm | 20.98 mm | 20.98 mm | 20.98 mm |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
可输出 | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOJ | TSOP2 | TSOP2 | TSOP2 | TSOP2 | SOJ | SOJ | SOJ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.68 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 3.68 mm | 3.68 mm | 3.68 mm |
最大供电电压 (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | J BEND | GULL WING | GULL WING | GULL WING | GULL WING | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.21 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.21 mm | 10.21 mm | 10.21 mm |
厂商名称 | Micron Technology | Micron Technology | Micron Technology | - | - | Micron Technology | Micron Technology | Micron Technology |
JESD-609代码 | - | e0 | e3 | e0 | e3 | e0 | e0 | - |
端子面层 | - | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
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