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MA4P7006F-1072T

产品描述SILICON, PIN DIODE, ROHS COMPLIANT, LEADLESS, CERAMIC, CASE 1072, SMQ, MELF-2
产品类别分立半导体    二极管   
文件大小1MB,共12页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
标准
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MA4P7006F-1072T概述

SILICON, PIN DIODE, ROHS COMPLIANT, LEADLESS, CERAMIC, CASE 1072, SMQ, MELF-2

MA4P7006F-1072T规格参数

参数名称属性值
是否Rohs认证符合
厂商名称TE Connectivity(泰科)
零件包装代码MELF
针数2
制造商包装代码CASE 1072
Reach Compliance Codeunknown
其他特性LOW DISTORTION
应用ATTENUATOR; SWITCHING
配置SINGLE
最大二极管电容0.7 pF
二极管元件材料SILICON
最大二极管正向电阻0.9 Ω
二极管类型PIN DIODE
频带HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
JESD-30 代码R-CDSO-R2
JESD-609代码e3
少数载流子标称寿命5 µs
元件数量1
端子数量2
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状RECTANGULAR
封装形式SMALL OUTLINE
最大功率耗散3 W
认证状态Not Qualified
表面贴装YES
技术POSITIVE-INTRINSIC-NEGATIVE
端子面层TIN
端子形式WRAP AROUND
端子位置DUAL

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MA4P HIPAX
High Power PIN Diodes
Features
High Power Handling
Low Loss / Low Distortion
Voltage Ratings up to 1000 Volts
Passivated Chip for Low Leakage Current
Low Theta (θ) Due to Full Face Chip Bonding
Leadless Low Inductance MELF Packages
Various Package Options
Available as Chips
Fully RoHS Compliant
V12
Package Styles
401 & 402
1072 & 1091
Description
M/A-COM Technology Solutions MELF and HIPAX
PIN diode series are designed for usage in switch
and attenuator applications requiring high power
handling and low distortion. The MELF and HIPAX
PIN diodes incorporate a fully passivated PIN diode
chip resulting in an extremely low reverse bias
leakage current. The semiconductor technology
utilized in the MELF and HIPAX families draws on
M/A-COM Tech’s substantial experience in PIN
diode design and wafer fabrication. The result is a
device which has a thick
I-region
and long carrier
lifetime while maintaining low series resistance and
capacitance values. The chips of the MELF and
HIPAX PIN diodes are enclosed in a rugged
ceramic package and is full face bonded to metal
pins on both the anode and cathode. The result is a
low loss PIN diode with low thermal resistance due
to symmetrical thermal paths. The parts are offered
in either magnetic or non-magnetic, HIPAX (axial
leaded) or
Metal Electrode Leadless Faced (MELF)
surface mount packages for MRI applications. The
MELF is a rectangular SMQ, package which is
designed for high volume tape and reel assembly.
This easy to use package design makes automatic
pick and place, indexing and assembly, extremely
easy. The parallel flat surfaces are suitable for most
key jaw or vacuum pick-up techniques. All of the
solderable surfaces are tin plated and compatible
with industry standard reflow and vapor phase
soldering processes. See page 7 of Application
Note
M538
on the
M/A-COM Technology Solutions
website for a typical solder reflow profile.
Applications
HIPAX PIN diodes are designed for use in a wide
variety of switch and attenuator applications from HF
through UHF frequencies and at power levels above
1kW, CW. The internal chip as well as each diode
assembly has been comprehensively tested and
characterized to ensure predictable and repeatable
performance.
Design Recommendations
Low Distortion Attenuators
MA4P4301B
Surface Mount Switches
MA4P7101F
Cellular Radio Antenna Switches
MA4P1200, MA4P1250
Absolute Maximum Ratings
T
AMB
= +25°C
(Unless Otherwise Noted)
1
Parameter
Absolute Maximum
D.C. Reverse Voltage (V
R
)
Operating Chip Junction
Temperature
Storage Temperature
Installation Temperature
ESD
(See Tables)
-55°C to +175°C
-55°C to +200°C
+280°C for 30 Seconds
Class 1A, HBM
Notes
1. Operation of this device above any one of these
parameters may cause permanent damage.
1
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
India
Tel: +91.80.4155721
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
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