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HB52E168EN-A6D: 产品描述Synchronous DRAM Module, 16MX64, 6ns, CMOS, DIMM-168; 产品类别存储存储; 文件大小965KB，共82页; 制造商Hitachi （Renesas ）; 官网地址http://www.renesas.com/eng/

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HB52E168EN-A6D概述

Synchronous DRAM Module, 16MX64, 6ns, CMOS, DIMM-168

HB52E168EN-A6D规格参数

参数名称	属性值
厂商名称	Hitachi （Renesas ）
零件包装代码	DIMM
包装说明	DIMM, DIMM168
针数	168
Reach Compliance Code	unknown
ECCN代码	EAR99
访问模式	DUAL BANK PAGE BURST
最长访问时间	6 ns
其他特性	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	100 MHz
I/O 类型	COMMON
JESD-30 代码	R-XDMA-N168
内存密度	1073741824 bit
内存集成电路类型	SYNCHRONOUS DRAM MODULE
内存宽度	64
功能数量	1
端口数量	1
端子数量	168
字数	16777216 words
字数代码	16000000
工作模式	SYNCHRONOUS
最高工作温度	65 °C
最低工作温度
组织	16MX64
输出特性	3-STATE
封装主体材料	UNSPECIFIED
封装代码	DIMM
封装等效代码	DIMM168
封装形状	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY
电源	3.3 V
认证状态	Not Qualified
刷新周期	4096
自我刷新	YES
最大待机电流	0.032 A
最大压摆率	1.36 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	3.3 V
表面贴装	NO
技术	CMOS
温度等级	COMMERCIAL
端子形式	NO LEAD
端子节距	1.27 mm
端子位置	DUAL

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HB52E88EM-D, HB52E89EM-D,

HB52E168EN-D, HB52E169EN-D

64 MB Unbuffered SDRAM DIMM, 100 MHz Memory Bus

(HB52E88EM) 8-Mword

64-bit, 1-Bank Module

(8 pcs of 8 M

8 Components)

(HB52E89EM) 8-Mword

72-bit, 1-Bank Module

(9 pcs of 8 M

8 Components)

128 MB Unbuffered SDRAM DIMM, 100 MHz Memory Bus

(HB52E168EN) 16-Mword

64-bit, 2-Bank Module

(16 pcs of 8 M

8 Components)

(HB52E169EN) 16-Mword

72-bit, 2-Bank Module

(18 pcs of 8 M

8 Components)

PC100 SDRAM

ADE-203-959 (Z)

Preliminary

Rev. 0.0

Sep. 10, 1998

Description

The HB52E88EM, HB52E89EM, HB52E168EN, HB52E169EN belong to 8-byte DIMM (Dual In-line

Memory Module) family, and have been developed as an optimized main memory solution for 8-byte

processor applications. They are synchronous Dynamic RAM Module, mounted 64-Mbit SDRAMs

(HM5264805DTT) sealed in TSOP package, and 1 piece of serial EEPROM (2-kbit EEPROM) for

Presence Detect (PD). The HB52E88EM is organized 8M

1-bank mounted 8 pieces of 64-Mbit

SDRAM. The HB52E89EM is organized 8M

1-bank mounted 9 pieces of 64-Mbit SDRAM. The

HB52E168EN is organized 8M

2-bank mounted 16 pieces of 64-Mbit SDRAM. The HB52E169EN

is organized 8M

2-bank mounted 18 pieces of 64-Mbit SDRAM. An outline of the products is 168-

pin socket type package (dual lead out). Therefore, they make high density mounting possible without

surface mount technology. They provide common data inputs and outputs. Decoupling capacitors are

mounted beside each TSOP on the module board.

Preliminary: The specification of this device are subject to change without notice. Please contact your nearest

Hitachi’s Sales Dept. regarding specification.

HB52E168EN-A6D相似产品对比

	HB52E168EN-A6D	HB52E168EN-B6D	HB52E169EN-B6D	HB52E169EN-A6D	HB52E88EM-B6D	HB52E88EM-A6D	HB52E89EM-B6D	HB52E89EM-A6D
描述	Synchronous DRAM Module, 16MX64, 6ns, CMOS, DIMM-168	Synchronous DRAM Module, 16MX64, 6ns, CMOS, DIMM-168	Synchronous DRAM Module, 16MX72, 6ns, CMOS, DIMM-168	Synchronous DRAM Module, 16MX72, 6ns, CMOS, DIMM-168	Synchronous DRAM Module, 8MX64, 6ns, CMOS, DIMM-168	Synchronous DRAM Module, 8MX64, 6ns, CMOS, DIMM-168	Synchronous DRAM Module, 8MX72, 6ns, CMOS, DIMM-168	Synchronous DRAM Module, 8MX72, 6ns, CMOS, DIMM-168
零件包装代码	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
包装说明	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168
针数	168	168	168	168	168	168	168	168
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
访问模式	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST
最长访问时间	6 ns	6 ns	6 ns	6 ns	6 ns	6 ns	6 ns	6 ns
其他特性	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168
内存密度	1073741824 bit	1073741824 bit	1207959552 bit	1207959552 bit	536870912 bit	536870912 bit	603979776 bit	603979776 bit
内存集成电路类型	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
内存宽度	64	64	72	72	64	64	72	72
功能数量	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1
端子数量	168	168	168	168	168	168	168	168
字数	16777216 words	16777216 words	16777216 words	16777216 words	8388608 words	8388608 words	8388608 words	8388608 words
字数代码	16000000	16000000	16000000	16000000	8000000	8000000	8000000	8000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	65 °C	65 °C	65 °C	65 °C	65 °C	65 °C	65 °C	65 °C
组织	16MX64	16MX64	16MX72	16MX72	8MX64	8MX64	8MX72	8MX72
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装代码	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
封装等效代码	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168	DIMM168
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
电源	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	4096	4096	4096	4096	4096	4096	4096	4096
自我刷新	YES	YES	YES	YES	YES	YES	YES	YES
最大待机电流	0.032 A	0.032 A	0.036 A	0.036 A	0.016 A	0.016 A	0.018 A	0.018 A
最大压摆率	1.36 mA	1.36 mA	1.53 mA	1.53 mA	1.12 mA	1.12 mA	1.26 mA	1.26 mA
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
厂商名称	Hitachi （Renesas ）	-	-	-	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）

HB52E168EN-A6D

HB52E168EN-A6D概述

HB52E168EN-A6D规格参数

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