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MAX9770ETI

产品描述1.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO28
产品类别模拟混合信号IC    消费电路   
文件大小495KB,共24页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
下载文档 详细参数 选型对比 全文预览 文档解析

MAX9770ETI概述

1.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO28

MAX9770ETI规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码QFN
包装说明5 X 5 MM, 0.80 MM HEIGHT, QFN-28
针数28
Reach Compliance Code_compli
ECCN代码EAR99
标称带宽22 kHz
商用集成电路类型AUDIO AMPLIFIER
增益9 dB
JESD-30 代码S-XQCC-N28
JESD-609代码e4
长度5 mm
湿度敏感等级1
信道数量2
功能数量1
端子数量28
最高工作温度85 °C
最低工作温度-40 °C
标称输出功率1.2 W
封装主体材料UNSPECIFIED
封装代码HVQCCN
封装等效代码LCC28,.2SQ,20
封装形状SQUARE
封装形式CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)245
电源3/5 V
认证状态Not Qualified
座面最大高度0.8 mm
最大压摆率10 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2.5 V
表面贴装YES
技术BICMOS
温度等级INDUSTRIAL
端子面层NICKEL PALLADIUM GOLD
端子形式NO LEAD
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度5 mm

文档解析

MAX9770是一款集成单声道无滤波器Class D扬声器放大器和立体声DirectDrive耳机放大器的音频芯片,工作电压范围为2.5V至5.5V。该芯片采用高效设计,扬声器部分可提供1.2W输出功率至8Ω负载,效率超过85%,同时通过专利扩展频谱技术降低电磁干扰(EMI),满足FCC B类辐射标准。耳机部分采用DirectDrive架构,消除对大型DC阻塞电容的需求,提升音频保真度并节省电路板空间。整体设计支持低功耗模式,待机电流仅0.1μA,适用于便携式设备。 关键技术包括:Class D放大器使用无滤波器架构,通过调制频率控制和外部时钟同步(SYNC输入)优化EMI性能;耳机放大器提供±8kV ESD保护,输出功率达80mW至16Ω负载,THD+N低至0.015%。芯片内置输入多路复用器/混合器,支持多路音频源选择和混合,逻辑可调增益(-2dB至9dB),并配备耳机感应(HPS)功能,自动切换扬声器或耳机模式。 应用场景涵盖手机、PDA和紧凑型笔记本等便携设备,提供全面的保护机制,如热过载和输出短路保护。封装选项包括28-pin TQFN(5mm x 5mm x 0.8mm)和TSSOP,工作温度范围-40°C至+85°C,确保在严苛环境下稳定运行。

文档预览

下载PDF文档
19-3134; Rev 0; 5/04
1.2W Low-EMI, Filterless, Mono Class D Amplifier
with Stereo DirectDrive Headphone Amplifiers
General Description
The MAX9770 combines a mono, filterless, Class D
speaker amplifier and stereo DirectDrive headphone
amplifiers in a single device. The MAX9770 operates
from a single 2.5V to 5.5V supply and includes features
that reduce external component count, system cost,
board space, and offer improved audio reproduction.
The speaker amplifier makes use of Maxim’s patented
Class D architecture, providing Class AB performance
with Class D efficiency, conserving board space, and
extending battery life. The speaker amplifier delivers
1.2W into an 8Ω load while offering efficiencies above
85%. A spread-spectrum scheme reduces radiated
emissions caused by the modulation frequency.
Furthermore, the MAX9770 oscillator can be synchro-
nized to an external clock through the SYNC input,
avoiding possible problem frequencies inside a system.
The speaker amplifier features a low 0.025% THD+N,
high 70dB PSRR, and SNR in excess of 90dB.
The headphone amplifiers feature Maxim’s patented
DirectDrive architecture that produces a ground-refer-
enced output from a single supply, eliminating the need
for large DC-blocking capacitors. The headphone ampli-
fiers deliver up to 80mW into a 16Ω load, feature low
0.015% THD+N, high 80dB PSRR, and
±8kV
ESD-pro-
tected outputs. A headphone sense input detects the
presence of a headphone, and automatically configures
the amplifiers for either speaker or headphone mode.
The MAX9770 includes internally set, logic-selectable
gain, and a comprehensive input multiplexer/mixer, allow-
ing multiple audio sources to be selected and for true
mono reproduction of a stereo source in speaker mode.
Industry-leading click-and-pop suppression eliminates
audible transients during power and shutdown cycles. A
low-power shutdown mode decreases supply current
consumption to 0.1µA, further extending battery life.
The MAX9770 is offered in space-saving, thermally effi-
cient 28-pin TQFN (5mm x 5mm x 0.8mm) and 28-pin
TSSOP packages. The MAX9770 features thermal-over-
load and output short-circuit protection, and is specified
over the extended -40°C to +85°C temperature range.
Features
1.2W Filterless Class D Amplifier Passes FCC
Class B Radiated Emissions Standards with
100mm of Cable
Unique Spread-Spectrum Mode Offers 5dB
Emissions Improvement Over Conventional
Methods
80mW DirectDrive Headphone Amplifier
Eliminates Bulky DC-Blocking Capacitors
High 80dB PSRR at 217Hz
85% Efficiency
Low 0.015% THD+N
Industry-Leading Click-and-Pop Suppression
Integrated 3-Way Input Mixer/Multiplexer
Logic-Selectable Gain
Short-Circuit and Thermal Protection
±8kV
ESD-Protected Headphone Outputs
Low-Power Shutdown Mode
Available in Space-Saving, Thermally Efficient
Packages
28-Pin TQFN (5mm x 5mm x 0.8mm)
28-Pin TSSOP
MAX9770
Ordering Information
PART
MAX9770ETI
MAX9770EUI
Lead-free package.
TEMP RANGE
-40
o
C to +85
o
C
-40 C to +85 C
o
o
PIN-PACKAGE
28 TQFN-EP*
28 TSSOP
*EP
= Exposed paddle.
Simplified Block Diagram
V
DD
DirectDrive
STEREO
HEADPHONE
L1IN
L2IN
MONO
Applications
Cellular Phones
PDAs
Compact Notebooks
R1IN
R2IN
GAIN SEL
INPUT SEL
MUTE
SHDN
HPS
CLASS
D
SPKR
(MONO)
MAX9770
Pin Configuration appears at end of data sheet.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX9770ETI相似产品对比

MAX9770ETI MAX9770 MAX9770EUI
描述 1.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO28 1.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO28 1.2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO28
增益 9 dB 9 dB 9 dB
功能数量 1 1 1
端子数量 28 28 28
表面贴装 YES Yes YES
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 NO LEAD GULL WING GULL WING
端子位置 QUAD DUAL DUAL
是否Rohs认证 不符合 - 不符合
厂商名称 Maxim(美信半导体) - Maxim(美信半导体)
零件包装代码 QFN - TSSOP
包装说明 5 X 5 MM, 0.80 MM HEIGHT, QFN-28 - 4.40 MM, MO-153AE, TSSOP-28
针数 28 - 28
Reach Compliance Code _compli - _compli
ECCN代码 EAR99 - EAR99
标称带宽 22 kHz - 22 kHz
商用集成电路类型 AUDIO AMPLIFIER - AUDIO AMPLIFIER
JESD-30 代码 S-XQCC-N28 - R-PDSO-G28
JESD-609代码 e4 - e0
长度 5 mm - 9.7 mm
湿度敏感等级 1 - 1
信道数量 2 - 2
最高工作温度 85 °C - 85 °C
最低工作温度 -40 °C - -40 °C
标称输出功率 1.2 W - 1.2 W
封装主体材料 UNSPECIFIED - PLASTIC/EPOXY
封装代码 HVQCCN - TSSOP
封装等效代码 LCC28,.2SQ,20 - TSSOP28,.25
封装形状 SQUARE - RECTANGULAR
封装形式 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 245 - 245
电源 3/5 V - 3/5 V
认证状态 Not Qualified - Not Qualified
座面最大高度 0.8 mm - 1.1 mm
最大压摆率 10 mA - 10 mA
最大供电电压 (Vsup) 5.5 V - 5.5 V
最小供电电压 (Vsup) 2.5 V - 2.5 V
技术 BICMOS - BICMOS
端子面层 NICKEL PALLADIUM GOLD - Tin/Lead (Sn/Pb)
端子节距 0.5 mm - 0.65 mm
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED
宽度 5 mm - 4.4 mm

 
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