MAX2104CCM
Rev. A
RELIABILITY REPORT
FOR
MAX2104CCM
PLASTIC ENCAPSULATED DEVICES
January 28, 2001
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX2104 Successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
IV. .......Die Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
......Attachments
I. Device Description
A. General
The MAX2104 low-cost direct-conversion tuner IC is designed for use in digital direct-broadcast satellite (DBS)
television set-top box units. Its direct-conversion architecture reduces system cost compared to devices with IF-
based architectures. The MAX2104 directly converts L-band signals to baseband signals using a broadband I/Q
downconverter. The operating frequency range extends from 925MHz to 2175MHz.
The IC includes an LNA gain control, I and Q downconverting mixers, lowpass filters with gain control and frequency
control, a local oscillator (LO) buffer with a 90° quadrature network, and a charge-pump based PLL for frequency
control. The MAX2104 also has an on-chip LO, requiring only an external varactor-tuned LC tank for operation. The
output of the LO drives the internal quadrature generator and dual modulus prescaler. An on-chip crystal amplifier
drives a reference divider as well as a buffer amplifier to drive off-chip circuitry. The MAX2104 is offered in a 48-pin
TQFP-EP package.
B. Absolute Maximum Ratings
Item
Vcc to GND
All other pins to GND
RF1+ to RF1-, RF2+ to RF2-, TANK+ to TANK-, IDC+ to IDC-,
QDC+ to QDC-
IOUT_,QOUT_ to GND Short Circuit Duration
PSOU+, PSOUT- to GND Short Circuit Duration
Continuous Current (any pin)
Storage Temperature Range
Lead Temperature (soldering, 10s)
Junction Temperature
Continuous Power Dissipation (TA = +70°C)
48-Pin TQFP
Derates above +70°C
48-Pin TQFP
Rating
-0.5V to +7V
-0.3V to (VCC + 0.3V)
+/-2V
10s
10s
20mA
-65°C to +150°C
+300°C
+150°C
1500mW
27mW/°C
II. Manufacturing Information
A. Description/Function:
B. Process:
Direct-Conversion Tuner IC for Digital DBS Application
GST2 – High Speed Double Poly-Silicon Bipolar Process
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
Oregon, USA
Malaysia
January, 1999
III. Packaging Information
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
48-Lead TQFP
Copper
Solder Plate
Silver-filled Epoxy
Gold (1.02mil dia.)
Epoxy with silica filler
Buildsheet # 05-7001-0319
Class UL94-V0
I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
96 x 96
Si
3
N
4
/SiO
2
(Silicon nitride/ Silicon dioxide)
Poly / Au
None
2 microns (as drawn)
2 microns (as drawn)
5 mil. Sq.
SiO
2
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager)
Bryan Preeshl (Executive Director of QA)
Kenneth Huening (Vice President)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 150°C biased (static) life test are shown in
Table 1.
Using these results, the Failure
Rate (λ) is calculated as follows:
λ
=
1
=
MTTF
1.83
(Chi square value for MTTF upper limit)
192 x 9823 x 50 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ
= 9.70 x 10
-9
λ
= 9.70 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs.
Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The
reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates
to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level.
Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product
Reliability Report (RR-1M) located on the Maxim website at http://www.maxim-ic.com .
B. Moisture Resistance Tests
Maxim evaluates pressure pot stress from every assembly process during qualification of each new design.
Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85°C/85%RH or
HAST tests are performed quarterly per device/package family.
C. E.S.D. and Latch-Up Testing
The WR31 die type has been found to have all pins able to withstand a transient pulse of
±1000V,
per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of
±100mA
and/or
±20V.
Table 1
Reliability Evaluation Test Results
MAX2104CCM
TEST ITEM
TEST CONDITION
FAILURE
IDENTIFICATION
SAMPLE
SIZE
NUMBER OF
FAILURES
Static Life Test
(Note 1)
Ta = 150°C
Biased
Time = 192 hrs.
Moisture Testing
(Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
50
0
DC Parameters
& functionality
77
0
85/85
DC Parameters
& functionality
77
0
Mechanical Stress
(Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
DC Parameters
77
0
Note 1: Life Test Data may represent plastic D.I.P. qualification lots.
Note 2: Generic Process/Package Data
PCB设计
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