Flash, 256KX8, 200ns, CDIP32, 0.600 INCH, CERDIP-32
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP32,.6 |
| 针数 | 32 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 200 ns |
| 其他特性 | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
| 启动块 | BOTTOM/TOP |
| 命令用户界面 | NO |
| 数据轮询 | YES |
| JESD-30 代码 | R-GDIP-T32 |
| JESD-609代码 | e0 |
| 长度 | 42.3 mm |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 部门数/规模 | 1K |
| 端子数量 | 32 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP32,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.72 mm |
| 部门规模 | 256 |
| 最大待机电流 | 0.00002 A |
| 最大压摆率 | 0.015 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 切换位 | YES |
| 类型 | NOR TYPE |
| 宽度 | 15.24 mm |
| AT29LV020-20DC | AT29LV020-20DI | AT29LV020-20PC | AT29LV020-20PI | AT29LV020-25DC | AT29LV020-25DI | AT29LV020-25PI | AT29LV020-25PC | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Flash, 256KX8, 200ns, CDIP32, 0.600 INCH, CERDIP-32 | Flash, 256KX8, 200ns, CDIP32, 0.600 INCH, CERDIP-32 | Flash, 256KX8, 200ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Flash, 256KX8, 200ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Flash, 256KX8, 250ns, CDIP32, 0.600 INCH, CERDIP-32 | Flash, 256KX8, 250ns, CDIP32, 0.600 INCH, CERDIP-32 | Flash, 256KX8, 250ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Flash, 256KX8, 250ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, DIP32,.6 | DIP, DIP32,.6 | DIP, DIP32,.6 | DIP, DIP32,.6 | DIP, DIP32,.6 | DIP, DIP32,.6 | DIP, DIP32,.6 | DIP, DIP32,.6 |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | compliant | compliant | unknown | unknown | compliant | compliant | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 200 ns | 200 ns | 200 ns | 200 ns | 250 ns | 250 ns | 250 ns | 250 ns |
| 其他特性 | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
| 启动块 | BOTTOM/TOP | BOTTOM/TOP | BOTTOM/TOP | BOTTOM/TOP | BOTTOM/TOP | BOTTOM/TOP | BOTTOM/TOP | BOTTOM/TOP |
| 命令用户界面 | NO | NO | NO | NO | NO | NO | NO | NO |
| 数据轮询 | YES | YES | YES | YES | YES | YES | YES | YES |
| JESD-30 代码 | R-GDIP-T32 | R-GDIP-T32 | R-PDIP-T32 | R-PDIP-T32 | R-GDIP-T32 | R-GDIP-T32 | R-PDIP-T32 | R-PDIP-T32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 42.3 mm | 42.3 mm | 42.05 mm | 42.05 mm | 42.3 mm | 42.3 mm | 42.05 mm | 42.05 mm |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 部门数/规模 | 1K | 1K | 1K | 1K | 1K | 1K | 1K | 1K |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP32,.6 | DIP32,.6 | DIP32,.6 | DIP32,.6 | DIP32,.6 | DIP32,.6 | DIP32,.6 | DIP32,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.72 mm | 5.72 mm | 5.59 mm | 5.59 mm | 5.72 mm | 5.72 mm | 5.59 mm | 5.59 mm |
| 部门规模 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| 最大待机电流 | 0.00002 A | 0.00005 A | 0.00002 A | 0.00005 A | 0.00002 A | 0.00005 A | 0.00005 A | 0.00002 A |
| 最大压摆率 | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 切换位 | YES | YES | YES | YES | YES | YES | YES | YES |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
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