EEPROM, 64X16, Serial, CMOS, PDIP8
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Catalyst |
包装说明 | DIP, DIP8,.3 |
Reach Compliance Code | unknown |
备用内存宽度 | 8 |
数据保留时间-最小值 | 100 |
耐久性 | 1000000 Write/Erase Cycles |
JESD-30 代码 | R-PDIP-T8 |
内存密度 | 1024 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 16 |
端子数量 | 8 |
字数 | 64 words |
字数代码 | 64 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 64X16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP8,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | SERIAL |
电源 | 2/5 V |
认证状态 | Not Qualified |
串行总线类型 | MICROWIRE |
最大待机电流 | 0.00001 A |
最大压摆率 | 0.003 mA |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
写保护 | SOFTWARE |
CAT93C46LI-1.8G | CAT93C46VI-1.8GT3 | CAT93C46ZD4I-1.8GT3 | CAT93C46ZD4I-1.8G | CAT93C46ZD4I-G | |
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描述 | EEPROM, 64X16, Serial, CMOS, PDIP8 | EEPROM, 64X16, Serial, CMOS, PDSO8 | EEPROM, 64X16, Serial, CMOS, PDSO8 | EEPROM, 64X16, Serial, CMOS, PDSO8 | EEPROM, 64X16, Serial, CMOS, PDSO8 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst |
包装说明 | DIP, DIP8,.3 | SOP, SOP8,.25 | SON, SOLCC8,.12,25 | SON, SOLCC8,.12,25 | SON, SOLCC8,.12,25 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
备用内存宽度 | 8 | 8 | 8 | 8 | 8 |
数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 |
耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
JESD-30 代码 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 |
内存密度 | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 |
端子数量 | 8 | 8 | 8 | 8 | 8 |
字数 | 64 words | 64 words | 64 words | 64 words | 64 words |
字数代码 | 64 | 64 | 64 | 64 | 64 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 64X16 | 64X16 | 64X16 | 64X16 | 64X16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | SON | SON | SON |
封装等效代码 | DIP8,.3 | SOP8,.25 | SOLCC8,.12,25 | SOLCC8,.12,25 | SOLCC8,.12,25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
电源 | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
最大待机电流 | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A |
最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
表面贴装 | NO | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | THROUGH-HOLE | GULL WING | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 2.54 mm | 1.27 mm | 0.635 mm | 0.635 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
写保护 | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |
Is Samacsys | - | N | N | N | N |
Base Number Matches | - | 1 | 1 | 1 | 1 |
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