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MAX9746BEBC+T

产品描述Audio Amplifier, 1 Channel(s), 1 Func, BICMOS, PDSO12, LEAD FREE, PLASTIC, UCSP-12
产品类别模拟混合信号IC    消费电路   
文件大小337KB,共16页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
标准
下载文档 详细参数 选型对比 全文预览

MAX9746BEBC+T概述

Audio Amplifier, 1 Channel(s), 1 Func, BICMOS, PDSO12, LEAD FREE, PLASTIC, UCSP-12

MAX9746BEBC+T规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Maxim(美信半导体)
零件包装代码SOIC
包装说明SON, BGA12,3X4,20
针数12
Reach Compliance Codecompliant
ECCN代码EAR99
商用集成电路类型AUDIO AMPLIFIER
JESD-30 代码R-PDSO-N12
JESD-609代码e3
湿度敏感等级1
信道数量1
功能数量1
端子数量12
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码SON
封装等效代码BGA12,3X4,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)260
电源3/5 V
认证状态Not Qualified
最大压摆率5.2 mA
表面贴装YES
技术BICMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式NO LEAD
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED

文档预览

下载PDF文档
19-0515; Rev 0; 5/06
1.2W, Low-EMI, Filterless,
Class D Audio Amplifier
General Description
The MAX9746 mono Class D audio power amplifier pro-
vides Class AB amplifier performance with Class D effi-
ciency, conserving board space and extending battery
life. The MAX9746 is designed specifically for systems
using 1.8V logic interface. Using a Class D architecture,
the MAX9746 delivers 1.2W into an 8Ω load while offer-
ing efficiencies near 90%. A patented, low-EMI modula-
tion scheme renders the traditional Class D output filter
unnecessary.
The MAX9746 offers two modulation schemes: a fixed-
frequency (FFM) mode, and a spread-spectrum (SSM)
mode that reduces EMI-radiated emissions due to the
modulation frequency. Furthermore, the MAX9746 oscil-
lator can be synchronized to an external clock through
the SYNC input, allowing the switching frequency to be
user defined. The SYNC input also allows multiple
MAX9746s to be cascaded and frequency locked, mini-
mizing interference due to clock intermodulation. The
device utilizes a fully differential architecture, a full-
bridged output, and comprehensive click-and-pop sup-
pression. The gain of the MAX9746 is set internally
further reducing external component count.
The MAX9746 features high 72dB PSRR, a low 0.1%
THD+N, and SNR in excess of 90dB. Short-circuit and
thermal-overload protection prevent the device from
damage during a fault condition. The MAX9746 is avail-
able in a 12-bump UCSP™ (1.5mm
2mm
0.6mm)
package. The MAX9746 is specified over the extended
-40°C to +85°C temperature range.
Features
Filterless Amplifier Passes FCC Radiated
Emissions Standards with 100mm of Cable
Unique Spread-Spectrum Mode Offers 5dB
Emissions Improvement Over Conventional
Methods
Optional External SYNC Input
Simple Master-Slave Setup for Stereo Operation
88% Efficiency
1.2W into 8Ω
Low 0.1% THD+N
High PSRR (72dB at 217Hz)
Integrated Click-and-Pop Suppression
1.8V Logic-Compatible
Low Quiescent Current (4mA)
Low-Power Shutdown Mode (0.1µA)
Short-Circuit and Thermal-Overload Protection
Available in Thermally Efficient, Space-Saving
12-Bump UCSP Package (1.5mm x 2mm x 0.6mm)
MAX9746
Ordering Information
PART
MAX9746BEBC+T
TEMP RANGE
-40
o
C to +85
o
C
PIN-PACKAGE
12 UCSP-12
+Denotes
lead-free package.
Applications
Cellular Phones
PDAs
MP3 Players
Portable Audio
Pin Configuration
TOP VIEW
(BUMP SIDE DOWN)
1
Block Diagram
V
DD
MAX9746
2
3
4
V
DD
DIFFERENTIAL
AUDIO INPUT
MODULATOR
AND H-BRIDGE
SYNC
OUT+
A
IN+
B
SHDN
PGND
PV
DD
SYNC
INPUT
OSCILLATOR
IN-
GND
OUT-
MAX9746
C
UCSP
UCSP is a trademark of Maxim Integrated Products, Inc.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX9746BEBC+T相似产品对比

MAX9746BEBC+T MAX9746BEBC+
描述 Audio Amplifier, 1 Channel(s), 1 Func, BICMOS, PDSO12, LEAD FREE, PLASTIC, UCSP-12 Audio Amplifier, 1 Func, BICMOS, PBGA12
是否Rohs认证 符合 符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体)
包装说明 SON, BGA12,3X4,20 FBGA, BGA12,3X4,20
Reach Compliance Code compliant unknown
商用集成电路类型 AUDIO AMPLIFIER AUDIO AMPLIFIER
JESD-30 代码 R-PDSO-N12 R-PBGA-B12
JESD-609代码 e3 e3
功能数量 1 1
端子数量 12 12
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SON FBGA
封装等效代码 BGA12,3X4,20 BGA12,3X4,20
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE GRID ARRAY, FINE PITCH
电源 3/5 V 3/5 V
认证状态 Not Qualified Not Qualified
最大压摆率 5.2 mA 5.2 mA
表面贴装 YES YES
技术 BICMOS BICMOS
温度等级 INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn)
端子形式 NO LEAD BALL
端子节距 0.5 mm 0.5 mm
端子位置 DUAL BOTTOM
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