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74LVC3G07DP: 产品描述Triple buffer with open-drain output; 产品类别逻辑逻辑; 文件大小79KB，共16页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74LVC3G07DP概述

Triple buffer with open-drain output

74LVC3G07DP规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	SOIC
包装说明	TSSOP, TSSOP8,.16
针数	8
Reach Compliance Code	compli
系列	LVC/LCX/Z
JESD-30 代码	S-PDSO-G8
JESD-609代码	e4
长度	3 mm
负载电容（CL）	50 pF
逻辑集成电路类型	BUFFER
最大I（ol）	0.024 A
湿度敏感等级	1
功能数量	3
输入次数	1
端子数量	8
最高工作温度	125 °C
最低工作温度	-40 °C
输出特性	OPEN-DRAIN
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装等效代码	TSSOP8,.16
封装形状	SQUARE
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法	TAPE AND REEL
峰值回流温度（摄氏度）	260
电源	3.3 V
Prop。Delay @ Nom-Su	4.7 ns
传播延迟（tpd）	8.4 ns
认证状态	Not Qualified
施密特触发器	NO
座面最大高度	1.1 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	1.65 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	3 mm
Base Number Matches	1

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74LVC3G07

Triple buffer with open-drain output

Rev. 06 — 16 June 2008

Product data sheet

1. General description

The 74LVC3G07 provides three non-inverting buffers.

The output of the device is an open-drain and can be connected to other open-drain

outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions.

Input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this

device in a mixed 3.3 V and 5 V environment.

Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall

time.

This device is fully speciﬁed for partial power-down applications using I

OFF

. The I

OFF

circuitry disables the output, preventing the damaging backﬂow current through the device

when it is powered down.

2. Features

Wide supply voltage range from 1.65 V to 5.5 V

5 V tolerant input/output for interfacing with 5 V logic

High noise immunity

Complies with JEDEC standard:

JESD8-7 (1.65 V to 1.95 V)

JESD8-5 (2.3 V to 2.7 V)

JESD8-B/JESD36 (2.7 V to 3.6 V).

ESD protection:

HBM JESD22-A114E exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

−24

mA output drive (V

= 3.0 V)

CMOS low power consumption

Latch-up performance exceeds 250 mA

Direct interface with TTL levels

Inputs accept voltages up to 5 V

Multiple package options

Speciﬁed from

−40 °C

to +85

°C

and

−40 °C

to +125

°C.

74LVC3G07DP相似产品对比

	74LVC3G07DP	74LVC3G07	74LVC3G07GD	74LVC3G07GM	74LVC3G07DC	74LVC3G07GT
描述	Triple buffer with open-drain output	Triple buffer with open-drain output	Triple buffer with open-drain output	Triple buffer with open-drain output	Triple buffer with open-drain output	Triple buffer with open-drain output
是否Rohs认证	符合	-	符合	符合	符合	符合
厂商名称	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
零件包装代码	SOIC	-	SON	QFN	TSSOP	SON
包装说明	TSSOP, TSSOP8,.16	-	VSON, SOLCC8,.11,20	1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-1, QFN-8	2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8	1 X 1.95 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT833-1, SON-8
针数	8	-	8	8	8	8
Reach Compliance Code	compli	-	compli	compli	compli	compli
系列	LVC/LCX/Z	-	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 代码	S-PDSO-G8	-	R-PDSO-N8	S-PQCC-N8	R-PDSO-G8	R-PDSO-N8
JESD-609代码	e4	-	e4	-	e4	e3
长度	3 mm	-	3 mm	1.6 mm	2.3 mm	1.95 mm
负载电容（CL）	50 pF	-	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	BUFFER	-	BUFFER	BUFFER	BUFFER	BUFFER
最大I（ol）	0.024 A	-	0.024 A	0.024 A	0.024 A	0.024 A
湿度敏感等级	1	-	1	1	1	1
功能数量	3	-	3	3	3	3
输入次数	1	-	1	1	1	1
端子数量	8	-	8	8	8	8
最高工作温度	125 °C	-	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C
输出特性	OPEN-DRAIN	-	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN
封装主体材料	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSSOP	-	VSON	HVQCCN	VSSOP	VSON
封装等效代码	TSSOP8,.16	-	SOLCC8,.11,20	LCC8,.06SQ,20	TSSOP8,.12,20	SOLCC8,.04,20
封装形状	SQUARE	-	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE
包装方法	TAPE AND REEL	-	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
峰值回流温度（摄氏度）	260	-	260	260	260	260
电源	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V
Prop。Delay @ Nom-Su	4.7 ns	-	4.7 ns	4.7 ns	4.7 ns	4.7 ns
传播延迟（tpd）	8.4 ns	-	8.4 ns	8.4 ns	8.4 ns	8.4 ns
认证状态	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
施密特触发器	NO	-	NO	NO	NO	NO
座面最大高度	1.1 mm	-	0.5 mm	0.5 mm	1 mm	0.5 mm
最大供电电压 (Vsup)	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	1.65 V	-	1.65 V	1.65 V	1.65 V	1.65 V
标称供电电压 (Vsup)	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	-	YES	YES	YES	YES
技术	CMOS	-	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD	-	Nickel/Palladium/Gold (Ni/Pd/Au)	-	NICKEL PALLADIUM GOLD	Tin (Sn)
端子形式	GULL WING	-	NO LEAD	NO LEAD	GULL WING	NO LEAD
端子节距	0.65 mm	-	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	DUAL	-	DUAL	QUAD	DUAL	DUAL
处于峰值回流温度下的最长时间	30	-	30	30	30	30
宽度	3 mm	-	2 mm	1.6 mm	2 mm	1 mm

74LVC3G07DP

74LVC3G07DP概述

74LVC3G07DP规格参数

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74LVC3G07DP相似产品对比

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