LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8
LVC/LCX/Z 系列, 双 1位 驱动, 实输出, PDSO8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SOIC |
| 包装说明 | 3 MM, PLASTIC, SOT505-2, TSSOP-8 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| 控制类型 | ENABLE HIGH |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.024 A |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.16 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Su | 5.4 ns |
| 传播延迟（tpd） | 12.3 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3 mm |
| 74LVC2G126DP | 74LVC2G126 | 74LVC2G126DC | 74LVC2G126GD | 74LVC2G126GM | 74LVC2G126GT | 74LVC2G126_08 | |
|---|---|---|---|---|---|---|---|
| 描述 | LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8 | LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8 | LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8 | LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8 | LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8 | LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8 | LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8 |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 输出特性 | 3-STATE | 3-ST | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-ST |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 表面贴装 | YES | Yes | YES | YES | YES | YES | Yes |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD | GULL WING |
| 端子位置 | DUAL | 双 | DUAL | DUAL | QUAD | DUAL | 双 |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - |
| 零件包装代码 | SOIC | - | TSSOP | SON | QFN | SON | - |
| 包装说明 | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | - | 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 | 3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8 | 1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-2, QFN-8 | 1 X 1.95 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT833-1, SON-8 | - |
| 针数 | 8 | - | 8 | 8 | 8 | 8 | - |
| Reach Compliance Code | compli | - | compli | compli | compli | compli | - |
| 控制类型 | ENABLE HIGH | - | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | - |
| JESD-30 代码 | S-PDSO-G8 | - | R-PDSO-G8 | R-PDSO-N8 | S-PQCC-N8 | R-PDSO-N8 | - |
| JESD-609代码 | e4 | - | e4 | e4 | - | e3 | - |
| 长度 | 3 mm | - | 2.3 mm | 3 mm | 1.6 mm | 1.95 mm | - |
| 负载电容（CL） | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | - |
| 逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - |
| 最大I（ol） | 0.024 A | - | 0.024 A | 0.024 A | 0.024 A | 0.024 A | - |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | - |
| 端口数量 | 2 | - | 2 | 2 | 2 | 2 | - |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | TSSOP | - | VSSOP | VSON | HVQCCN | VSON | - |
| 封装等效代码 | TSSOP8,.16 | - | TSSOP8,.12,20 | SOLCC8,.11,20 | LCC8,.06SQ,20 | SOLCC8,.04,20 | - |
| 封装形状 | SQUARE | - | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | - |
| 包装方法 | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | - |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | 260 | 260 | - |
| 电源 | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| Prop。Delay @ Nom-Su | 5.4 ns | - | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | - |
| 传播延迟（tpd） | 12.3 ns | - | 12.3 ns | 12.3 ns | 12.3 ns | 12.3 ns | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.1 mm | - | 1 mm | 0.5 mm | 0.5 mm | 0.5 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 1.65 V | - | 1.65 V | 1.65 V | 1.65 V | 1.65 V | - |
| 标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | - |
| 端子面层 | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | Tin (Sn) | - |
| 端子节距 | 0.65 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 30 | 30 | - |
| 宽度 | 3 mm | - | 2 mm | 2 mm | 1.6 mm | 1 mm | - |
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