Dual bus buffer/line driver 3-state
| 74LVC2G125 | 74LVC2G125GD | 74LVC2G125DP | 74LVC2G125GM | 74LVC2G125_08 | |
|---|---|---|---|---|---|
| 描述 | Dual bus buffer/line driver 3-state | Dual bus buffer/line driver 3-state | LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8 | Dual bus buffer/line driver 3-state | Dual bus buffer/line driver 3-state |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | - |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - |
| 零件包装代码 | - | SON | SOIC | QFN | - |
| 包装说明 | - | 3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8 | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | HVQCCN, LCC8,.06SQ,20 | - |
| 针数 | - | 8 | 8 | 8 | - |
| Reach Compliance Code | - | compli | compli | compli | - |
| 控制类型 | - | ENABLE LOW | ENABLE LOW | ENABLE LOW | - |
| 系列 | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | - |
| JESD-30 代码 | - | R-PDSO-N8 | S-PDSO-G8 | S-PQCC-N8 | - |
| JESD-609代码 | - | e4 | e4 | e4 | - |
| 长度 | - | 3 mm | 3 mm | 1.6 mm | - |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | - |
| 逻辑集成电路类型 | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | - |
| 最大I（ol） | - | 0.024 A | 0.024 A | 0.024 A | - |
| 湿度敏感等级 | - | 1 | 1 | 1 | - |
| 位数 | - | 1 | 1 | 1 | - |
| 功能数量 | - | 2 | 2 | 2 | - |
| 端口数量 | - | 2 | 2 | 2 | - |
| 端子数量 | - | 8 | 8 | 8 | - |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | - |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | - |
| 输出极性 | - | TRUE | TRUE | TRUE | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | VSON | TSSOP | HVQCCN | - |
| 封装等效代码 | - | SOLCC8,.11,20 | TSSOP8,.16 | LCC8,.06SQ,20 | - |
| 封装形状 | - | RECTANGULAR | SQUARE | SQUARE | - |
| 封装形式 | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - |
| 包装方法 | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | - |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V | - |
| Prop。Delay @ Nom-Su | - | 5.5 ns | 5.5 ns | 5.5 ns | - |
| 传播延迟（tpd） | - | 11.4 ns | 11.4 ns | 11.4 ns | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | - | 0.5 mm | 1.1 mm | 0.5 mm | - |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | - | 1.65 V | 1.65 V | 1.65 V | - |
| 标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | - |
| 表面贴装 | - | YES | YES | YES | - |
| 技术 | - | CMOS | CMOS | CMOS | - |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - |
| 端子面层 | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | - | NO LEAD | GULL WING | NO LEAD | - |
| 端子节距 | - | 0.5 mm | 0.65 mm | 0.5 mm | - |
| 端子位置 | - | DUAL | DUAL | QUAD | - |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | - |
| 宽度 | - | 2 mm | 3 mm | 1.6 mm | - |
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