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74HCT3G07DP

产品描述Triple buffer with open-drain outputs
产品类别逻辑    逻辑   
文件大小68KB,共13页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74HCT3G07DP概述

Triple buffer with open-drain outputs

74HCT3G07DP规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码SOIC
包装说明3 MM, PLASTIC, SOT505-2, TSSOP-8
针数8
Reach Compliance Codecompli
系列HCT
JESD-30 代码S-PDSO-G8
JESD-609代码e4
长度3 mm
负载电容(CL)50 pF
逻辑集成电路类型BUFFER
最大I(ol)0.004 A
湿度敏感等级1
功能数量3
输入次数1
端子数量8
最高工作温度125 °C
最低工作温度-40 °C
输出特性OPEN-DRAIN
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP8,.16
封装形状SQUARE
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源5 V
Prop。Delay @ Nom-Su32 ns
传播延迟(tpd)32 ns
认证状态Not Qualified
施密特触发器NO
座面最大高度1.1 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层NICKEL PALLADIUM GOLD
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度3 mm
Base Number Matches1

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74HC3G07; 74HCT3G07
Triple buffer with open-drain outputs
Rev. 02 — 12 May 2009
Product data sheet
1. General description
The 74HC3G07 and 74HCT3G07 are high-speed Si-gate CMOS devices. They provide
three buffers with open-drain outputs.
The outputs of the 74HC3G07 and 74HCT3G07 devices are open drains and can be
connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH
wired-AND functions. For digital operation this device must have a pull-up resistor to
establish a logic HIGH-level.
The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V.
The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
2. Features
I
I
I
I
I
Wide supply voltage range from 2.0 V to 6.0 V
High noise immunity
Low power dissipation
Multiple package options
ESD protection:
N
HBM JESD22-A114E exceeds 2000 V
N
MM JESD22-A115-A exceeds 200 V
I
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range Name
74HC3G07DP
74HCT3G07DP
74HC3G07DC
74HCT3G07DC
74HC3G07GD
74HCT3G07GD
−40 °C
to +125
°C
XSON8U
−40 °C
to +125
°C
VSSOP8
−40 °C
to +125
°C
TSSOP8
Description
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
Version
SOT505-2
Type number
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
plastic extremely thin small outline package; no leads; SOT996-2
8 terminals; UTLP based; body 3
×
2
×
0.5 mm

74HCT3G07DP相似产品对比

74HCT3G07DP 74HC3G07 74HC3G07GD 74HC3G07DC 74HC3G07DP 74HCT3G07 74HCT3G07DC 74HCT3G07GD
描述 Triple buffer with open-drain outputs Triple buffer with open-drain outputs Triple buffer with open-drain outputs Triple buffer with open-drain outputs Triple buffer with open-drain outputs Triple buffer with open-drain outputs Triple buffer with open-drain outputs Triple buffer with open-drain outputs
是否无铅 不含铅 - 不含铅 不含铅 不含铅 - 不含铅 不含铅
是否Rohs认证 符合 - 符合 符合 符合 - 符合 符合
厂商名称 NXP(恩智浦) - NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) - NXP(恩智浦) NXP(恩智浦)
零件包装代码 SOIC - SON TSSOP SOIC - TSSOP SON
包装说明 3 MM, PLASTIC, SOT505-2, TSSOP-8 - 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 3 MM, PLASTIC, SOT505-2, TSSOP-8 - 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8
针数 8 - 8 8 8 - 8 8
Reach Compliance Code compli - unknow compli compli - compli unknow
系列 HCT - HC/UH HC/UH HC/UH - HCT HCT
JESD-30 代码 S-PDSO-G8 - R-PDSO-N8 R-PDSO-G8 S-PDSO-G8 - R-PDSO-G8 R-PDSO-N8
JESD-609代码 e4 - e4 e4 e4 - e4 e4
长度 3 mm - 3 mm 2.3 mm 3 mm - 2.3 mm 3 mm
逻辑集成电路类型 BUFFER - BUFFER BUFFER BUFFER - BUFFER BUFFER
湿度敏感等级 1 - 1 1 1 - 1 1
功能数量 3 - 3 3 3 - 3 3
输入次数 1 - 1 1 1 - 1 1
端子数量 8 - 8 8 8 - 8 8
最高工作温度 125 °C - 125 °C 125 °C 125 °C - 125 °C 125 °C
最低工作温度 -40 °C - -40 °C -40 °C -40 °C - -40 °C -40 °C
输出特性 OPEN-DRAIN - OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN - OPEN-DRAIN OPEN-DRAIN
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP - VSON VSSOP TSSOP - VSSOP VSON
封装形状 SQUARE - RECTANGULAR RECTANGULAR SQUARE - RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
峰值回流温度(摄氏度) 260 - 260 260 260 - 260 260
传播延迟(tpd) 32 ns - 125 ns 125 ns 125 ns - 32 ns 32 ns
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
座面最大高度 1.1 mm - 0.5 mm 1 mm 1.1 mm - 1 mm 0.5 mm
最大供电电压 (Vsup) 5.5 V - 6 V 6 V 6 V - 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V - 2 V 2 V 2 V - 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V - 5 V 5 V 5 V - 5 V 5 V
表面贴装 YES - YES YES YES - YES YES
技术 CMOS - CMOS CMOS CMOS - CMOS CMOS
温度等级 AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
端子面层 NICKEL PALLADIUM GOLD - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
端子形式 GULL WING - NO LEAD GULL WING GULL WING - GULL WING NO LEAD
端子节距 0.65 mm - 0.5 mm 0.5 mm 0.65 mm - 0.5 mm 0.5 mm
端子位置 DUAL - DUAL DUAL DUAL - DUAL DUAL
处于峰值回流温度下的最长时间 30 - 30 30 30 - 30 30
宽度 3 mm - 2 mm 2 mm 3 mm - 2 mm 2 mm

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