16-channel analog multiplexer/demultiplexer
| 74HC4067 | 74HC4067BQ | 74HCT4067 | 74HCT4067N | 74HC4067N | 74HCT4067BQ | |
|---|---|---|---|---|---|---|
| 描述 | 16-channel analog multiplexer/demultiplexer | 16-channel analog multiplexer/demultiplexer | 16-channel analog multiplexer/demultiplexer | 16-Channel Analog Multiplexer | 16-channel analog multiplexer/demultiplexer | 16-channel analog multiplexer/demultiplexer |
| 是否无铅 | - | 含铅 | - | 不含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | - | 符合 | - | 符合 | 符合 | 符合 |
| 厂商名称 | - | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | - | QFN | - | DIP | DIP | QFN |
| 包装说明 | - | HVQCCN, LCC24/28,.14X.2,20 | - | 0.600 INCH, PLASTIC, MO-015, SC509-24, SOT101-1, DIP-24 | DIP, DIP24,.6 | HVQCCN, LCC24/28,.14X.2,20 |
| 针数 | - | 24 | - | 24 | 24 | 24 |
| Reach Compliance Code | - | compliant | - | unknown | compliant | compliant |
| 模拟集成电路 - 其他类型 | - | SINGLE-ENDED MULTIPLEXER | - | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | - | R-PQCC-N24 | - | R-PDIP-T24 | R-PDIP-T24 | R-PQCC-N24 |
| JESD-609代码 | - | e4 | - | e3 | e2 | e4 |
| 长度 | - | 5.5 mm | - | 31.7 mm | 31.7 mm | 5.5 mm |
| 信道数量 | - | 16 | - | 16 | 16 | 16 |
| 功能数量 | - | 1 | - | 1 | 1 | 1 |
| 端子数量 | - | 24 | - | 24 | 24 | 24 |
| 标称断态隔离度 | - | 50 dB | - | 50 dB | 50 dB | 50 dB |
| 通态电阻匹配规范 | - | 9 Ω | - | 9 Ω | 9 Ω | 9 Ω |
| 最大通态电阻 (Ron) | - | 180 Ω | - | 180 Ω | 180 Ω | 180 Ω |
| 最高工作温度 | - | 125 °C | - | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | HVQCCN | - | DIP | DIP | HVQCCN |
| 封装等效代码 | - | LCC24/28,.14X.2,20 | - | DIP24,.6 | DIP24,.6 | LCC24/28,.14X.2,20 |
| 封装形状 | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | IN-LINE | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | - | 260 | - | NOT SPECIFIED | NOT SPECIFIED | 260 |
| 电源 | - | 2/9 V | - | 5 V | 2/9 V | 5 V |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1 mm | - | 5.1 mm | 5.1 mm | 1 mm |
| 最大供电电流 (Isup) | - | 50 mA | - | 0.08 mA | 0.16 mA | 50 mA |
| 最大供电电压 (Vsup) | - | 10 V | - | 5.5 V | 10 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 2 V | - | 4.5 V | 2 V | 4.5 V |
| 标称供电电压 (Vsup) | - | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | - | YES | - | NO | NO | YES |
| 最长断开时间 | - | 435 ns | - | 90 ns | 435 ns | 90 ns |
| 最长接通时间 | - | 450 ns | - | 98 ns | 450 ns | 98 ns |
| 切换 | - | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | - | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | - | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Tin (Sn) | Tin/Silver (Sn/Ag) | NICKEL PALLADIUM GOLD |
| 端子形式 | - | NO LEAD | - | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子节距 | - | 0.5 mm | - | 2.54 mm | 2.54 mm | 0.5 mm |
| 端子位置 | - | QUAD | - | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | - | 30 | - | NOT SPECIFIED | NOT SPECIFIED | 30 |
| 宽度 | - | 3.5 mm | - | 15.24 mm | 15.24 mm | 3.5 mm |
| Base Number Matches | - | 1 | - | 1 | 1 | 1 |
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