Bus Driver, HC/UH Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20,
| 参数名称 | 属性值 |
| 厂商名称 | Harris |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| 系列 | HC/UH |
| JESD-30 代码 | R-CDFP-F20 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟（tpd） | 20 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子形式 | FLAT |
| 端子位置 | DUAL |
| HCS240K/SAMPLE | 5962R9580901VXC | 5962R9580901V9A | 5962R9580901VRC | HCS240HMSR | HCS240DMSR | HCS240KMSR | |
|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver, HC/UH Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, | Bus Driver, HC/UH Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, | Bus Driver, HC/UH Series, 2-Func, 4-Bit, Inverted Output, CMOS | Bus Driver, HC/UH Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, | Bus Driver, HC/UH Series, 2-Func, 4-Bit, Inverted Output, CMOS | Bus Driver, HC/UH Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDIP20, | Bus Driver, HC/UH Series, 2-Func, 4-Bit, Inverted Output, CMOS, CDFP20, |
| 包装说明 | , | , | DIE, | , | DIE, | DIP, DIP20,.3 | DFP, FL20,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-CDFP-F20 | R-CDFP-F20 | X-XUUC-N20 | R-CDIP-T20 | X-XUUC-N20 | R-CDIP-T20 | R-CDFP-F20 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | UNCASED CHIP | IN-LINE | UNCASED CHIP | IN-LINE | FLATPACK |
| 传播延迟（tpd） | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | FLAT | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT |
| 端子位置 | DUAL | DUAL | UPPER | DUAL | UPPER | DUAL | DUAL |
| 厂商名称 | Harris | - | - | Harris | - | Harris | Harris |
| JESD-609代码 | - | e4 | e0 | e4 | - | e0 | e0 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 温度等级 | - | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | - | GOLD | TIN LEAD | GOLD | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 总剂量 | - | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | - | 200k Rad(Si) V | 200k Rad(Si) V |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - | - |
| 封装代码 | - | - | DIE | - | DIE | DIP | DFP |
模拟电子
嵌入式系统
TI技术论坛
FPGA/CPLD
stm32/stm8
DIY/开源硬件专区
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
