Power Supply Support Circuit, Fixed, 1 Channel, CMOS, DIE
参数名称 | 属性值 |
厂商名称 | California Micro Devices |
零件包装代码 | DIE |
包装说明 | DIE, |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
可调阈值 | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | X-XUUC-N |
信道数量 | 1 |
功能数量 | 1 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | UNSPECIFIED |
封装代码 | DIE |
封装形状 | UNSPECIFIED |
封装形式 | UNCASED CHIP |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子位置 | UPPER |
CM1210X | CM1210FI | CM1210P | CM1210PI | CM1210S | CM1210SI | CM1210F | CM1210C | CM1210CI | |
---|---|---|---|---|---|---|---|---|---|
描述 | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, DIE | Power Management Circuit, CMOS, PDSO16 | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDIP8, PLASTIC, DIP-8 | Power Supply Support Circuit, Fixed, 3 Channel, CMOS, PDIP8, PLASTIC, DIP-8 | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO16, SOIC-16 | Power Supply Support Circuit, Fixed, 3 Channel, CMOS, PDSO16, SOIC-16 | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO16, EIAJ, SOIC-16 | Power Management Circuit, CMOS, CDSO16 | Power Management Circuit, CMOS, CDSO16 |
厂商名称 | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices |
包装说明 | DIE, | SOP, SO16(UNSPEC) | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SO16(UNSPEC) | SOP, SO16(UNSPEC) | SOP, SO16(UNSPEC) | SOP, SO16(UNSPEC) | SOP, SO16(UNSPEC) |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | X-XUUC-N | R-PDSO-G16 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-XDSO-G16 | R-XDSO-G16 |
最高工作温度 | 70 °C | 85 °C | 70 °C | 80 °C | 70 °C | 80 °C | 70 °C | 70 °C | 85 °C |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
封装代码 | DIE | SOP | DIP | DIP | SOP | SOP | SOP | SOP | SOP |
封装形状 | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | UNCASED CHIP | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | NO | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | OTHER | COMMERCIAL | OTHER | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子形式 | NO LEAD | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | UPPER | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
零件包装代码 | DIE | - | DIP | DIP | SOIC | SOIC | SOIC | - | - |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - |
可调阈值 | NO | - | NO | NO | NO | NO | NO | - | - |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - | - |
信道数量 | 1 | - | 1 | 3 | 1 | 3 | 1 | - | - |
功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | - | - |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | - | 16 | 8 | 8 | 16 | 16 | 16 | 16 | 16 |
封装等效代码 | - | SO16(UNSPEC) | DIP8,.3 | DIP8,.3 | SO16(UNSPEC) | SO16(UNSPEC) | SO16(UNSPEC) | SO16(UNSPEC) | SO16(UNSPEC) |
电源 | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
针数 | - | - | 8 | 8 | 16 | 16 | 16 | - | - |
峰值回流温度(摄氏度) | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved