BZM55B
SERIES
SURFACE MOUNT ZENER DIODES
VOLTAGE RANGE 2.4 to 75 Volts POWER 500 mWatt
FEATURES
* Planar Die construction
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly Processes
0.043(1.1)
MICRO-MELF
MECHANICAL DATA
* Case: Molded Glass MICRO-MELF
* Terminals: Solderable per MIL-STD-750, Method 2026
0.008(0.2)
0.008(0.2)
0.079(2.0)
0.071(1.8)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
o
C ambient temperature unless otherwise specified.
Resistive or inductive load.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Power Dissipation at T
A
= 25
O
C
Junction Temperature
Storage Temperature Range
Symbol
Value
500
-65 to +175
-65 to +175
Units
mW
O
P
TOT
T
J
T
S
O
Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.
Parameter
Thermal Resistance Junction to Ambient Air
Forward Voltage at I
F
= 200mA
Symbol
R
JA
V
F
Min.
--
--
Typ.
--
--
Max.
0.3
1.5
o
0.0 48(1.2)D I A.
0 .0 4 0 (1 .0 )
C
C
Units
C/mW
V
Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.
2018-12/62
REV: O
RATING AND CHARACTERISTICS CURVES (BZM55B SERIES)
500
400
300
200
100
P O W E R D I S S I PAT I O N , m Wa t t s
0
50
100
150
200
O
250
AMBIENT TEMPERATURE, C
FIG. 1 POWER DERATING CURVE
Vz (V)
30
Iz (mA)
50
40
30
20
10
0
5
10
15
20
25
Test Current
Iz = 5mA
27
24
20
22
15
12
11
9V1
6V8
5V6
5V1
4V7
4V3
3V9
3V3
2V4
Fig.2 BREAKDOWN CHARACTERISTICS
PACKAGING OF DIODE AND BRIDGE RECTIFIERS
REEL PACK
PACKAGE
PACKING
EA PER EA PER COMPONENT TAPE SPACE REEL DIA CARTON SIZE EA PER
GROSS
SPACE
INNER
REEL
CARTON WEIGHT(Kg)
CODE
(mm)
(mm)
(mm)
(mm)
BOX
-T
2,500
---
---
---
178
390*205*310
100,000
7.10
MICRO-MELF
嵌入式系统
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