1.5 Amp Output Current IGBT
Gate Drive Optocoupler
Technical Data
HCPL-T250
Features
• Input Threshold Current
(I
FLH
): 5 mA (Max.)
• Supply Current
(I
CC
): 11 mA (Max.)
• Supply Voltage
(V
CC
): 15-35 V
• Output Current
(I
O
):
±
0.5 A (Min.)
• Switching Time
(t
PLH
/t
PHL
): 0.5
µ
s (Max.)
• Isolation Voltage
(V
ISO
): 3750 Vrms (Min.)
• UL 1577 Recognized:
File No. E55361
• CSA Approved
• IEC/EN/DIN EN 60747-5-2
Approved with V
IORM
= 630
V
peak
• 8 kV/
µ
s Minimum Common
Mode Rejection (CMR) at
Vcm = 1500 V
• Creepage Distance: 7.4 mm.
Clearance: 7.1 mm.
Description
The HCPL-T250 contains GaAs
LED. The LED is optically
coupled to an integrated circuit
with a power output stage. This
optocoupler is ideally suited for
driving power IGBTs and
MOSFETs used in motor control
inverter applications. The high
operating voltage range of the
output stage provides the drive
voltages required by gate
controlled devices. The voltage
and current supplied by this
optocoupler makes it ideally
suited for directly driving IGBTs
with ratings up to 1200 V/25 A.
For IGBTs with higher ratings,
the HCPL-T250 can be used to
drive a discrete power stage
which drives the IGBT gate.
Functional Diagram
N/C
1
Q1
8
V
CC
V
O
V
O
V
EE
ANODE
CATHODE
N/C
2
3
7
6
Q2
4
SHIELD
5
Truth Table
LED
ON
OFF
V
out
LOW
HIGH
Ordering Information
Specify Part Number followed by
Option Number.
Example:
HCPL-T250 #XXXX
No Option = Standard DIP Package, 50 per tube.
060 = IEC/EN/DIN EN 60747-5-2 V
IORM
= 630 V
peak
Option, 50 per tube.
300 = Gull Wing Surface Mount Option, 50 per tube.
500 = Tape and Reel Packaging Option, 1000 per reel.
XXXE = Lead Free Option
Remarks: The notation “#” is used for existing products, while (new) products launched
since 15th July 2001 and lead free option will use “–”
Applications
• IGBT/MOSFET Gate Drive
• AC/Brushless DC Motor
Drives
• Industrial Inverters
• Switch Mode Power
Supplies
A 0.1
µF
bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component
to prevent damage and/or degradation which may be induced by ESD.
2
Package Outline Drawings
Standard DIP Package
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
DATE CODE
A T250
YYWW
PIN ONE
1.19 (0.047) MAX.
1
2
3
4
1.78 (0.070) MAX.
3.56 ± 0.13
(0.140 ± 0.005)
PIN ONE
4.70 (0.185) MAX.
5° TYP.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
0.254
+ 0.076
- 0.051
+ 0.003)
(0.010
- 0.002)
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Gull Wing Surface Mount Option 300
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
2.0 (0.080)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
t
p
T
p
T
L
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
TEMPERATURE
T
smax
T
smin
RAMP-DOWN
6 °C/SEC. MAX.
t
s
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
t
L
60 to 150 SEC.
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
4
Regulatory Information
The HCPL-T250 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
(Option 060 only)
Insulation and Safety Related
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
Symbol
L(101)
Value Units
7.1
mm
Conditions
Measured from input terminals to
output terminals, shortest distance through
air.
Measured from input terminals to
output terminals, shortest distance path
along body.
Insulation thickness between emitter
and detector; also known as distance
through insulation
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
L(102)
7.4
mm
0.08
mm
≥
175
IIIa
Volts
Absolute Maximum Ratings
(Compared with HCPL-3120)
Parameter
Operating Temperature
“High” Peak Output Current
“High” Peak Output Current
Storage Temperature
Average Input Current
Peak Transient Input Current
(<1
µs
Pulse Width, 300 pps)
Reverse Input Voltage
Supply Voltage
Output Voltage
Output Power Dissipation
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
T
A
I
OH(PEAK)
I
OL(PEAK)
T
S
I
F(AVG)
I
F(TRAN)
V
R
(V
CC
- V
EE
)
V
O
P
O
Units
°C
A
A
°C
mA
A
HCPL-3120
Min.
Max.
-40
100
2.5
2.5
-55
125
25
1.0
HCPL-T250
Min.
Max.
-20
85
1.5
1.5
-55
125
20
1.0
Note
1
2
V
5
5
V
0
35
0
35
V
0
V
CC
0
V
CC
mW
250
250
3
260°C for 10 sec., 1.6 mm below seating plane
See Package Outline Drawings section
Notes:
1. Maximum pulse width = 10
µs,
maximum duty cycle = 0.2%. See HCPL-3120 Applications section for additional details on limiting
I
OH(PEAK)
.
2. Derate linearly above 70°C free-air temperature at a rate of 0.3 mA/°C.
3. Derate lineraly above 70°C free-air temperature at a rate of 4.8 mW/°C.
5
Recommended Operating Conditions
Parameter
Power Supply Voltage
Input Current (ON)
Input Voltage (OFF)
Symbol
V
CC
- V
EE
I
F(ON)
V
F(OFF)
Min.
15
7
-3.0
Max.
30
16
0.8
Units
V
mA
V
DC Electrical Specifications
(Compared with HCPL-3120)
Over recommended operating conditions (I
F(ON)
= 7 to 16 mA, V
F(OFF)
= -3.0 to 0.8 V, V
CC
= 15 to 30 V,
V
EE
= Ground) unless otherwise specified.
Parameter
Input Forward
Voltage
Temperature
Coefficient of
Forward Voltage
Input Reverse
Current
Input Capacitance
High Level
Output Current
Low Level
Output Current
High Level
Output Voltage
Low Level
Output Voltage
Symbol
V
F
∆V
F
/∆T
A
Units
V
mV/
°C
HCPL-3120
Min.
Typ.* Max.
1.2
1.5
1.8
-1.6
HCPL-T250
Min.
Typ.* Max.
1.6
1.8
-2.0
Test
Conditions
I
F
= 10 mA
I
F
= 10 mA
Note
I
R
C
IN
I
OH
I
OL
V
OH
V
OL
µA
pF
A
A
V
V
0.5
2.0
0.5
2.0
V
CC
- 4
60
1.5
2.0
V
CC
- 3
10
60
0.5
N.A.
0.5
N.A.
V
CC
- 4
1.5
2.0
V
CC
- 3
10
250
V
R
= 5 V
V
F
= 0 V,
F = 1 MHz
V
O
V
O
V
O
V
O
= V
CC
- 4 V
= V
CC
- 15 V
= V
CC
- 4 V
= V
CC
- 15 V
I
O
= -100 mA
V
EE
+0.1 V
EE
+0.5
2.0
2.0
5
5
V
EE
+0.8 V
EE
+2.5 I
O
= 100 mA
7
7.5
11
11
Output Open
I
F
= 7 to 16 mA
Output Open
V
F
= -3.0 to
+0.8 V
I
O
= 0 mA,
V
O
> 5 V
High Level
I
CCH
mA
Supply CurrentntSupply
Current
Low Level
I
CCL
mA
Supply Current
Threshold Input
Current Low to
High
Threshold Input
Voltage High
to Low
Supply Voltage
Capacitance
(Input-Output)
Resistance
(Input-Output)
I
FLH
mA
2.3
5
1.2
5
V
FHL
V
0.8
0.8
V
CC
C
I-0
R
I-0
V
pF
Ω
15
0.6
10
12
30
15
1.0
10
12
30
*All typical values at T
A
= 25°C and V
CC
- V
EE
= 3° V, unless otherwise noted.
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