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74CBTLV1G125GV

产品描述CBTLV/3B SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5
产品类别逻辑    逻辑   
文件大小124KB,共18页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74CBTLV1G125GV概述

CBTLV/3B SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5

CBTLV/3B系列, 1位 驱动, 实输出, PDSO5

74CBTLV1G125GV规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码SC-74A
包装说明PLASTIC, SOT-753, SC-74A, 5 PIN
针数5
制造商包装代码SOT753
Reach Compliance Codecompli
系列CBTLV/3B
JESD-30 代码R-PDSO-G5
JESD-609代码e3
长度2.9 mm
逻辑集成电路类型BUS DRIVER
湿度敏感等级1
位数1
功能数量1
端口数量2
端子数量5
最高工作温度125 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSOP5/6,.11,37
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
电源2.5/3.3 V
传播延迟(tpd)0.39 ns
认证状态Not Qualified
座面最大高度1.1 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Tin (Sn)
端子形式GULL WING
端子节距0.95 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度1.5 mm
Base Number Matches1

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74CBTLV1G125
Single bus switch
Rev. 01 — 23 February 2007
Product data sheet
1. General description
The 74CBTLV1G125 is a high-performance, low-power, low-voltage, Si-gate CMOS
device, superior to most advanced CMOS compatible TTL families.
Schmitt trigger action at control input makes the circuit tolerant to slower input rise and fall
times across the entire V
CC
range from 2.3 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
The 74CBTLV1G125 provides a single high-speed line switch. The switch is disabled
when the output enable (OE) input is high.
To ensure the high-impedance OFF-state during power up or power down, OE should be
tied to the V
CC
through a pullup resistor. The minimum value of the resistor is determined
by the current-sinking capability of the driver.
2. Features
s
Supply voltage range from 2.3 V to 3.6 V
s
High noise immunity
s
Complies with JEDEC standard:
x
JESD8-5 (2.3 V to 2.7 V)
x
JESD8-B/JESD36 (2.7 V to 3.6 V)
s
ESD protection:
x
HBM JESD22-A114-D exceeds 2000 V
x
MM JESD22-A115-A exceeds 200 V
x
CDM JESD22-C101-C exceeds 1000 V
s
5
switch connection between two ports
s
Rail to rail switching on data I/O ports
s
CMOS low power consumption
s
Latch-up performance meets requirements of JESD78 Class I
s
I
OFF
circuitry provides partial power down mode operation
s
Multiple package options
s
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C

74CBTLV1G125GV相似产品对比

74CBTLV1G125GV 74CBTLV1G125 74CBTLV1G125GM 74CBTLV1G125GF 74CBTLV1G125GW
描述 CBTLV/3B SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5 CBTLV/3B SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5 CBTLV/3B SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5 CBTLV/3B SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5 CBTLV/3B SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5
系列 CBTLV/3B CBTLV/3B CBTLV/3B CBTLV/3B CBTLV/3B
位数 1 1 1 1 1
功能数量 1 1 1 1 1
端子数量 5 5 6 6 5
输出特性 3-STATE 3-ST 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE
表面贴装 YES Yes YES YES YES
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子形式 GULL WING GULL WING NO LEAD NO LEAD GULL WING
端子位置 DUAL DUAL DUAL DUAL
是否无铅 不含铅 - 不含铅 - 不含铅
是否Rohs认证 符合 - 符合 符合 符合
厂商名称 NXP(恩智浦) - NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 SC-74A - SON SON SON
包装说明 PLASTIC, SOT-753, SC-74A, 5 PIN - 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6 1.25 MM, PLASTIC, MO-252, SC-88A, SOT353-1, TSSOP-5
针数 5 - 6 6 5
Reach Compliance Code compli - compli compli compli
JESD-30 代码 R-PDSO-G5 - R-PDSO-N6 S-PDSO-N6 R-PDSO-G5
JESD-609代码 e3 - e3 e3 e3
长度 2.9 mm - 1.45 mm 1 mm 2.05 mm
逻辑集成电路类型 BUS DRIVER - BUS DRIVER BUS DRIVER BUS DRIVER
湿度敏感等级 1 - 1 1 1
端口数量 2 - 2 2 2
最高工作温度 125 °C - 125 °C 125 °C 125 °C
最低工作温度 -40 °C - -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP - VSON VSON TSSOP
封装等效代码 TSOP5/6,.11,37 - SOLCC6,.04,20 SOLCC6,.04,14 TSSOP5/6,.08
封装形状 RECTANGULAR - RECTANGULAR SQUARE RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 260 - 260 260 260
电源 2.5/3.3 V - 2.5/3.3 V 2.5/3.3 V 2.5/3.3 V
传播延迟(tpd) 0.39 ns - 0.39 ns 0.39 ns 0.39 ns
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified
座面最大高度 1.1 mm - 0.5 mm 0.5 mm 1.1 mm
最大供电电压 (Vsup) 3.6 V - 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.3 V - 2.3 V 2.3 V 2.3 V
标称供电电压 (Vsup) 3.3 V - 3.3 V 3.3 V 3.3 V
技术 CMOS - CMOS CMOS CMOS
端子面层 Tin (Sn) - Tin (Sn) Tin (Sn) Tin (Sn)
端子节距 0.95 mm - 0.5 mm 0.35 mm 0.65 mm
处于峰值回流温度下的最长时间 30 - 30 30 30
宽度 1.5 mm - 1 mm 1 mm 1.25 mm
Base Number Matches 1 - 1 1 1

 
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