电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

74AUP2G241DC

产品描述Low-power dual buffer/line driver; 3-state
产品类别逻辑    逻辑   
文件大小99KB,共22页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74AUP2G241DC概述

Low-power dual buffer/line driver; 3-state

74AUP2G241DC规格参数

参数名称属性值
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码TSSOP
包装说明2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8
针数8
Reach Compliance Codecompli
控制类型ENABLE LOW/HIGH
系列AUP/ULP/V
JESD-30 代码R-PDSO-G8
长度2.3 mm
负载电容(CL)30 pF
逻辑集成电路类型BUS DRIVER
最大I(ol)0.0017 A
湿度敏感等级1
位数1
功能数量2
端口数量2
端子数量8
最高工作温度125 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码VSSOP
封装等效代码TSSOP8,.12,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源1.2/3.3 V
Prop。Delay @ Nom-Su24 ns
传播延迟(tpd)24 ns
认证状态Not Qualified
座面最大高度1 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)0.8 V
标称供电电压 (Vsup)1.1 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度2 mm

文档预览

下载PDF文档
74AUP2G241
Low-power dual buffer/line driver; 3-state
Rev. 03 — 12 January 2009
Product data sheet
1. General description
The 74AUP2G241 provides a dual non-inverting buffer/line driver with 3-state outputs.
The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH
level at pin 1OE causes output 1Y to assume a high-impedance OFF-state. A LOW level
at pin 2OE causes output 2Y to assume a high-impedance OFF-state.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire V
CC
range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
This device has an input-disable feature, which allows floating input signals. The input 1A
is disabled when the output enable input 1OE is HIGH. The input 2A is disabled when the
output enable input 2OE is LOW.
2. Features
I
Wide supply voltage range from 0.8 V to 3.6 V
I
High noise immunity
I
Complies with JEDEC standards:
N
JESD8-12 (0.8 V to 1.3 V)
N
JESD8-11 (0.9 V to 1.65 V)
N
JESD8-7 (1.2 V to 1.95 V)
N
JESD8-5 (1.8 V to 2.7 V)
N
JESD8-B (2.7 V to 3.6 V)
I
ESD protection:
N
HBM JESD22-A114E Class 3A exceeds 5000 V
N
MM JESD22-A115-A exceeds 200 V
N
CDM JESD22-C101C exceeds 1000 V
I
Low static power consumption; I
CC
= 0.9
µA
(maximum)
I
Latch-up performance exceeds 100 mA per JESD 78 Class II
I
Inputs accept voltages up to 3.6 V
I
Low noise overshoot and undershoot < 10 % of V
CC
I
Input-disable feature allows floating input conditions
I
I
OFF
circuitry provides partial Power-down mode operation

74AUP2G241DC相似产品对比

74AUP2G241DC 74AUP2G241GD 74AUP2G241 74AUP2G241GT 74AUP2G241GM
描述 Low-power dual buffer/line driver; 3-state Low-power dual buffer/line driver; 3-state Low-power dual buffer/line driver; 3-state Low-power dual buffer/line driver; 3-state Low-power dual buffer/line driver; 3-state
是否Rohs认证 符合 符合 - 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) - NXP(恩智浦) NXP(恩智浦)
零件包装代码 TSSOP SON - SON QFN
包装说明 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 3 X 2 MM, 0.50 MM HEIGHT, PLASTC, SOT996-2, SON-8 - 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT833-1, SON-8 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8
针数 8 8 - 8 8
Reach Compliance Code compli compli - compli compli
控制类型 ENABLE LOW/HIGH ENABLE LOW/HIGH - ENABLE LOW/HIGH ENABLE LOW/HIGH
系列 AUP/ULP/V AUP/ULP/V - AUP/ULP/V AUP/ULP/V
JESD-30 代码 R-PDSO-G8 R-PDSO-N8 - R-PDSO-N8 S-PQCC-N8
长度 2.3 mm 3 mm - 1.95 mm 1.6 mm
负载电容(CL) 30 pF 30 pF - 30 pF 30 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER - BUS DRIVER BUS DRIVER
最大I(ol) 0.0017 A 0.0017 A - 0.0017 A 0.0017 A
湿度敏感等级 1 1 - 1 1
位数 1 1 - 1 1
功能数量 2 2 - 2 2
端口数量 2 2 - 2 2
端子数量 8 8 - 8 8
最高工作温度 125 °C 125 °C - 125 °C 125 °C
最低工作温度 -40 °C -40 °C - -40 °C -40 °C
输出特性 3-STATE 3-STATE - 3-STATE 3-STATE
输出极性 TRUE TRUE - TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VSSOP VSON - VSON VQCCN
封装等效代码 TSSOP8,.12,20 SOLCC8,.11,20 - SOLCC8,.04,20 LCC8,.06SQ,20
封装形状 RECTANGULAR RECTANGULAR - RECTANGULAR SQUARE
封装形式 SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE - SMALL OUTLINE, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE
包装方法 TAPE AND REEL TAPE AND REEL - TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) 260 260 - 260 260
电源 1.2/3.3 V 1.2/3.3 V - 1.2/3.3 V 1.2/3.3 V
Prop。Delay @ Nom-Su 24 ns 24 ns - 24 ns 24 ns
传播延迟(tpd) 24 ns 24 ns - 24 ns 24 ns
认证状态 Not Qualified Not Qualified - Not Qualified Not Qualified
座面最大高度 1 mm 0.5 mm - 0.5 mm 0.5 mm
最大供电电压 (Vsup) 3.6 V 3.6 V - 3.6 V 3.6 V
最小供电电压 (Vsup) 0.8 V 0.8 V - 0.8 V 0.8 V
标称供电电压 (Vsup) 1.1 V 1.1 V - 1.1 V 1.1 V
表面贴装 YES YES - YES YES
技术 CMOS CMOS - CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
端子形式 GULL WING NO LEAD - NO LEAD NO LEAD
端子节距 0.5 mm 0.5 mm - 0.5 mm 0.55 mm
端子位置 DUAL DUAL - DUAL QUAD
处于峰值回流温度下的最长时间 30 30 - 30 30
宽度 2 mm 2 mm - 1 mm 1.6 mm

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2618  2861  1745  1500  1555  44  52  26  15  11 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved