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74AUP2G157DC

产品描述Low-power 2-input multiplexer
产品类别逻辑    逻辑   
文件大小89KB,共20页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
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74AUP2G157DC概述

Low-power 2-input multiplexer

74AUP2G157DC规格参数

参数名称属性值
Source Url Status Check Date2013-06-14 00:00:00
是否无铅不含铅
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码TSSOP
包装说明VSSOP, TSSOP8,.12,20
针数8
Reach Compliance Codecompli
系列AUP/ULP/V
JESD-30 代码R-PDSO-G8
JESD-609代码e4
长度2.3 mm
负载电容(CL)30 pF
逻辑集成电路类型MULTIPLEXER
最大I(ol)0.0017 A
湿度敏感等级1
功能数量1
输入次数2
输出次数1
端子数量8
最高工作温度125 °C
最低工作温度-40 °C
输出极性COMPLEMENTARY
封装主体材料PLASTIC/EPOXY
封装代码VSSOP
封装等效代码TSSOP8,.12,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源1.2/3.3 V
Prop。Delay @ Nom-Su22.8 ns
传播延迟(tpd)22.8 ns
认证状态Not Qualified
座面最大高度1 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)0.8 V
标称供电电压 (Vsup)1.1 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度2 mm

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74AUP2G157
Low-power 2-input multiplexer
Rev. 03 — 2 July 2008
Product data sheet
1. General description
The 74AUP2G157 is a high-performance, low-power, low-voltage, Si-gate CMOS device,
superior to most advanced CMOS compatible TTL families.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire V
CC
range from 0.8 V to 3.6 V. This device ensures a very low
static and dynamic power consumption across the entire V
CC
range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
The 74AUP2G157 is a single 2-input multiplexer which select data from two data inputs
(I0 and I1) under control of a common data select input (S). The state of the common data
select input determines the particular register from which the data comes. The output
(Y, Y) presents the selected data in the true (non-inverted) and complement form. The
enable input (E) is active LOW. When E is HIGH, the output Y is forced LOW and the
output Y is forced HIGH regardless of all other input conditions.
2. Features
I
Wide supply voltage range from 0.8 V to 3.6 V
I
High noise immunity
I
Complies with JEDEC standards:
N
JESD8-12 (0.8 V to 1.3 V)
N
JESD8-11 (0.9 V to 1.65 V)
N
JESD8-7 (1.2 V to 1.95 V)
N
JESD8-5 (1.8 V to 2.7 V)
N
JESD8-B (2.7 V to 3.6 V)
I
ESD protection:
N
HBM JESD22-A114E Class 3A exceeds 5000 V
N
MM JESD22-A115-A exceeds 200 V
N
CDM JESD22-C101C exceeds 1000 V
I
Low static power consumption; I
CC
= 0.9
µA
(maximum)
I
Latch-up performance exceeds 100 mA per JESD 78 Class II
I
Inputs accept voltages up to 3.6 V
I
Low noise overshoot and undershoot < 10 % of V
CC
I
I
OFF
circuitry provides partial Power-down mode operation
I
Multiple package options
I
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C

74AUP2G157DC相似产品对比

74AUP2G157DC 74AUP2G157 74AUP2G157GM 74AUP2G157GD 74AUP2G157GT
描述 Low-power 2-input multiplexer Low-power 2-input multiplexer Low-power 2-input multiplexer Low-power 2-input multiplexer Low-power 2-input multiplexer
是否Rohs认证 符合 - 符合 符合 符合
厂商名称 NXP(恩智浦) - NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 TSSOP - QFN SON SON
包装说明 VSSOP, TSSOP8,.12,20 - 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8 VSON, SOLCC8,.11,20 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT883-1, SON-8
针数 8 - 8 8 8
Reach Compliance Code compli - compli compli compli
系列 AUP/ULP/V - AUP/ULP/V AUP/ULP/V AUP/ULP/V
JESD-30 代码 R-PDSO-G8 - S-PQCC-N8 R-PDSO-N8 R-PDSO-N8
JESD-609代码 e4 - - e4 e3
长度 2.3 mm - 1.6 mm 3 mm 1.95 mm
负载电容(CL) 30 pF - 30 pF 30 pF 30 pF
逻辑集成电路类型 MULTIPLEXER - MULTIPLEXER MULTIPLEXER MULTIPLEXER
最大I(ol) 0.0017 A - 0.0017 A 0.0017 A 0.0017 A
湿度敏感等级 1 - 1 1 1
功能数量 1 - 1 1 1
输入次数 2 - 2 2 2
输出次数 1 - 1 1 1
端子数量 8 - 8 8 8
最高工作温度 125 °C - 125 °C 125 °C 125 °C
最低工作温度 -40 °C - -40 °C -40 °C -40 °C
输出极性 COMPLEMENTARY - COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VSSOP - VQCCN VSON VSON
封装等效代码 TSSOP8,.12,20 - SOLCC8,.04,20 SOLCC8,.11,20 LCC8,.06SQ,20
封装形状 RECTANGULAR - SQUARE RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
包装方法 TAPE AND REEL - TAPE AND REEL TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) 260 - 260 260 260
电源 1.2/3.3 V - 1.2/3.3 V 1.2/3.3 V 1.2/3.3 V
Prop。Delay @ Nom-Su 22.8 ns - 22.8 ns 22.8 ns 22.8 ns
传播延迟(tpd) 22.8 ns - 22.8 ns 22.8 ns 22.8 ns
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified
座面最大高度 1 mm - 0.5 mm 0.5 mm 0.5 mm
最大供电电压 (Vsup) 3.6 V - 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 0.8 V - 0.8 V 0.8 V 0.8 V
标称供电电压 (Vsup) 1.1 V - 1.1 V 1.1 V 1.1 V
表面贴装 YES - YES YES YES
技术 CMOS - CMOS CMOS CMOS
温度等级 AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au) - - Nickel/Palladium/Gold (Ni/Pd/Au) Tin (Sn)
端子形式 GULL WING - NO LEAD NO LEAD NO LEAD
端子节距 0.5 mm - 0.5 mm 0.5 mm 0.5 mm
端子位置 DUAL - QUAD DUAL DUAL
处于峰值回流温度下的最长时间 30 - 30 30 30
宽度 2 mm - 1.6 mm 2 mm 1 mm

 
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