ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, CDIP18, CERAMIC, DIP-18
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Spectrum Microwave |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP18,.3 |
| 针数 | 18 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 最大模拟输入电压 | 7.5 V |
| 最小模拟输入电压 | -0.5 V |
| 最长转换时间 | 0.022 µs |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | R-CDIP-T18 |
| JESD-609代码 | e0 |
| 长度 | 22.86 mm |
| 最大线性误差 (EL) | 1.56% |
| 模拟输入通道数量 | 1 |
| 位数 | 6 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP18,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 采样速率 | 50 MHz |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 最大压摆率 | 50 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| MN5906CDH/B | MN5906CDE | MN5906PDE | MN5906PD | MN5906CDH | MN5906CD | |
|---|---|---|---|---|---|---|
| 描述 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, CDIP18, CERAMIC, DIP-18 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, CDIP18, CERAMIC, DIP-18 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, PDIP18, PLASTIC, DIP-18 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, PDIP18, PLASTIC, DIP-18 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, CDIP18, CERAMIC, DIP-18 | ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, CDIP18, CERAMIC, DIP-18 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 |
| 针数 | 18 | 18 | 18 | 18 | 18 | 18 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | 3A001.A.2.C | EAR99 | EAR99 | EAR99 | 3A001.A.2.C | EAR99 |
| 最大模拟输入电压 | 7.5 V | 7.5 V | 7.5 V | 7.5 V | 7.5 V | 7.5 V |
| 最小模拟输入电压 | -0.5 V | -0.5 V | -0.5 V | -0.5 V | -0.5 V | -0.5 V |
| 最长转换时间 | 0.022 µs | 0.022 µs | 0.022 µs | 0.022 µs | 0.022 µs | 0.022 µs |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | R-CDIP-T18 | R-CDIP-T18 | R-PDIP-T18 | R-PDIP-T18 | R-CDIP-T18 | R-CDIP-T18 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 22.86 mm | 22.86 mm | 22.48 mm | 22.48 mm | 22.86 mm | 22.86 mm |
| 最大线性误差 (EL) | 1.56% | 1.56% | 1.56% | 1.56% | 1.56% | 1.56% |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 6 | 6 | 6 | 6 | 6 | 6 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 18 | 18 | 18 | 18 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 70 °C | 125 °C | 70 °C |
| 最低工作温度 | -55 °C | -25 °C | -25 °C | - | -55 °C | - |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| 最大压摆率 | 50 mA | 50 mA | 50 mA | 50 mA | 50 mA | 50 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | OTHER | OTHER | COMMERCIAL | MILITARY | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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