Inverter
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | SOIC |
包装说明 | 3 MM, PLASTIC, SOT505-2, TSSOP-8 |
针数 | 8 |
Reach Compliance Code | compli |
系列 | AHCT/VHCT/VT |
JESD-30 代码 | S-PDSO-G8 |
JESD-609代码 | e4 |
长度 | 3 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | INVERTER |
最大I(ol) | 0.008 A |
湿度敏感等级 | 1 |
功能数量 | 3 |
输入次数 | 1 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP8,.16 |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
包装方法 | TAPE AND REEL |
峰值回流温度(摄氏度) | 260 |
电源 | 5 V |
Prop。Delay @ Nom-Su | 10 ns |
传播延迟(tpd) | 10 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
座面最大高度 | 1.1 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 3 mm |
Base Number Matches | 1 |
74AHCT3G04DP | 74AHC3G04 | 74AHC3G04DP | 74AHC3G04DC | 74AHC3G04GD | 74AHCT3G04 | 74AHCT3G04DC | 74AHCT3G04GD | |
---|---|---|---|---|---|---|---|---|
描述 | Inverter | Inverter | Inverter | Inverter | Inverter | Inverter | Inverter | Inverter |
是否无铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | - | 符合 | 符合 |
厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | SOIC | - | SOIC | TSSOP | SON | - | TSSOP | SON |
包装说明 | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | - | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 | 3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8 | - | VSSOP, TSSOP8,.12,20 | 3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8 |
针数 | 8 | - | 8 | 8 | 8 | - | 8 | 8 |
Reach Compliance Code | compli | - | compli | compli | compli | - | compli | compli |
系列 | AHCT/VHCT/VT | - | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V | - | AHCT/VHCT/VT | AHCT/VHCT/VT |
JESD-30 代码 | S-PDSO-G8 | - | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | - | R-PDSO-G8 | R-PDSO-N8 |
JESD-609代码 | e4 | - | e4 | e4 | e4 | - | e4 | e4 |
长度 | 3 mm | - | 3 mm | 2.3 mm | 3 mm | - | 2.3 mm | 3 mm |
负载电容(CL) | 50 pF | - | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF |
逻辑集成电路类型 | INVERTER | - | INVERTER | INVERTER | INVERTER | - | INVERTER | INVERTER |
最大I(ol) | 0.008 A | - | 0.008 A | 0.008 A | 0.008 A | - | 0.008 A | 0.008 A |
湿度敏感等级 | 1 | - | 1 | 1 | 1 | - | 1 | 1 |
功能数量 | 3 | - | 3 | 3 | 3 | - | 3 | 3 |
输入次数 | 1 | - | 1 | 1 | 1 | - | 1 | 1 |
端子数量 | 8 | - | 8 | 8 | 8 | - | 8 | 8 |
最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | - | TSSOP | VSSOP | VSON | - | VSSOP | VSON |
封装等效代码 | TSSOP8,.16 | - | TSSOP8,.16 | TSSOP8,.12,20 | SOLCC8,.11,20 | - | TSSOP8,.12,20 | SOLCC8,.11,20 |
封装形状 | SQUARE | - | SQUARE | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE |
包装方法 | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL |
峰值回流温度(摄氏度) | 260 | - | 260 | 260 | 260 | - | 260 | 260 |
电源 | 5 V | - | 2/5.5 V | 2/5.5 V | 2/5.5 V | - | 5 V | 5 V |
Prop。Delay @ Nom-Su | 10 ns | - | 9.5 ns | 9.5 ns | 9.5 ns | - | 10 ns | 10 ns |
传播延迟(tpd) | 10 ns | - | 14.5 ns | 14.5 ns | 14.5 ns | - | 10 ns | 10 ns |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
施密特触发器 | NO | - | NO | NO | NO | - | NO | NO |
座面最大高度 | 1.1 mm | - | 1.1 mm | 1 mm | 0.5 mm | - | 1 mm | 0.5 mm |
最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | - | 2 V | 2 V | 2 V | - | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | - | 5 V | 5 V |
表面贴装 | YES | - | YES | YES | YES | - | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS | - | CMOS | CMOS |
温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING | - | GULL WING | GULL WING | NO LEAD | - | GULL WING | NO LEAD |
端子节距 | 0.65 mm | - | 0.65 mm | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.5 mm |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | - | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 30 | - | 30 | 30 |
宽度 | 3 mm | - | 3 mm | 2 mm | 2 mm | - | 2 mm | 2 mm |
Base Number Matches | 1 | - | 1 | 1 | 1 | - | 1 | 1 |
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