Dual buffer/line driver; 3-state
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | TSSOP |
| 包装说明 | VSSOP, TSSOP8,.12,20 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| 控制类型 | ENABLE HIGH |
| 系列 | AHCT/VHCT/VT |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 2.3 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.008 A |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSSOP |
| 封装等效代码 | TSSOP8,.12,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Su | 9.5 ns |
| 传播延迟（tpd） | 9.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 2 mm |
| Base Number Matches | 1 |
| 74AHCT2G126DC | 74AHC2G126DP | 74AHC2G126 | 74AHC2G126DC | 74AHC2G126GD | 74AHCT2G126 | 74AHCT2G126DP | 74AHCT2G126GD | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Dual buffer/line driver; 3-state | Dual buffer/line driver; 3-state | Dual buffer/line driver; 3-state | Dual buffer/line driver; 3-state | Dual buffer/line driver; 3-state | Dual buffer/line driver; 3-state | Dual buffer/line driver; 3-state | Dual buffer/line driver; 3-state |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | - | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | TSSOP | SOIC | - | TSSOP | SON | - | SOIC | SON |
| 包装说明 | VSSOP, TSSOP8,.12,20 | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | - | 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 | VSON, SOLCC8,.11,20 | - | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | VSON, SOLCC8,.11,20 |
| 针数 | 8 | 8 | - | 8 | 8 | - | 8 | 8 |
| Reach Compliance Code | compli | compli | - | compli | compli | - | compli | compli |
| 控制类型 | ENABLE HIGH | ENABLE HIGH | - | ENABLE HIGH | ENABLE HIGH | - | ENABLE HIGH | ENABLE HIGH |
| 系列 | AHCT/VHCT/VT | AHC/VHC/H/U/V | - | AHC/VHC/H/U/V | AHC/VHC/H/U/V | - | AHCT/VHCT/VT | AHCT/VHCT/VT |
| JESD-30 代码 | R-PDSO-G8 | S-PDSO-G8 | - | R-PDSO-G8 | R-PDSO-N8 | - | S-PDSO-G8 | R-PDSO-N8 |
| JESD-609代码 | e4 | e4 | - | e4 | e4 | - | e4 | e4 |
| 长度 | 2.3 mm | 3 mm | - | 2.3 mm | 3 mm | - | 3 mm | 3 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.008 A | 0.008 A | - | 0.008 A | 0.008 A | - | 0.008 A | 0.008 A |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | - | 1 | 1 |
| 位数 | 1 | 1 | - | 1 | 1 | - | 1 | 1 |
| 功能数量 | 2 | 2 | - | 2 | 2 | - | 2 | 2 |
| 端口数量 | 2 | 2 | - | 2 | 2 | - | 2 | 2 |
| 端子数量 | 8 | 8 | - | 8 | 8 | - | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | - | 125 °C | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | - | TRUE | TRUE | - | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VSSOP | TSSOP | - | VSSOP | VSON | - | TSSOP | VSON |
| 封装等效代码 | TSSOP8,.12,20 | TSSOP8,.16 | - | TSSOP8,.12,20 | SOLCC8,.11,20 | - | TSSOP8,.16 | SOLCC8,.11,20 |
| 封装形状 | RECTANGULAR | SQUARE | - | RECTANGULAR | RECTANGULAR | - | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE |
| 包装方法 | TAPE AND REEL | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 | 260 | - | 260 | 260 | - | 260 | 260 |
| 电源 | 5 V | 2/5.5 V | - | 2/5.5 V | 2/5.5 V | - | 5 V | 5 V |
| Prop。Delay @ Nom-Su | 9.5 ns | 9.5 ns | - | 9.5 ns | 9.5 ns | - | 9.5 ns | 9.5 ns |
| 传播延迟（tpd） | 9.5 ns | 14.5 ns | - | 14.5 ns | 14.5 ns | - | 9.5 ns | 9.5 ns |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1.1 mm | - | 1 mm | 0.5 mm | - | 1.1 mm | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 2 V | - | 2 V | 2 V | - | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | YES | YES | - | YES | YES | - | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | - | GULL WING | NO LEAD | - | GULL WING | NO LEAD |
| 端子节距 | 0.5 mm | 0.65 mm | - | 0.5 mm | 0.5 mm | - | 0.65 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | 30 | 30 | - | 30 | 30 |
| 宽度 | 2 mm | 3 mm | - | 2 mm | 2 mm | - | 3 mm | 2 mm |
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