Datasheet> 器件分类 > 逻辑> 逻辑> 74AHC2G241DC

文档预览

74AHC2G241DC: 产品描述Dual buffer/line driver; 3-state; 产品类别逻辑逻辑; 文件大小78KB，共16页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

下载文档详细参数选型对比全文预览

74AHC2G241DC概述

Dual buffer/line driver; 3-state

74AHC2G241DC规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	TSSOP
包装说明	VSSOP, TSSOP8,.12,20
针数	8
Reach Compliance Code	compli
控制类型	ENABLE LOW/HIGH
系列	AHC/VHC/H/U/V
JESD-30 代码	R-PDSO-G8
JESD-609代码	e4
长度	2.3 mm
负载电容（CL）	50 pF
逻辑集成电路类型	BUS DRIVER
最大I（ol）	0.008 A
湿度敏感等级	1
位数	1
功能数量	2
端口数量	2
端子数量	8
最高工作温度	125 °C
最低工作温度	-40 °C
输出特性	3-STATE
输出极性	TRUE
封装主体材料	PLASTIC/EPOXY
封装代码	VSSOP
封装等效代码	TSSOP8,.12,20
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
包装方法	TAPE AND REEL
峰值回流温度（摄氏度）	260
电源	2/5.5 V
Prop。Delay @ Nom-Su	9.5 ns
传播延迟（tpd）	14.5 ns
认证状态	Not Qualified
座面最大高度	1 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式	GULL WING
端子节距	0.5 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	2 mm

文档预览

下载PDF文档

全文
预览

74AHC2G241; 74AHCT2G241

Dual buffer/line driver; 3-state

Rev. 02 — 13 January 2009

Product data sheet

1. General description

The 74AHC2G241; 74AHCT2G241 is a high-speed Si-gate CMOS device.

The 74AHC2G241; 74AHCT2G241 is a dual non-inverting buffer/line driver with 3-state

outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A

HIGH level at pin 1OE causes output 1Y to assume a high-impedance OFF-state. A LOW

level at pin 2OE causes output 2Y to assume a high-impedance OFF-state.

Schmitt-trigger action at all inputs makes the circuit highly tolerant for slower input rise

and fall times.

2. Features

Symmetrical output impedance

High noise immunity

ESD protection:

HBM JESD22-A114E: exceeds 2000 V

MM JESD22-A115-A: exceeds 200 V

CDM JESD22-C101C: exceeds 1000 V

Low power dissipation

Balanced propagation delays

Multiple package options

Speciﬁed from

−40 °C

to +85

°C

and from

−40 °C

to +125

°C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range Name

74AHC2G241DP

74AHCT2G241DP

74AHC2G241DC

74AHCT2G241DC

74AHC2G241GD

74AHCT2G241GD

−40 °C

to +125

°C

XSON8U

−40 °C

to +125

°C

VSSOP8

−40 °C

to +125

°C

TSSOP8

Description

plastic thin shrink small outline package; 8 leads;

body width 3 mm; lead length 0.5 mm

Version

SOT505-2

Type number

plastic very thin shrink small outline package; 8 leads; SOT765-1

body width 2.3 mm

plastic extremely thin small outline package; no leads; SOT996-2

8 terminals; UTLP based; body 3

0.5 mm

74AHC2G241DC相似产品对比

	74AHC2G241DC	74AHC2G241	74AHC2G241GD	74AHC2G241DP	74AHCT2G241	74AHCT2G241DC	P6SMBF11A	74AHCT2G241GD
描述	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Dual buffer/line driver; 3-state	Surface mounttransient voltage suppressor power 600watts	Dual buffer/line driver; 3-state
是否无铅	不含铅	-	不含铅	不含铅	-	不含铅	-	不含铅
是否Rohs认证	符合	-	符合	符合	-	符合	-	符合
厂商名称	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)	-	NXP(恩智浦)	-	NXP(恩智浦)
零件包装代码	TSSOP	-	SON	SOIC	-	TSSOP	-	SON
包装说明	VSSOP, TSSOP8,.12,20	-	3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT-996-2, UTLP-8	3 MM WIDTH, PLASTIC, SOT-505-2, TSSOP-8	-	2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8	-	VSON, SOLCC8,.11,20
针数	8	-	8	8	-	8	-	8
Reach Compliance Code	compli	-	compli	compli	-	compliant	-	compliant
控制类型	ENABLE LOW/HIGH	-	ENABLE LOW/HIGH	ENABLE LOW/HIGH	-	ENABLE LOW/HIGH	-	ENABLE LOW/HIGH
系列	AHC/VHC/H/U/V	-	AHC/VHC/H/U/V	AHC/VHC/H/U/V	-	AHCT/VHCT/VT	-	AHCT/VHCT/VT
JESD-30 代码	R-PDSO-G8	-	R-PDSO-N8	S-PDSO-G8	-	R-PDSO-G8	-	R-PDSO-N8
JESD-609代码	e4	-	e4	e4	-	e4	-	e4
长度	2.3 mm	-	3 mm	3 mm	-	2.3 mm	-	3 mm
负载电容（CL）	50 pF	-	50 pF	50 pF	-	50 pF	-	50 pF
逻辑集成电路类型	BUS DRIVER	-	BUS DRIVER	BUS DRIVER	-	BUS DRIVER	-	BUS DRIVER
最大I（ol）	0.008 A	-	0.008 A	0.008 A	-	0.008 A	-	0.008 A
湿度敏感等级	1	-	1	1	-	1	-	1
位数	1	-	1	1	-	1	-	1
功能数量	2	-	2	2	-	2	-	2
端口数量	2	-	2	2	-	2	-	2
端子数量	8	-	8	8	-	8	-	8
最高工作温度	125 °C	-	125 °C	125 °C	-	125 °C	-	125 °C
最低工作温度	-40 °C	-	-40 °C	-40 °C	-	-40 °C	-	-40 °C
输出特性	3-STATE	-	3-STATE	3-STATE	-	3-STATE	-	3-STATE
输出极性	TRUE	-	TRUE	TRUE	-	TRUE	-	TRUE
封装主体材料	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY
封装代码	VSSOP	-	VSON	TSSOP	-	VSSOP	-	VSON
封装等效代码	TSSOP8,.12,20	-	SOLCC8,.11,20	TSSOP8,.16	-	TSSOP8,.12,20	-	SOLCC8,.11,20
封装形状	RECTANGULAR	-	RECTANGULAR	SQUARE	-	RECTANGULAR	-	RECTANGULAR
封装形式	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, VERY THIN PROFILE
峰值回流温度（摄氏度）	260	-	260	260	-	260	-	260
电源	2/5.5 V	-	2/5.5 V	2/5.5 V	-	5 V	-	5 V
传播延迟（tpd）	14.5 ns	-	14.5 ns	14.5 ns	-	9.5 ns	-	9.5 ns
认证状态	Not Qualified	-	Not Qualified	Not Qualified	-	Not Qualified	-	Not Qualified
座面最大高度	1 mm	-	0.5 mm	1.1 mm	-	1 mm	-	0.5 mm
最大供电电压 (Vsup)	5.5 V	-	5.5 V	5.5 V	-	5.5 V	-	5.5 V
最小供电电压 (Vsup)	2 V	-	2 V	2 V	-	4.5 V	-	4.5 V
标称供电电压 (Vsup)	5 V	-	5 V	5 V	-	5 V	-	5 V
表面贴装	YES	-	YES	YES	-	YES	-	YES
技术	CMOS	-	CMOS	CMOS	-	CMOS	-	CMOS
温度等级	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	-	AUTOMOTIVE	-	AUTOMOTIVE
端子面层	Nickel/Palladium/Gold (Ni/Pd/Au)	-	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	-	NICKEL PALLADIUM GOLD	-	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式	GULL WING	-	NO LEAD	GULL WING	-	GULL WING	-	NO LEAD
端子节距	0.5 mm	-	0.5 mm	0.65 mm	-	0.5 mm	-	0.5 mm
端子位置	DUAL	-	DUAL	DUAL	-	DUAL	-	DUAL
处于峰值回流温度下的最长时间	30	-	30	30	-	30	-	30
宽度	2 mm	-	2 mm	3 mm	-	2 mm	-	2 mm

74AHC2G241DC

74AHC2G241DC概述

74AHC2G241DC规格参数

文档预览

74AHC2G241DC相似产品对比

推荐资源