1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, MICRO, SOP-10
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | SOIC |
包装说明 | MICRO, SOP-10 |
针数 | 10 |
Reach Compliance Code | unknown |
可调阈值 | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | S-PDSO-G10 |
JESD-609代码 | e0 |
长度 | 3 mm |
湿度敏感等级 | 1 |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 10 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 240 |
座面最大高度 | 1.1 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 3 mm |
MAX1823EUB | MAX1823EUB+ | MAX1823AEUB | MAX1823HEUB | MAX1823HEUB+ | MAX1823HEUB+T | |
---|---|---|---|---|---|---|
描述 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, MICRO, SOP-10 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, LEAD FREE, MICRO, SOP-10 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, MICRO, SOP-10 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, MICRO, SOP-10 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, LEAD FREE, MICRO, SOP-10 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, LEAD FREE, MICRO, SOP-10 |
是否无铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 |
是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 符合 | 符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
包装说明 | MICRO, SOP-10 | LEAD FREE, MICRO, SOP-10 | MICRO, SOP-10 | MICRO, SOP-10 | LEAD FREE, MICRO, SOP-10 | LEAD FREE, MICRO, SOP-10 |
针数 | 10 | 10 | 10 | 10 | 10 | 10 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
可调阈值 | NO | NO | NO | NO | NO | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 |
JESD-609代码 | e0 | e3 | e0 | e0 | e3 | e3 |
长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 10 | 10 | 10 | 10 | 10 | 10 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 240 | 260 | 240 | 240 | 260 | 260 |
座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | MATTE TIN | TIN LEAD | TIN LEAD | TIN | MATTE TIN |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 20 | NOT SPECIFIED | 20 | 20 | 30 | NOT SPECIFIED |
宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
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