Interface Circuit, BICMOS, 5 X 4 MM, UCSP-20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | BGA |
| 包装说明 | 5 X 4 MM, UCSP-20 |
| 针数 | 20 |
| Reach Compliance Code | not_compliant |
| 接口集成电路类型 | INTERFACE CIRCUIT |
| JESD-30 代码 | R-XBGA-B20 |
| JESD-609代码 | e0 |
| 湿度敏感等级 | 1 |
| 功能数量 | 8 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA20,4X5,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | 1.8/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.67 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 1.2 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn63Pb37) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| MAX3010EBP | MAX3001EEBP | MAX3006EBP | MAX3000EEBP | MAX3002EBP | MAX3002EBP+ | |
|---|---|---|---|---|---|---|
| 描述 | Interface Circuit, BICMOS, 5 X 4 MM, UCSP-20 | Interface Circuit, BICMOS, PBGA20 | Interface Circuit, BICMOS, 5 X 4 MM, UCSP-20 | Interface Circuit, BICMOS, PBGA20 | Interface Circuit, BICMOS, PBGA20, UCSP-20 | Interface Circuit, BICMOS, PBGA20, UCSP-20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 |
| Reach Compliance Code | not_compliant | _compli | not_compliant | not_compliant | not_compliant | compliant |
| JESD-30 代码 | R-XBGA-B20 | R-PBGA-B20 | R-XBGA-B20 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | FBGA | VFBGA | FBGA | VFBGA | VFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 包装说明 | 5 X 4 MM, UCSP-20 | - | 5 X 4 MM, UCSP-20 | - | UCSP-20 | VFBGA, |
| 接口集成电路类型 | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e1 |
| 湿度敏感等级 | 1 | 1 | 1 | - | 1 | 1 |
| 功能数量 | 8 | - | 8 | - | 1 | 1 |
| 封装等效代码 | BGA20,4X5,20 | BGA20,4X5,20 | BGA20,4X5,20 | BGA20,4X5,20 | - | - |
| 电源 | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 座面最大高度 | 0.67 mm | - | 0.67 mm | - | 0.67 mm | 0.67 mm |
| 最大供电电压 | 5.5 V | - | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 | 1.2 V | - | 1.2 V | - | 1.2 V | 1.2 V |
| 端子面层 | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | - | Tin/Lead (Sn63Pb37) | Tin/Silver/Copper (Sn/Ag/Cu) |
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