Line Driver/Receiver, 4 Driver, BIPolar, CDFP16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| 差分输出 | YES |
| 驱动器位数 | 4 |
| 高电平输入电流最大值 | 0.00002 A |
| JESD-30 代码 | R-XDFP-F16 |
| JESD-609代码 | e0 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最小输出摆幅 | 2 V |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC |
| 封装代码 | DFP |
| 封装等效代码 | FL16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 最大传输延迟 | 20 ns |
| DS26LS31MW/883 | AM26LS31/B2A | AM26LS31/BFA | AM26LS31MF | DS26LS31MJ/883 | |
|---|---|---|---|---|---|
| 描述 | Line Driver/Receiver, 4 Driver, BIPolar, CDFP16 | Line Driver/Receiver, 4 Driver, BIPolar, CQCC20 | Line Driver/Receiver, 4 Driver, BIPolar, CDFP16 | Line Driver/Receiver, 4 Driver, BIPolar, CDIP16, | Line Driver/Receiver, 4 Driver, BIPolar, CDIP16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DFP, FL16,.3 | QCCN, LCC20,.35SQ | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 差分输出 | YES | YES | YES | YES | YES |
| 驱动器位数 | 4 | 4 | 4 | 4 | 4 |
| 高电平输入电流最大值 | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A |
| JESD-30 代码 | R-XDFP-F16 | S-XQCC-N20 | R-XDFP-F16 | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 16 | 20 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 最小输出摆幅 | 2 V | 2 V | 2 V | 2 V | 2 V |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DFP | QCCN | DFP | DIP | DIP |
| 封装等效代码 | FL16,.3 | LCC20,.35SQ | FL16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | CHIP CARRIER | FLATPACK | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | NO LEAD | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL |
| 最大传输延迟 | 20 ns | 30 ns | 30 ns | 20 ns | 20 ns |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B |
| Base Number Matches | - | 1 | 1 | 1 | - |
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