19-5258; Rev 0; 4/10
1-Wire and SPI Authentication Microcontroller
General Description
The MAXQ1004 is a low-power microcontroller that
integrates a 10-bit ADC, 1-Wire
M
slave interface, SPIK,
AES encryption, random-number generator (RNG), and
temperature sensor with a 16-bit MAXQ
M
pipelined CPU.
Performance bandwidth is sufficient to handle master
or slave challenge-response authentication in portable
devices.
The device incorporates 16KB of flash memory and 640B
of RAM. Factory programming of a customer secret key
is available upon request. The microcontroller runs within
a wide 1.7V to 3.6V operating range.
For the ultimate in low-power performance, an ultra-low-
power stop mode (300nA typ) is available. In this mode,
only a minimum amount of circuitry is powered to sup-
port detection of the start of a 1-Wire transaction. When
1-Wire activity is detected, the microcontroller is turned
on and the command is executed in an atomic fashion.
This allows for stateless operation between commands,
providing the highest reliability and lowest power con-
sumption.
Features
S
High-Performance, Low-Power, 16-Bit MAXQ20
RISC Core
S
6MHz Operation from an Internal Oscillator,
MAXQ1004
Approaching 1MIPS per MHz
S
1.7V to 3.6V Wide Operating Voltage
S
Three Independent Data Pointers Accelerate Data
Movement with Automatic Increment/Decrement
S
Up to Eight General-Purpose I/O Pins
S
16-Level Hardware Stack
S
Optimized for C-Compiler (High-Speed/Density Code)
S
Memory
16KB Flash Memory, In-Application Programmable
640B of Data RAM
4KB of ROM
JTAG/TAP Bootloader Mode for In-System
Programming
S
Peripheral Features
Applications
Portable Electronics
Battery Chargers
Battery Packs
10-Bit Delta-Sigma ADC, Internal Reference
1-Wire Slave Interface
On-Chip Power-On Reset (POR)/Power-Fail Reset
Overvoltage Detection
Programmable Watchdog Timer
Built-In Temperature Sensor, ±6NC
S
Secure Programming Interface
Ordering Information
PART
MAXQ1004-B01+
TEMP
RANGE
-40°C to
+85°C
AES
ENCRYPTION
Yes
PIN-
PACKAGE
16 TQFN-
EP*
Flash Programming Through Secure ROM Loader
Secret Key Destruction on Mass Erase
Permanent Loader Lockout Option
Code and Secret Scrambling
S
Unique 64-Bit Serial Number
S
Low-Power Consumption
+Denotes
a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
300nA (typ) in Stop Mode
3.75mA (typ) at 6MHz, 0.8mA (typ) at 1 MHz
Low-Power Divide-by Modes (2, 4, 8, 256)
1-Wire/Interrupt Activity Detector
1-Wire and MAXQ are registered trademarks of Maxim
Integrated Products, Inc.
SPI is a trademark of Motorola, Inc.
Note:
Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, go to:
www.maxim-ic.com/errata.
_______________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
1-Wire and SPI Authentication Microcontroller
MAXQ1004
TABLE OF CONTENTS
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
10-Bit ADC Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
SPI Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
SPI Master Communications Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
SPI Slave Communications Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
MAXQ Core Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Utility ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Loading Flash Memory with the Bootstrap Loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
In-Application Flash Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Code Scrambling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Nanopower Ring Wake-Up Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Serial Number/Device ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Hardware AES Engine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
16-Bit Timer/Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Serial Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1-Wire Bus System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Hardware Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Slave Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
In-Circuit Debug . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Applications Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Grounds and Bypassing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Design Guidelines for ESD Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Additional Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Development and Technical Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2
1-Wire and SPI Authentication Microcontroller
MAXQ1004
LIST OF FIGURES
Figure 1. ADC Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 2. In-Circuit Debugger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 3. I/O Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 4. Typical Application Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
LIST OF TABLES
Table 1. Watchdog Interrupt Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3
1-Wire and SPI Authentication Microcontroller
MAXQ1004
ABSOLUTE MAXIMUM RATINGS
Voltage Range on All Pins (including V
DD
),
except DQ to GND............................................-0.5V to +3.6V
Voltage Range on DQ Relative to GND ...............-0.5V to +6.0V
Continuous Output Current
Any Single I/O Pin ...........................................................35mA
All I/O Pins Combined.....................................................35mA
Continuous Power Dissipation (T
A
= +70NC)
Single-Layer Board (derate 16.9mW/NC above +70NC) .. 1349.1mW
Multilayer Board (derate 25mW/NC above +70NC) ....2000mW
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
(V
DD
= 1.7V to 3.6V, T
A
= -40NC to +85NC, unless otherwise noted. Typical values are at T
A
= +25NC and V
DD
= 3.3V, unless oth-
erwise noted.) (Note 1)
PARAMETER
Supply Voltage
1.8V Internal Regulator
Power-On Reset Voltage
Power-Fail Reset Voltage
Power-Fail Warning Voltage
Digital Overvoltage Detect
Supply Current (Note 5)
SYMBOL
V
DD
V
REG18
V
POR
V
RST
V
PFW
V
HV
I
DD1
I
DD2
I
STOP1
Stop-Mode Current (Note 5)
I
STOP2
I
STOP3
I
STOP4
DIGITAL I/O
Input High Voltage (P0,
RST)
Input Hysteresis
Input Low Voltage (P0,
RST)
Output Low Voltage (P0,
RST)
(Note 7)
Output High Voltage (P0,
RST)
Input Leakage Current
Input/Output Pin Capacitance
Input Low Current for All Pins
RST
Pullup Resistor
V
IH
V
IHYS
V
IL
V
OL
V
OH
I
L
C
IO
I
IL
R
RST
V
DD
= 3.6V, I
OL
= 4mA (Note 6)
V
DD
= 1.85V, I
OL
= 4mA
I
OH
= -2mA
Internal pullup disabled
(Note 6)
V
IN
= 0.4V, pullup enabled
65
V
DD
-
0.4
-100
(Note 6)
V
GND
0.7 x
V
DD
0.3
0.3 x
V
DD
0.4
0.4
V
DD
+100
15
-70
Q20%
V
DD
V
V
V
V
V
nA
pF
FA
kI
(Note 2)
(Notes 3, 4)
Monitors V
REG18
Device is executing
from flash
f
SYS
= 6MHz
f
SYS
= 1MHz
0.8
5
7.5
6.5
9
FA
CONDITIONS
MIN
V
RST
1.62
1.0
1.64
1.75
2.4
TYP
3.3
1.8
MAX
3.6
1.98
1.42
1.695
1.85
2.8
3.5
UNITS
V
V
V
V
V
V
mA
T
A
= +25NC, CPU not backed up
T
A
= +85NC, CPU not backed up
T
A
= +25NC, CPU backed up
T
A
= +85NC, CPU backed up
4
1-Wire and SPI Authentication Microcontroller
RECOMMENDED DC OPERATING CONDITIONS (continued)
(V
DD
= 1.7V to 3.6V, T
A
= -40NC to +85NC, unless otherwise noted. Typical values are at T
A
= +25NC and V
DD
= 3.3V, unless oth-
erwise noted.) (Note 1)
PARAMETER
INTERNAL OSCILLATOR
Oscillator Frequency
Oscillator Startup Time
Oscillator Duty Cycle
NANOPOWER RING OSCILLATOR
Nanopower Ring Frequency
Nanopower Ring Current
Wakeup Timer Interval
FLASH MEMORY
Flash Erase Time
Flash Programming Time per Word
Write/Erase Cycles
Data Retention
Analog Supply Voltage
V
AVDD
T
A
= +25NC
t
PROG
Mass erase
Page erase
20
20
20
1000
100
V
DD
40
40
40
ms
Fs
Cycles
Years
V
f
NANO
I
NANO
t
WAKEUP
T
A
= +25NC
Typical at V
DD
= 3.0V, active
during wake-up (Note 6)
1/f
NANO
t
NANO
3
11
120
22
400
65,535
x t
NANO
kHz
nA
s
f
OSC
t
OSC_RDY
V
REG18
= 1.8V (Note 6)
(Note 6)
45
5
6
350
55
7
MHz
Fs
%
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
MAXQ1004
10-BIT ADC PERFORMANCE
(V
DD
= 1.7V to 3.6V, V
REF
= 1.845V, T
A
= -40NC to +85NC, unless otherwise noted.)
PARAMETER
Resolution
ADC Clock Frequency
ADC Clock Period
AN0 Input Voltage Range
Analog Input Capacitance
Integral Nonlinearity
Differential Nonlinearity
Offset Error
ADC Active Current Consumption
ADC Setup Time
ADC Output Latency
ADC Settling Time
ADC Throughput
TEMPERATURE SENSOR
Temperature Sensor Setup Time
Temperature Sensor Error
t
TSN_SETUP
D
TSN
25
Q6
Fs
NC
5
f
ACLK
t
ACLK
V
AN0
C
AIN
INL
DNL
V
OS
I
ADC
t
ADC_SETUP
t
ADC
t
ADC_SETTLE
f
ADC
Settling time due to channel, refer-
ence or scale change (not produc-
tion tested)
ACLK = 6MHz, internal reference
on, ADEN = 1 (Note 6)
100
25
1025
10
f
ADC
/t
ADC
(Note 6)
No missing codes over temperature
V
GND
1
Q2
Q1
Q2
150
SYMBOL
CONDITIONS
MIN
TYP
10
f
SYSCLK
1/f
ACLK
V
AVDD
MAX
UNITS
Bits
MHz
Fs
V
pF
LSB
LSB
LSB
FA
Fs
t
ACLK
Fs
ksps
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