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IDT70V9099L9PF: 产品描述Dual-Port SRAM, 128KX8, 20ns, CMOS, PQFP100, TQFP-100; 产品类别存储存储; 文件大小296KB，共17页; 制造商IDT (Integrated Device Technology)

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IDT70V9099L9PF概述

Dual-Port SRAM, 128KX8, 20ns, CMOS, PQFP100, TQFP-100

IDT70V9099L9PF规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	QFP
包装说明	TQFP-100
针数	100
Reach Compliance Code	not_compliant
ECCN代码	3A991.B.2.A
最长访问时间	20 ns
其他特性	FLOW-THROUGH OR PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)	66 MHz
I/O 类型	COMMON
JESD-30 代码	S-PQFP-G100
JESD-609代码	e0
长度	14 mm
内存密度	1048576 bit
内存集成电路类型	DUAL-PORT SRAM
内存宽度	8
湿度敏感等级	3
功能数量	1
端口数量	2
端子数量	100
字数	131072 words
字数代码	128000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	128KX8
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	LFQFP
封装等效代码	QFP100,.63SQ,20
封装形状	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL
峰值回流温度（摄氏度）	240
电源	3.3 V
认证状态	Not Qualified
座面最大高度	1.6 mm
最大待机电流	0.002 A
最小待机电流	3 V
最大压摆率	0.23 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn85Pb15)
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	20
宽度	14 mm

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HIGH-SPEED 3.3V

128K x9/x8

SYNCHRONOUS PIPELINED

DUAL-PORT STATIC RAM

Features:

◆

IDT70V9199/099L

◆

True Dual-Ported memory cells which allow simultaneous

access of the same memory location

High-speed clock to data access

– Commercial: 6/7.5/9/12ns (max.)

– Industrial: 9ns (max.)

Low-power operation

– IDT70V9199/099L

Active: 500mW (typ.)

Standby: 1.5mW (typ.)

Flow-Through or Pipelined output mode on either port via

the

FT/PIPE

pins

Dual chip enables allow for depth expansion without

additional logic

◆

Counter enable and reset features

Full synchronous operation on both ports

– 3.5ns setup to clock and 0ns hold on all control, data, and

address inputs

– Data input, address, and control registers

– Fast 6.5ns clock to data out in the Pipelined output mode

– Self-timed write allows fast cycle time

– 10ns cycle time, 100MHz operation in Pipelined output mode

LVTTL- compatible, single 3.3V (±0.3V) power supply

Industrial temperature range (–40°C to +85°C) is

available for selected speeds

Available in a 100-pin Thin Quad Flatpack (TQFP)

Functional Block Diagram

R/W

0/1

FT/PIPE

0/1

FT/PIPE

I/O

- I/O

8L(1)

I/O

- I/O

8R(1)

I/O

Control

I/O

Control

16L

CLK

ADS

CNTEN

CNTRST

NOTE:

1. I/O

- I/O

for IDT70V9099.

16R

Counter/

Address

Reg.

MEMORY

ARRAY

Counter/

Address

Reg.

CLK

ADS

CNTEN

CNTRST

4859 drw 01

APRIL 2003

DSC-4859/3

IDT70V9099L9PF相似产品对比

	IDT70V9099L9PF	IDT70V9099L6PF	IDT70V9199L9PFI	IDT70V9199L6PF	IDT70V9199L12PF	IDT70V9199L9PF	IDT70V9199L7PF	IDT70V9099L12PF
描述	Dual-Port SRAM, 128KX8, 20ns, CMOS, PQFP100, TQFP-100	Dual-Port SRAM, 128KX8, 15ns, CMOS, PQFP100, TQFP-100	Dual-Port SRAM, 128KX9, 20ns, CMOS, PQFP100, TQFP-100	Dual-Port SRAM, 128KX9, 15ns, CMOS, PQFP100, TQFP-100	Dual-Port SRAM, 128KX9, 25ns, CMOS, PQFP100, TQFP-100	Dual-Port SRAM, 128KX9, 20ns, CMOS, PQFP100, TQFP-100	Dual-Port SRAM, 128KX9, 18ns, CMOS, PQFP100, TQFP-100	Dual-Port SRAM, 128KX8, 25ns, CMOS, PQFP100, TQFP-100
是否无铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
包装说明	TQFP-100	TQFP-100	TQFP-100	TQFP-100	TQFP-100	TQFP-100	TQFP-100	TQFP-100
针数	100	100	100	100	100	100	100	100
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	_compli
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	20 ns	15 ns	20 ns	15 ns	25 ns	20 ns	18 ns	25 ns
其他特性	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)	66 MHz	100 MHz	66 MHz	100 MHz	50 MHz	66 MHz	83 MHz	50 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
长度	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
内存密度	1048576 bit	1048576 bit	1179648 bit	1179648 bit	1179648 bit	1179648 bit	1179648 bit	1048576 bi
内存集成电路类型	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
内存宽度	8	8	9	9	9	9	9	8
湿度敏感等级	3	3	3	3	3	3	3	3
功能数量	1	1	1	1	1	1	1	1
端口数量	2	2	2	2	2	2	2	2
端子数量	100	100	100	100	100	100	100	100
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000	128000	128000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	85 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	128KX8	128KX8	128KX9	128KX9	128KX9	128KX9	128KX9	128KX8
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP
封装等效代码	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	240	240	240	240	240	240	240	240
电源	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
最大待机电流	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A
最小待机电流	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
最大压摆率	0.23 mA	0.28 mA	0.24 mA	0.28 mA	0.2 mA	0.23 mA	0.25 mA	0.2 mA
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
处于峰值回流温度下的最长时间	20	20	20	20	20	20	20	20
宽度	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm

IDT70V9099L9PF

IDT70V9099L9PF概述

IDT70V9099L9PF规格参数

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IDT70V9099L9PF相似产品对比

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